|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||174/052.3 ; 174/052.4 ; 257/680 ; 257/704 ; 357/072 ; 357/074 ; 250/239 ; 703/754 ; 703/756|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 43 인용 특허 : 4|
A windowed package is capable of withstanding a mass reflow process. During mass reflow, the entire package is subjected to the solder reflow temperature. In one embodiment, the lid comprises a ceramic frame and a glass window.
[ What is claimed is:] [1.] An integrated circuit package comprising:a non-ceramic body; anda lid sealed to the non-ceramic body with a distinct adhesive material, the lid having a transparent window with a ceramic frame, said ceramic frame bordering said transparent window, wherein the integrated circuit package is capable of withstanding a mass reflow process.