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In a semiconductor package stack module, an LSI (Large Scale Integrated circuit) is mounted, via fine bumps, on a ceramic carrier substrate or a flexible carrier film on which wiring conductors are formed. After a seal resin has been injected, the chip is thinned by, e.g., grinding. A plurality of s

In a semiconductor package stack module, an LSI (Large Scale Integrated circuit) is mounted, via fine bumps, on a ceramic carrier substrate or a flexible carrier film on which wiring conductors are formed. After a seal resin has been injected, the chip is thinned by, e.g., grinding. A plurality of such carrier substrates or carrier films are connected to each other by bumps via through holes which are electrically connected to the wiring conductors, thereby completing a tridimensional stack module. The module achieves a miniature, thin, dense, low cost, and reliable structure without resorting to a wire bonding system or a TAB (Tape Automated Bonding) system. In addition, the module has a minimum of wiring length and a desirable electric characteristic.

대표청구항 ▼

[ What is claimed is:] [1.] A semiconductor package stack module comprising:a plurality of carriers stacked one upon the other, each of said plurality of carriers having first through holes associated with said carrier;a conductor pattern on at least a front face of said carrier and electrically con

[ What is claimed is:] [1.] A semiconductor package stack module comprising:a plurality of carriers stacked one upon the other, each of said plurality of carriers having first through holes associated with said carrier;a conductor pattern on at least a front face of said carrier and electrically connected to said first through holes;pads for inner bonding on a rear face of said carrier, and electrically connected to said first through holes;an LSI chip mounted face down on said carrier and connected thereto by said pads, said plurality of carriers being connected tridimensionally by said first through holes,wherein first said through holes are formed in said carriers, said plurality of carriers being electrically and tridimensionally connected to each other by bumps formed on said through holes;further comprising second through holes formed in fine pitch arrays in the edge of each of said carriers portions of said carrier; andsaid second through holes being connected to ground without exception.