초록 ▼

A method for producing a back-illuminated CMOS image sensor including a matrix of pixels (e.g., CMOS APS cells) that are fabricated on a semiconductor substrate. The semiconductor substrate is secured to a protective substrate by an adhesive such that the processed (frontside) surface of the semicon

A method for producing a back-illuminated CMOS image sensor including a matrix of pixels (e.g., CMOS APS cells) that are fabricated on a semiconductor substrate. The semiconductor substrate is secured to a protective substrate by an adhesive such that the processed (frontside) surface of the semiconductor substrate faces the protective substrate. With the protective substrate providing structural support, the exposed backside surface of the semiconductor substrate is then subjected to grinding and/or chemical etching, followed by optional chemical/mechanical processing, to thin the semiconductor substrate to a range of 10 to 15 microns. A transparent substrate (e.g., glass) is then secured to the backside surface of the semiconductor substrate, thereby sandwiching the semiconductor substrate between the transparent substrate and the protective substrate.

대표청구항 ▼

[ What is claimed is:] [1.] A backside illuminated image sensor comprising:a semiconductor substrate having a first surface and a second surface;a plurality of light-sensitive pixel regions formed on the first surface of the semiconductor substrate and including a photodiode diffusion region extendi

[ What is claimed is:] [1.] A backside illuminated image sensor comprising:a semiconductor substrate having a first surface and a second surface;a plurality of light-sensitive pixel regions formed on the first surface of the semiconductor substrate and including a photodiode diffusion region extending into the semiconductor substrate from the first surface;a metal line formed adjacent the first surface of the semiconductor substrate;a protective substrate secured to the semiconductor substrate such that the metal line is located between the protective substrate and the semiconductor substrate; anda transparent substrate secured to the second surface of the semiconductor substrate such that the semiconductor substrate is sandwiched between the transparent substrate and the protective substrate;wherein the semiconductor substrate has a thickness defined such that the light-sensitive pixel region is effectively exposed through the second surface.