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Electrochemical-control of abrasive polishing and machining rates 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/302
출원번호 US-0198483 (1998-11-24)
발명자 / 주소
  • Weihs Timothy P.
  • Mann Adrian B.
  • Searson Peter C.
출원인 / 주소
  • The John Hopkins University
대리인 / 주소
    Dickstein Shapiro Morin & Oshinsky LLP
인용정보 피인용 횟수 : 100  인용 특허 : 7

초록 ▼

An apparatus and method is disclosed; both of which use electrochemistry to selectively grow and remove hard oxide coatings on metals, and capacitive double layers on non-metals and semiconductors in order to predict and control the rate of surface abrasion during planarization of the surface of suc

대표청구항 ▼

[ What is claimed is:] [1.] A method of treating a surface of material on a silicon wafer, the method comprising the steps of:placing the silicon wafer in an electrolytic bath;placing reference and counter electrodes in the electrolytic bath;connecting a working electrode to the material on the sili

이 특허에 인용된 특허 (7)

  1. Ohmori Hitoshi (Tokyo JPX) Nakagawa Takeo (Kawasaki JPX) Karikomi Katsuhiko (Tokyo JPX), Apparatus and method for mirror surface grinding and grinding wheel therefore.
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  2. Kishii Sadahiro (Kawasaki JPX) Arimoto Yoshihiro (Kawasaki JPX) Horie Hiroshi (Kawasaki JPX) Sugimoto Fumitoshi (Kawasaki JPX), Apparatus and method for uniformly polishing a wafer.
    상세보기
  3. Tsai Chia S. (Hsin-chu TWX) Tseng Pin-Nan (Hsin-chu TWX), Chemical/mechanical planarization (CMP) apparatus and polish method.
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  4. Chen Lai-Juh (Hsin-Chu TWX), Electrochemical simulator for chemical-mechanical polishing (CMP).
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  5. Katsumoto Kenichi (Ashiya JPX) Isoda Shigeo (Nagoya JPX) Yuuki Takahiro (Kobe JPX) Koike Shiro (Kobe JPX) Yamamoto Yutaka (Kobe JPX) Motonishi Suguru (Akashi JPX) Kawaguchi Tadashi (Kobe JPX) Gotoh T, Electrolytic-abrasive polishing method of aluminum surface.
    상세보기
  6. Zubatova Lidia S. (Ljublinskaya ; 111 ; kv. 120 Moscow SUX) Grodzinsky Eduard Y. (ulitsa Maril Ulyanovoi ; 11 ; kv. 117 Moscow SUX) Shelyagin Ivan V. (Volgo-gradsky prospekt ; 147/5 ; Korpus 1 ; kv. , Method of abrasive electroerosion grinding.
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  7. Murarka Shyam P. (Clifton Park NY) Gutmann Ronald J. (Troy NY) Duquette David J. (Loudonville NY) Steigerwald Joseph M. (Aloha OR), Systems for performing chemical mechanical planarization and process for conducting same.
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