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특허 상세정보

Mass reflowable windowed package

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01L-023/02   
미국특허분류(USC) 174/052.3 ; 174/052.4 ; 257/680 ; 257/704 ; 357/072 ; 357/074 ; 250/239 ; 703/754 ; 703/756
출원번호 US-0172710 (1998-10-13)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Blakely, Sokoloff, Taylor & Zafman LLP
인용정보 피인용 횟수 : 43  인용 특허 : 4
초록

A windowed package is capable of withstanding a mass reflow process. During mass reflow, the entire package is subjected to the solder reflow temperature. In one embodiment, the lid comprises a ceramic frame and a glass window.

대표
청구항

[ What is claimed is:] [1.] An integrated circuit package comprising:a non-ceramic body; anda lid sealed to the non-ceramic body with a distinct adhesive material, the lid having a transparent window with a ceramic frame, said ceramic frame bordering said transparent window, wherein the integrated circuit package is capable of withstanding a mass reflow process.

이 특허를 인용한 특허 피인용횟수: 43

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