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[미국특허] Semiconductor die back side surface and method of fabrication 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/44
출원번호 US-0481947 (2000-01-12)
발명자 / 주소
  • Jiang Tongbi
  • Cobbley Chad A.
출원인 / 주소
  • Micron Technology, Inc.
대리인 / 주소
    Trask Brett
인용정보 피인용 횟수 : 68  인용 특허 : 25

초록 ▼

A method of physically altering the backside surface of a semiconductor wafer or other substrate, and resulting article, to improve adhesion between the backside surface of semiconductor dice singulated from the wafer and a die attach adhesive or encapsulation compound. The physically altered backsi

대표청구항 ▼

[ What is claimed is:] [1.] A semiconductor component assembly, comprising:a semiconductor component comprising an active surface and a back side surface, said back side surface having a substantially non-planar texture wherein said substantially non-planar texture of the back side surface has a pea

이 특허에 인용된 특허 (25) 인용/피인용 타임라인 분석

  1. King Jerrold L. (Boise ID) Brooks J. Mike (Caldwell ID) Moden Walter L. (Boise ID), Adhesion enhanced semiconductor die for mold compound packaging.
    상세보기
  2. Ebe Kazuyoshi (Saitama JPX) Narita Hiroaki (Saitama JPX) Taguchi Katsuhisa (Saitama JPX) Akeda Yoshitaka (Saitama JPX) Saito Takanori (Saitama JPX), Adhesive sheets.
    상세보기
  3. Tsutsumi Yukio (Tokyo JPX) Kumabe Shigeo (Tokyo JPX) Takahashi Keisuke (Tokyo JPX), Apparatus for polishing wafer.
    상세보기
  4. Lund Douglas E. (13304 Purple Sage Dallas TX 75240), Automatic chemical and mechanical polishing system for semiconductor wafers.
    상세보기
  5. La Tho Le ; Venkatkrishnan Subramanian ; Ramsbey Mark T. ; Thomas Jack F. ; Early Kathleen, Backside wafer polishing for improved photolithography.
    상세보기
  6. Lim Thiam B. (Pasir Ris Gardens SGX) Saitoh Tadashi (Mandarin Garden SGX) Seow Boon Q. (Greenridge Crescent SGX), Integrated circuit device having a polyimide moisture barrier coating.
    상세보기
  7. Ebihara Kazumi,JPX, Leadframe and resin-sealed semiconductor device.
    상세보기
  8. Robbins John (Sherman TX) Boston Ricky L. (Denison TX), Method and apparatus for back side damage of silicon wafers.
    상세보기
  9. Ball Michael B., Method and apparatus for grinding wafers.
    상세보기
  10. Ganesan Sankaranarayanan (Chandler AZ) Berg Howard M. (Scottsdale AZ), Method and apparatus for improving interfacial adhesion between a polymer and a metal.
    상세보기
  11. Leach Michael A., Method and structure for polishing a wafer during manufacture of integrated circuits.
    상세보기
  12. Tu Tuby,TWX ; Chen Kuang-Chao,TWX, Method for forming trenched polysilicon structure.
    상세보기
  13. Berg Howard M. ; Ganesan Sankaranarayanan ; Lewis Gary L. ; Hawkins George W. ; Sloan James W. ; Bolton Scott C., Method for making a moisture resistant semiconductor device having an organic substrate.
    상세보기
  14. Tsuji Kazuto,JPX ; Yoneda Yoshiyuki,JPX ; Orimo Seiichi,JPX ; Nomoto Ryuji,JPX ; Onodera Masanori,JPX ; Sakoda Hideharu,JPX, Method for producing a semiconductor device.
    상세보기
  15. Lawrence John E. (Cupertino CA), Method for reclaiming substrate from semiconductor wafers.
    상세보기
  16. Takemura Kazumi (Tokyo JPX) Toyokawa Fumitoshi (Tokyo JPX) Mikami Masao (Tokyo JPX), Method of gettering semiconductor wafers with an excimer laser beam.
    상세보기
  17. Nakanishi Toshiro (Kawasaki JPX) Sato Yasuhisa (Kawasaki JPX), Method of making a semiconductor memory device having a floating gate.
    상세보기
  18. Tonti William R. ; Mandelman Jack A. ; Zalesinski Jerzy M. ; Furukawa Toshiharu ; Nguyen Son V. ; Chidambarrao Dureseti, Method of manufacturing an integrated ULSI heatsink.
    상세보기
  19. Earl Michael R. (Kokomo IN) Detterich Russell A. (Kokomo IN) Yancey Robert A. (Carmel IN), No coat backside wafer grinding process.
    상세보기
  20. Billett Bruce H., Polishing pad conditioning surface having integral conditioning points.
    상세보기
  21. Buchner Alfred (Pischelsdorf ATX) Kuhn-Kuhnenfeld Franz (Emmerting DEX) Auer Walter (Burghausen DEX), Process for the backside-gettering surface treatment of semiconductor wafers.
    상세보기
  22. Okabe Yoshifumi (Nagoya JPX) Yamaoka Masami (Anjo JPX) Kuroyanagi Akira (Okazaki JPX), Semiconductor device and method of manufacturing same.
    상세보기
  23. Yamada Shigeru,JPX ; Uchida Yasufumi,JPX ; Murakami Noriko,JPX ; Shizuno Yoshinori,JPX, Semiconductor device having a die pad structure for preventing cracks in a molding resin.
    상세보기
  24. Lowrey Tyler A. (Boise ID) Doan Trung T. (Boise ID) Sandhu Gurtej S. (Boise ID), Semiconductor gettering process using backside chemical mechanical planarization (CMP) and dopant diffusion.
    상세보기
  25. Bennett Richard E. ; Bird Gerald C. ; Nestegard Mark K. ; Rudin Eleanor, Semiconductor wafer processing adhesives and tapes.
    상세보기

이 특허를 인용한 특허 (68) 인용/피인용 타임라인 분석

  1. Monthei, Dean L.; Espinoza, Antonio; Holgado, Waldemar J., Apparatus and method for reduced delamination of an integrated circuit module.
    상세보기
  2. Park, Sang Wook, Chip size stack package and method of fabricating the same.
    상세보기
  3. Park, Sang Wook, Chip size stack package and method of fabricating the same.
    상세보기
  4. Obu, Isao; Umemoto, Yasunari; Shibata, Masahiro, Compound semiconductor substrate and power amplifier module.
    상세보기
  5. Hara,Kazumi, Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus.
    상세보기
  6. Hagen,Robert Christian; Jerebic,Simon, Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same.
    상세보기
  7. Yamanaka, Takahiro, Electronic device and actuator using the same.
    상세보기
  8. Ding, Xiaoyi; Nowicki, James, Embedded structures for high glass strength and robust packaging.
    상세보기
  9. Ding, Xiaoyi; Nowicki, James, Embedded structures for high glass strength and robust packaging.
    상세보기
  10. Xu, Shuming; Zheng, Yi, Enhanced thermal transfer in a semiconductor structure.
    상세보기
  11. Chiu, Chin-Tien; Bhagath, Shrikar; Zhang, Yuang; Zhong, Lu; Qian, Kaiyou, Extrinsic gettering on semiconductor devices.
    상세보기
  12. Huang, Wen-Home; Tseng, Wen-Tsung; Lin, Chang-Fu; Tsai, Ho-Yi; Hsiao, Cheng-Hsu, Fabrication method of semiconductor package.
    상세보기
  13. Su,Michael Zhuoying; Eppes,David Harry, Integrated circuit with increased heat transfer.
    상세보기
  14. Goida, Thomas M.; Xue, Xiaojie, Integrated device die and package with stress reduction features.
    상세보기
  15. Goida, Thomas M.; Xue, Xiaojie, Integrated device die and package with stress reduction features.
    상세보기
  16. Xu, Shuming, Integrated on-chip junction capacitor for power management integrated circuit device.
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  17. Juengling, Werner, Method and apparatus for designing a pattern on a semiconductor surface.
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  18. Juengling,Werner, Method and apparatus for designing a pattern on a semiconductor surface.
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  19. Lee, SungYoon; Shin, JungHoon; Yoon, BoHan, Method for directional grinding on backside of a semiconductor wafer.
    상세보기
  20. Kim,Hang Ja; Jung,Eun Kyoung, Method of forming TEM specimen and related protection layer.
    상세보기
  21. Meyers,John G., Method of forming a multi-die semiconductor package.
    상세보기
  22. Sunohara,Masahiro; Murayama,Kei; Higashi,Mitsutoshi, Method of production of multilayer circuit board with built-in semiconductor chip.
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  23. Wachtler, Kurt P., Method of separating semiconductor dies from a wafer.
    상세보기
  24. Rinne, Glenn A.; Engel, Kevin; Roe, Julia; Berry, Chirstopher John, Methods of forming back side layers for thinned wafers.
    상세보기
  25. Jiang, Tongbi, Methods of thinning microelectronic workpieces.
    상세보기
  26. Jiang, Tongbi; Luo, Shijian, Microelectronic device wafers including an in-situ molded adhesive, molds for in-situ molding adhesives on microelectronic device wafers, and methods of molding adhesives on microelectronic device wafers.
    상세보기
  27. Sri Jayantha,Sri M.; Hougham,Gareth; Kang,Sung; Mok,Lawrence; Dang,Hien; Sharma,Arun, Microelectronic devices and methods.
    상세보기
  28. Meyers, John G., Multi-die semiconductor package.
    상세보기
  29. Jiang, Tongbi; Connell, Mike; Li, Li; Hollingshead, Curtis, Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate.
    상세보기
  30. Thurgood, Blaine; Corisis, David, Packaged microelectronic devices and methods for packaging microelectronic devices.
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  31. Viswanathan, Lakshminarayan; Mahalingam, L. M.; Abdo, David F.; Molla, Jaynal A., Packaged semiconductor devices and methods of their fabrication.
    상세보기
  32. Juengling, Werner, Pattern generation on a semiconductor surface.
    상세보기
  33. Juengling,Werner, Pattern generation on a semiconductor surface.
    상세보기
  34. Derderian,James M.; Draney,Nathan R., Process for strengthening semiconductor substrates following thinning.
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  35. Chao,Iwen; Eskildsen,Steve R., Semiconducting device with folded interposer.
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  36. Chao,Iwen; Eskildsen,Steve R., Semiconducting device with folded interposer.
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  37. Chao,Iwen; Eskildsen,Steve R., Semiconducting device with folded interposer.
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  38. Sahaida,Scott R.; Chao,Iwen, Semiconducting device with stacked dice.
    상세보기
  39. Pagaila, Reza Argenty, Semiconductor device and method of forming channels in back surface of FO-WLCSP for heat dissipation.
    상세보기
  40. Hiroshi Haji JP; Shoji Sakemi JP, Semiconductor device and method of manufacturing the same.
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  41. Yoneyama, Rei; Okabe, Hiroyuki; Nishida, Nobuya; Obara, Taichi, Semiconductor device and semiconductor module.
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  42. Sumikawa, Masato; Tanaka, Kazumi, Semiconductor device having reinforcement member and method of manufacturing the same.
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  43. Viswanathan, Lakshminarayan; Mahalingam, L. M.; Abdo, David F.; Molla, Jaynal A., Semiconductor device with mechanical lock features between a semiconductor die and a substrate.
    상세보기
  44. Haji, Hiroshi; Sakemi, Shoji, Semiconductor device with reinforcing resin layer.
    상세보기
  45. Sakai, Tadahiko; Ozono, Mitsuru; Maeda, Tadashi, Semiconductor device, method of manufacturing the device and method of mounting the device.
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  46. Wachtler, Kurt P., Semiconductor die with contoured bottom surface and method for making same.
    상세보기
  47. Shivkumar, Bharat; Cheah, Chuan, Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance.
    상세보기
  48. Huang, Wen-Home; Tseng, Wen-Tsung; Lin, Chang-Fu; Tsai, Ho-Yi; Hsiao, Cheng-Hsu, Semiconductor package and fabrication method thereof.
    상세보기
  49. Newman, Robert A.; Weidler, Jaime D., Semiconductor packaging apparatus for controlling die attach fillet height to reduce die shear stress.
    상세보기
  50. Derderian,James M.; Draney,Nathan R., Semiconductor substrate.
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  51. Kirby,Kyle K., Semiconductor wafers including one or more reinforcement structures and methods of forming the same.
    상세보기
  52. Cobbley, Chad A.; Jackson, Timothy L., Stacked die module and techniques for forming a stacked die module.
    상세보기
  53. Cobbley,Chad A.; Jackson,Timothy L., Stacked die module and techniques for forming a stacked die module.
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  54. Cobbley,Chad A.; Jackson,Timothy L., Stacked die module and techniques for forming a stacked die module.
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  55. Cobbley,Chad A.; Jackson,Timothy L., Stacked die module and techniques for forming a stacked die module.
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  56. Cobbley, Chad A.; Jackson, Timothy L., Stacked die module including multiple adhesives that cure at different temperatures.
    상세보기
  57. Draney,Nathan R.; Derderian,James M., Substrate thinning including planarization.
    상세보기
  58. Draney,Nathan R.; Derderian,James M., Substrate with enhanced properties for planarization.
    상세보기
  59. Hsu, Shih Ping, Surface roughening method for embedded semiconductor chip structure.
    상세보기
  60. Lee, SungYoon; Shin, JungHoon; Yoon, BoHan, System and method for directional grinding on backside of a semiconductor wafer.
    상세보기
  61. Viswanathan, Lakshminarayan; Molla, Jaynal A., Thick-silver layer interface for a semiconductor die and corresponding thermal layer.
    상세보기
  62. Ding, Xiaoyi; Frye, Jeffrey James, Thin semiconductor die package.
    상세보기
  63. Derderian, James M.; Draney, Nathan R., Thinned, strengthened semiconductor substrates and packages including same.
    상세보기
  64. Lee,Myoung Rack; Kim,Jung Sun, Transmission electron microscope specimen and method of manufacturing the same.
    상세보기
  65. Jiang,Tongbi; Connell,Mike; Li,Li; Hollingshead,Curtis, Treatment of a ground semiconductor die to improve adhesive bonding to a substrate.
    상세보기
  66. Dydyk, Mark; Urquiza, Arturo; Singleton, Charles; McIntosh, Tim, Wafer backside grinding with stress relief.
    상세보기
  67. Kirby,Kyle K., Wafer reinforcement structure and methods of fabrication.
    상세보기
  68. Rinne, Glenn A.; Engel, Kevin; Roe, Julia; Berry, Christopher John, Wafers including patterned back side layers thereon.
    상세보기

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