초록 ▼

An enclosure for electronic devices has a wall of a rigid plastic material, with elongated chambers defined therein. The chambers are filled with a material having a high thermal conductivity, or materials having high heat capacity, such as phase change material. Each chamber is located so that the

An enclosure for electronic devices has a wall of a rigid plastic material, with elongated chambers defined therein. The chambers are filled with a material having a high thermal conductivity, or materials having high heat capacity, such as phase change material. Each chamber is located so that the material in the chamber is in thermal contact with the wall at a first location that tends to be at a relatively high temperature, and at a second location that tends to be at a lower temperature. The enclosure may alternatively have heat pipes of metal rather than chambers.

대표청구항 ▼

[ What is claimed is:] [1.] An enclosure for electronic devices, comprising a wall, said wall comprising;a first material, said first material being a substantially rigid material characterized by a thermal capacity and a poor thermal conductivity; anda body of a second material having thermal capac

[ What is claimed is:] [1.] An enclosure for electronic devices, comprising a wall, said wall comprising;a first material, said first material being a substantially rigid material characterized by a thermal capacity and a poor thermal conductivity; anda body of a second material having thermal capacity and thermal conductivity greater than the thermal capacity and thermal conductivity of said first material, said body being in direct thermal communication with said first material at a first location and a second location so as to provide improved heat transfer between said first material at said first location and said first material at said second location.