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Enhanced dielectric strength mica tapes 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-005/16
출원번호 US-0512152 (2000-02-24)
발명자 / 주소
  • Smith James D. B.
  • Emery Franklin T.
출원인 / 주소
  • Siemens Westinghouse Power Corporation
대리인 / 주소
    Eckert Seamans Cherin & Mellott, LLC
인용정보 피인용 횟수 : 41  인용 특허 : 10

초록

A flexible insulating tape (16) contains a flexible backing (18) and a mica or mica-like silicate matrix (20) with insulating resin (17) and intercalated metal ions (12) between the matrix (2) where the resin (17) and the ions (12) are intimately disposed next to the mica (20).

대표청구항

[ What is claimed is:] [1.] A flexible electrically insulating mica tape, comprising a flexible backing and a mica matrix structure bonded to the backing, where the mica tape also contains insulating resin and intercalated metal ions selected from the group consisting of Cr, Sn, Zn and mixtures ther

이 특허에 인용된 특허 (10)

  1. Smith James D. B. ; Schoch ; Jr. Karl F. ; Emery Franklin T., Catalyzed mica tapes for electrical insulation.
  2. Usuki Arimitsu (Aichi JPX) Mizutani Tadashi (Aichi JPX) Fukushima Yoshiaki (Aichi JPX) Fujimoto Megumi (Aichi JPX) Fukumori Kenzo (Aichi JPX) Kojima Yoshitsugu (Aichi JPX) Sato Norio (Aichi JPX) Kura, Composite material containing a layered silicate.
  3. Smith James D. B. ; Schoch ; Jr. Karl F. ; Su Wei-Fang A., Electrical insulation using liquid crystal thermoset epoxy resins.
  4. Beall Gary W. (McHenry IL) Tsipursky Semeon (Lincolnwood IL) Sorokin Anatoliy (Buffalo Grove IL) Goldman Anatoliy (Palatine IL), Exfoliated layered materials and nanocomposites comprising matrix polymers and said exfoliated layered materials formed.
  5. Smith ; James D.B., Flexible resin rich epoxide-mica winding tape insulation containing organo-tin catalysts.
  6. Beall Gary W. ; Tsipursky Semeon ; Sorokin Anatoliy ; Goldman Anatoliy, Intercalates and exfoliates formed with monomeric carbonyl-functional organic compounds, including carboxylic and polyc.
  7. Beall Gary W. ; Tsipursky Semeon ; Sorokin Anatoliy ; Goldman Anatoliy, Intercalates and exfoliates formed with oligomers and polymers and composite materials containing same.
  8. Smith James D. B. (Wilkins Township ; Allegheny County PA) Kauffman Robert N. (Monroeville PA), Metal acetylacetonate latent accelerators for an epoxy-styrene resin system.
  9. Kuwajima Hideji (Hitachi JPX) Watanabe Takeyoshi (Hitachi JPX), Reconstituted mica materials, reconstituted mica prepreg materials, reconstituted mica products and insulated coils.
  10. Tsipursky Semeon ; Beall Gary W. ; Sorokin Anatoliy ; Goldman Anatoliy, Viscous carrier compositions, including gels, formed with an organic liquid carrier and a layered material:polymer compl.

이 특허를 인용한 특허 (41)

  1. Emery,Franklin T., Apparatus and method to prevent loss of conductive ground electrode.
  2. Smith, James D. B.; Stevens, Gary; Wood, John W., Composite insulation tape with loaded HTC materials.
  3. Yin, Weijun; Yeager, Gary William; Flanagan, Kevin Warner; Simon, David Andrew; Boden, Eugene Pauling; Misner, Kathryn Amanda, Composition for bonding windings or core laminates in an electrical machine, and associated method.
  4. Smith, James D; Stevens, Gary; Wood, John W; Lutz, Andreas, Compression of resin impregnated insulating tapes.
  5. Boden, Eugene Pauling; Flanagan, Kevin Warner; Simon, David Andrew; Yin, Weijun; Zhang, Wei; McTigue, Robert Colin; Misner, Kathryn Amanda; Yeager, Gary William, Curable composition for electrical machine, and associated method.
  6. Smith,James David Blackhall; Stevens,Gary; Wood,John William, Diamond like carbon coating on nanofillers.
  7. Ikeda, Kenji; Morooka, Hisashi; Iizuka, Motonobu; Haraguchi, Yoshihiro; Hiruta, Naohiro; Maruyama, Shoichi, Dry mica tape and insulation coils manufactured therewith.
  8. Yin, Weijun; Zhang, Lili; Durantay, Lionel; Grignard, Jean François, Electrical insulation system.
  9. Tsai, Tsung-Yen; Jong, Sung-Jeng; Yeh, An-Chi; Chiang, Joshua; Fang, Bor-Ren, Epoxy/clay nanocomposite for making printed circuit boards.
  10. Smith, James D; Stevens, Gary; Wood, John W, Fabrics with high thermal conductivity coatings.
  11. Smith, James D; Stevens, Gary; Wood, John W, Fabrics with high thermal conductivity coatings.
  12. Miller, Mark L., High thermal conductivity dielectric tape.
  13. Smith, James David Blackhall; Stevens, Gary; Wood, John William, High thermal conductivity materials aligned within resins.
  14. Smith, James David Blackhall, High thermal conductivity materials with grafted surface functional groups.
  15. Smith, James David Blackhall; Stevens, Gary; Wood, John William, High thermal conductivity materials with grafted surface functional groups.
  16. Emery, Franklin T., High-voltage winding including double-sided insulating tape and associated methods.
  17. Smith,James D. B., Homogeneous alumoxane-LCT-epoxy polymers and methods for making the same.
  18. Wang,Xingwu; Weiner,Michael L., Hydrogen storage apparatus comprised of halloysite.
  19. Segletes, David S.; Han, Zhaohui, Insulation materials having apertures formed therein.
  20. Smith, James D; Stevens, Gary; Wood, John W, Insulation paper with high thermal conductivity materials.
  21. Emery,F. Tim, Integral slip layer for insulating tape.
  22. Smith,James D. B., LCT-epoxy polymers with HTC-oligomers and method for making the same.
  23. Sternberg, Lisa Marie; Dobbins, William Paul; Sheaffer, Jeffrey David; Rigby, Marc Herbert; Iversen, Alan M., Method for manufacturing liquid-cooled stator bars.
  24. Smith, James D. B.; Stevens, Gary; Wood, John W., Mix of grafted and non-grafted particles in a resin.
  25. Stevens, Gary; Smith, James D. B.; Wood, John W.; Groeppel, Peter, Multi-layered platelet structure.
  26. Stevens, Gary; Smith, James D. B.; Wood, John W., Nano and meso shell-core control of physical properties and performance of electrically insulating composites.
  27. Prigent, Madeleine; Vanpoulle, Sophie, Optical fiber cable having improved properties.
  28. Smith, James D. B.; Stevens, Gary; Wood, John W., Patterning on surface with high thermal conductivity materials.
  29. Smith, James D. B.; Stevens, Gary; Wood, John W., Patterning on surface with high thermal conductivity materials.
  30. Stevens, Gary C.; Smith, James D. B.; Wood, John W., Polymer brushes.
  31. Brockschmidt, Mario; Pohlmann, Friedhelm; Rainer, Frank, Reaction accelerator for a copolymerisation, electrical-insulation tape, electrical-insulation body, and consolidation body.
  32. Smith, James D. B.; Stevens, Gary; Wood, John W., Seeding of HTC fillers to form dendritic structures.
  33. Smith, James D. B.; Stevens, Gary; Wood, John W., Seeding resins for enhancing the crystallinity of polymeric substructures.
  34. Smith, James D. B.; Stevens, Gary; Wood, John W., Seeding resins for enhancing the crystallinity of polymeric substructures.
  35. Nelson, Thomas I.; Wood, John W.; Montgomery, Lon W., Stator coil with improved heat dissipation.
  36. Smith, James David Blackhall; Stevens, Gary; Wood, John William, Structured resin systems with high thermal conductivity fillers.
  37. Smith,James D B; Stevens,Gary; Wood,John W, Surface coating of lapped insulation tape.
  38. Okamoto,Tetsushi; Sawa,Fumio; Iwata,Noriyuki; Kakiuchi,Mikio; Yamada,Toshimitsu, Tape member or sheet member, and method of producing tape member or sheet member.
  39. Emery, Franklin T., Tape structure with conductive outer side and electrically insulating inner side.
  40. Gunderman, Robert D.; Hammond, John M., Ultracapacitors comprised of mineral microtubules.
  41. Gunderman,Robert D.; Hammond,John M, Ultracapacitors comprised of mineral microtubules.
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