초록 ▼

A structure and process for a copper-containing, wire-bonding pad structure for bonding to gold wires. The structure includes a nickel-containing film to improve metal lurgical characteristics. The structure also has a laminated impurity film within the copper pad, which complexes with the nickel-co

A structure and process for a copper-containing, wire-bonding pad structure for bonding to gold wires. The structure includes a nickel-containing film to improve metal lurgical characteristics. The structure also has a laminated impurity film within the copper pad, which complexes with the nickel-containing pad to prevent a destructive interaction between nickel and copper at elevated temperatures, or during the lifetime of the device or the wirebond.

대표청구항 ▼

[ What is claimed:] [1.] A process for forming a copper-containing structure, comprising the steps of:a) forming a first bulk copper-containing film at least indirectly on a substrate, said first bulk copper-containing film having a first surface;b) roughening said first surface;c) laminating an imp

[ What is claimed:] [1.] A process for forming a copper-containing structure, comprising the steps of:a) forming a first bulk copper-containing film at least indirectly on a substrate, said first bulk copper-containing film having a first surface;b) roughening said first surface;c) laminating an impurity film onto said first surface, said impurity film including copper and a first impurity and having a first impurity concentration;d) forming a second bulk copper-containing film on said impurity film, said second bulk copper-containing film having a thickness and a second surface, wherein said first bulk copper-containing film, said impurity film, and said second bulk copper-containing film form a composite film;e) forming a pattern within said composite film to create a pad having side walls;f) forming a transition film over said pad, said transition film having at least one component and forming an interface with said second surface;g) covering said transition film with a gold film; andh) heating said structure thereby urging the combination of said first impurity with said at least one component to produce a chemical mixture disposed along said interface.