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Heat transfer apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0153523 (1998-09-15)
발명자 / 주소
  • Batchelder John Samuel
인용정보 피인용 횟수 : 54  인용 특허 : 9

초록

An apparatus to transfer heat from a heat source to a heat sink, the apparatus consisting of a solid thermal conveyer proximate to the heat source and the heat sink. Heat from the heat source is transferred to the thermal conveyer; this heat is conveyed by the thermal conveyer, and this heat is then

대표청구항

[ The invention claimed is:] [1.] An apparatus for transferring heat from a heat source, the heat transferring through a first area of the heat source to the apparatus, comprising:a fin means having a second area;a housing containing a cavity, the housing thermally contacting the first area, the hou

이 특허에 인용된 특허 (9)

  1. DiStefano Thomas H. (Monte Sereno CA) Smith John W. (Palo Alto CA), Compliant thermal connectors and assemblies incorporating the same.
  2. Huang Chuan-Wen,TWX, Cup and heat sink mounting arrangement.
  3. Maling ; Jr. George C. (Poughkeepsie NY) Schmidt Roger R. (Poughkeepsie NY), Disk augmented heat transfer system.
  4. Albrecht Thomas R. (San Jose) Foster John S. (Morgan Hill) Homola Andrew M. (Morgan Hill CA), Disk file with liquid film head-disk interface.
  5. Williams Edward J. (Charlottesville VA), Dynamic heat sink.
  6. Ogushi Tetsurou (Amagasaki JPX) Kaga Kunihiko (Amagasaki JPX) Tanaka Hideharu (Amagasaki JPX) Yamanaka Goro (Amagasaki JPX), Heat exchange apparatus and method for preparing the apparatus.
  7. Jaeger Marc J. (Gainesville FL), Heat transfer system without mass transfer.
  8. Jaeger Marc J. (Gainesville FL), Heat transfer system without mass transfer.
  9. Jaeger Marc J. (Gainsville FL), Heat transfer system without mass transfer.

이 특허를 인용한 특허 (54)

  1. Elzey,Dana M.; Wadley,Haydn N. G., Active energy absorbing cellular metals and method of manufacturing and using the same.
  2. Mongia, Rajiv K.; Machiroutu, Sridhar V., Apparatus and method to efficiently cool a computing device.
  3. Mongia, Rajiv K.; Machiroutu, Sridhar V., Apparatus and method to efficiently cool a computing device.
  4. Mongia, Rajiv K.; Machiroutu, Sridhar V., Apparatus and method to efficiently cool a computing device.
  5. Koplow, Jeffrey P., Axial flow heat exchanger devices and methods for heat transfer using axial flow devices.
  6. San Yaun Lin TW, CPU cooling arrangement.
  7. Uomori, Yasuharu; Takahashi, Masanori; Ito, Satoshi, Cooler for electronic device.
  8. Lopatinsky,Edward L.; Schaefer,Dan K.; Rosenfeld,Saveliy T.; Fedoseyev,Lev A., Cooler for electronic devices.
  9. Ghoshal, Uttam; Miner, Andrew Carl, Cooling of electronics by electrically conducting fluids.
  10. Ghoshal,Uttam; Miner,Andrew Carl, Cooling of electronics by electrically conducting fluids.
  11. Ghoshal,Uttam, Counterflow thermoelectric configuration employing thermal transfer fluid in closed cycle.
  12. Schaff, Ulrich Y.; Koh, Chung-Yan; Sommer, Gregory J., Devices, systems, and methods for conducting assays with improved sensitivity using sedimentation.
  13. Schaff, Ulrich Y.; Sommer, Gregory J.; Singh, Anup K.; Hatch, Anson V., Devices, systems, and methods for conducting sandwich assays using sedimentation.
  14. Koh, Chung-Yan; Schaff, Ulrich Y.; Sommer, Gregory J., Devices, systems, and methods for detecting nucleic acids using sedimentation.
  15. Sommer, Gregory J.; Hatch, Anson V.; Wang, Ying-Chih; Singh, Anup K., Devices, systems, and methods for microscale isoelectric fractionation.
  16. Holahan, Maurice F.; Kline, Eric V.; Krystek, Paul N.; Rasmussen, Michael R.; Sinha, Arvind K.; Zins, Stephen M., Dual magnetically coupled rotor heat exchanger.
  17. Holahan, Maurice F.; Kline, Eric V.; Krystek, Paul N.; Rasmussen, Michael R.; Sinha, Arvind K.; Zins, Stephen M., Duplex flexible heat exchanger.
  18. Guedes-Pinto, Paulo; Saban, Daniel M.; Stout, John; Krishnan, Venkateshwaran; Strouse, Dennis; Ivaschenko, Alex, Electric machine.
  19. Mongia, Rajiv K.; Bhattacharya, Anandaroop, Electromagnetic interference shielding for device cooling.
  20. Saban, Daniel M.; Ahmad, Raed H.; Pan, Zhiguo, Electromechanical energy conversion systems.
  21. Berlin,Carl W.; Chengalva,Suresh K.; Brandenburg,Scott D.; Myers,Bruce A., Electronic package and method of cooling electronics.
  22. Brandenburg,Scott D.; Chengalva,Suresh K., Fluid circulator for fluid cooled electronic device.
  23. Queheillalt,Douglas T.; Wadley,Haydn N. G.; Katsumi,Yasushi, Heat exchange foam.
  24. Koplow, Jeffrey P., Heat exchanger device and method for heat removal or transfer.
  25. Koplow, Jeffrey P., Heat exchanger device and method for heat removal or transfer.
  26. Koplow, Jeffrey P., Heat exchanger device and method for heat removal or transfer.
  27. Khanna, Vijayeshwar D.; McVicker, Gerard; Sri-Jayantha, Sri M., Heat transfer device in a rotating structure.
  28. Gayda, John; Gabb, Timothy P.; Kantzos, Peter T., Heat treatment devices and method of operation thereof to produce dual microstructure superalloy disks.
  29. Gektin, Vadim; Novotny, Shlomo; Vogel, Marlin R., Heatsink with active liquid base.
  30. Al-Garni, Ahmed Z.; Hawwa, Muhammad A., Hybrid cooling system and method for cooling electronic devices.
  31. Saban, Daniel M.; Stout, John, Hybrid winding configuration of an electric machine.
  32. Wu, Bo Jiu; Zhang, Jia Ju; Wu, Zhong Ming, Integrated fluid cooling system for electronic components.
  33. Symons,Robert S., Integrated liquid cooling device for electronic components.
  34. Symons,Robert S., Integrated liquid cooling device with immersed electronic components.
  35. Wang, Chin-Wen, Magnetic-levitated cooling circulatory mechanism.
  36. Wadley, Haydn N. G.; Queheillalt, Douglas T.; Haj-Hariri, Hossein; Evans, Anthony G.; Peterson, George P.; Kurtz, Robert; Long, G. Douglas; Murty, Yellapu V., Method and apparatus for jet blast deflection.
  37. Ervin,Kenneth D.; Wadley,Haydn N. G., Method for manufacture of truss core sandwich structures and related structures thereof.
  38. Payne, LeRoy, Multiaxis rotational molding apparatus and method.
  39. Gabb, Timothy P.; Gayda, John; Telesman, Ignacy; Kantzos, Pete T., Nickel base superalloy turbine disk.
  40. Williams, Arthur R., Rotating bernoulli heat pump.
  41. Saban, Daniel M., Rotor for an electric machine.
  42. Petrov, Peter; Saban, Daniel M., Rotor for electric machine having a sleeve with segmented layers.
  43. Saban, Daniel M.; Guedes-Pinto, Paulo, Rotor for electric machine having a sleeve with segmented layers.
  44. Krassowski,Daniel Witold; Shives,Gary D.; Norley,Julian; Reynolds, III,Robert Anderson, Sandwiched finstock.
  45. Saban, Daniel M.; Stout, John; Guedes-Pinto, Paulo, Slot configuration of an electric machine.
  46. Saban, Daniel M.; Guedes-Pinto, Paulo, Stator for an electric machine.
  47. Saban, Daniel M.; Guedes-Pinto, Paulo, Stator for an electric machine.
  48. Stout, John; Saban, Daniel M.; Guedes-Pinto, Paulo, Stator wedge for an electric machine.
  49. Ghoshal,Uttam, System employing temporal integration of thermoelectric action.
  50. Schaff, Ulrich Y.; Sommer, Gregory J.; Singh, Anup K., Systems, devices, and methods for agglutination assays using sedimentation.
  51. Balian,Charles; Bergerson,Steven E.; Currier,Gregg C., Thermal interface material with low melting alloy.
  52. Saban, Daniel M.; Guedes-Pinto, Paulo, Thermally matched composite sleeve.
  53. Ghoshal,Uttam, Thermoelectric configuration employing thermal transfer fluid flow(s) with recuperator.
  54. Saban, Daniel M.; Guedes-Pinto, Paulo, Wrapped rotor sleeve for an electric machine.
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