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[미국특허] Method of planarizing the upper surface of a semiconductor wafer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/302
출원번호 US-0091932 (1998-06-24)
국제출원번호 PCT/US98/08693 (1998-04-30)
§371/§102 date 19980624 (19980624)
국제공개번호 WO-9849723 (1998-11-05)
발명자 / 주소
  • Kaisaki David A.
  • Kranz Heather K.
  • Wood Thomas E.
  • Hardy L. Charles
출원인 / 주소
  • 3M Innovative Properties Company
대리인 / 주소
    Pastirik
인용정보 피인용 횟수 : 140  인용 특허 : 105

초록 ▼

This invention pertains to a method of modifying or refining a surface of a wafer suited for semiconductor fabrication. This method may be used to modify a wafer having an unmodified, exposed surface comprised of a layer of a second material deployed over at least one discrete feature of a first mat

대표청구항 ▼

[What is claimed is:] [1.]a) providing a wafer comprising at least a first material having a surface etched to form a pattern and at least a second material deployed over the surface of the first material;b) contacting the second material of the wafer to a plurality of three-dimensional abrasive com

이 특허에 인용된 특허 (105) 인용/피인용 타임라인 분석

  1. Bilkadi Zayn (Mahtomedi MN), Abrasion resistant coatings comprising silicon dioxide dispersions.
    상세보기
  2. Bilkadi Zayn (Mahtomedi MN) Klun Thomas P. (Lakeland MN), Abrasive article.
    상세보기
  3. Gagliardi John J. (Hudson WI) Lokken Roger C. (Woodbury MN), Abrasive article and method of making same.
    상세보기
  4. Rowenhorst Donley D. (Maplewood MN) Berg Todd A. (St. Louis Park MN), Abrasive article containing shaped abrasive particles.
    상세보기
  5. Bruxvoort Wesley J. (Woodbury MN) Calhoun Clyde D. (Stillwater MN) Webb Richard J. (Inver Grove Heights MN), Abrasive article having abrasive composite members positioned in recesses.
    상세보기
  6. Calhoun Clyde D. (Stilwater MN), Abrasive article having precise lateral spacing between abrasive composite members.
    상세보기
  7. Buchanan Scott J. (Minneapolis) Morrison Eric D. (West St. Paul) Boston David R. (Woodbury) Hedrick Steven T. (Cottage Grove) Kausch William L. (Cottage Grove) Larson Wayne K. (Maplewood MN), Abrasive article having vanadium oxide incorporated therein.
    상세보기
  8. Harmer Walter L. (Arden Hills MN) Christensen Leif (St. Paul MN) Drtina Gary J. (Woodbury MN) Helmin Harvey J. (Golden Valley MN), Abrasive article with conductive, doped, conjugated, polymer coat and method of making same.
    상세보기
  9. Haas John D. (Woodbury MN) Christianson Todd J. (Oakdale MN) Bruxvoort Wesley J. (Woodbury MN), Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface.
    상세보기
  10. Hibbard Louis D. (Eagan MN) Collins Stanley B. (White Bear Lake MN) Haas John D. (Woodbury MN), Abrasive article, a process of making same, and a method of using same to finish a workpiece surface.
    상세보기
  11. Follensbee Robert A. (Cottage Grove MN), Abrasive articles.
    상세보기
  12. Culler Scott R. (Burnsville MN) Berg Gregory A. (Lindstrom MN) Pieper Jon R. (Lindstrom MN) Olson Richard M. (Stillwater MN), Abrasive articles and methods of making and using same.
    상세보기
  13. Holmes Gary L. (Vadnais Heights MN) Culler Scott R. (Burnsville MN) Hardy David H. (New Richmond WI) Hendrickson William A. (St. Joseph WI) Klun Thomas P. (Lakeland MN) Harmon Kimberly K. (Hudson WI), Abrasive articles comprising precisely shaped particles.
    상세보기
  14. Jantschek Robert J. (Stillwater MN) Rouser Forrest J. (San Rafael CA) Sterner Mark L. (Mahtomedi MN) Testen Theodore J. (St. Paul MN), Abrasive attachment system for rotative abrading applications.
    상세보기
  15. Fujiwara Yukio (Hyougo JPX) Shirai Keiichi (Omiya JPX) Inoue Fumio (Tokyo JPX), Abrasive cloth dresser.
    상세보기
  16. Hibbard Louis D. (Eagan MN), Abrasive composites having a controlled rate of erosion, articles incorporating same, and methods of making and using sa.
    상세보기
  17. Rutherford Denise R. (Stillwater MN) Goetz Douglas P. (St. Paul MN) Thomas Cristina U. (Woodbury MN) Webb Richard J. (Inver Grove Heights MN) Bruxvoort Wesley J. (Woodbury MN) Buhler James D. (Shring, Abrasive construction for semiconductor wafer modification.
    상세보기
  18. Celikkaya Ahmet (P.O. Box 33427 St. Paul MN 55133-3427) Scherger Jerald A. (P.O. Box 33427 St. Paul MN 55133-3427) Wald Vernon M. (P.O. Box 33427 St. Paul MN 55133-3427), Abrasive grain, method of making same and abrasive products.
    상세보기
  19. Monroe Larry D. (Inver Grove Heights MN) Wood William P. (Minneapolis MN), Abrasive grits formed of ceramic containing oxides of aluminum and rare earth metal, method of making and products made.
    상세보기
  20. Monroe Larry D. (Inver Grove Heights MN) Wood William P. (Minneapolis MN), Abrasive grits formed of ceramic containing oxides of aluminum and yttrium, method of making and using the same and prod.
    상세보기
  21. Cottringer Thomas E. (Niagara Falls CAX) van de Merwe Ronald H. (Niagara Falls CAX) Bauer Ralph (Niagara Falls CAX), Abrasive material and method for preparing the same.
    상세보기
  22. Hartfelt Jorgen (36 Berkeley Dr. Horsholm MA DKX) Hoehn Ralf (36 Berkeley Dr. Chelmsford MA 01824), Abrasive of a microporous polymer matrix with inorganic particles thereon.
    상세보기
  23. Buchanan Scott J. (St. Paul MN) Chang Kwo-Dong A. (St. Paul MN), Abrasive printed with an electrically conductive ink.
    상세보기
  24. Kirk Alan R. (St. Paul MN) Larson Eric G. (St. Paul MN), Abrasive product having a binder comprising an aminoplast binder.
    상세보기
  25. Kirk Alan R. (St. Paul MN) Larson Eric G. (St. Paul MN), Abrasive product having binder comprising an aminoplast resin.
    상세보기
  26. Yamamoto Motokazu (8-20-602 ; Mita 2-Chome Minato-Ku ; Tokyo JPX), Abrasive sheet and method for manufacturing the abrasive sheet.
    상세보기
  27. Calhoun Clyde D. (Grant Township ; Washington County MN) Foss George D. (Amery WI) Fleming Maurice J. (Cottage Grove MN) Bruxvoort Wesley J. (Woodbury MN), Abrasive sheeting having individually positioned abrasive granules.
    상세보기
  28. Terazawa Masatoshi (Kyoto JPX) Inoue Toshisada (Kyoto JPX), Abrasive tape.
    상세보기
  29. Kawashima Norimichi (Tokyo JPX) Hattori Toshiro (Tokyo JPX), Abrasive tools.
    상세보기
  30. Yu Chris C. (Boise ID), Acoustical method and system for detecting and controlling chemical-mechanical polishing (CMP) depths into layers of con.
    상세보기
  31. Lund Douglas E. (13304 Purple Sage Dallas TX 75240), Automatic chemical and mechanical polishing system for semiconductor wafers.
    상세보기
  32. Beyer Klaus D. (Poughkeepsie NY) Guthrie William L. (Poughkeepsie NY) Makarewicz Stanley R. (New Windsor NY) Mendel Eric (Poughkeepsie NY) Patrick William J. (Newburgh NY) Perry Kathleen A. (Lagrange, Chem-mech polishing method for producing coplanar metal/insulator films on a substrate.
    상세보기
  33. Watts David ; Bajaj Rajeev ; Das Sanjit ; Farkas Janos ; Dang Chelsea ; Freeman Melissa ; Saravia Jaime A. ; Gomez Jason ; Cook Lance B., Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture.
    상세보기
  34. Neville Matthew (Champaign IL) Fluck David J. (Pesotum IL) Hung Cheng-Hung (Champaign IL) Lucarelli Michael A. (Mattoon IL) Scherber Debra L. (Orangevale CA), Chemical mechanical polishing slurry for metal layers.
    상세보기
  35. Kaufman Vlasta Brusic ; Kistler Rodney C., Chemical mechanical polishing slurry useful for copper substrates.
    상세보기
  36. Somekh Sasson, Chemical mechanical polishing with multiple polishing pads.
    상세보기
  37. Barber ; Jr. Loren L. (Lake Elmo MN) Christianson Todd J. (Oakdale MN) Preston Jay B. (St. Paul MN), Coatable thermally curable binder presursor solutions modified with a reactive diluent, abrasive articles incorporating.
    상세보기
  38. Harmer Walter L. (Arden Hills MN) DeVoe Robert J. (Oakdale MN) Larson Eric G. (Lake Elmo MN) Kincaid Don H. (Hudson WI) Willett Peggy S. (Stillwater MN) Williams Jerry W. (Cottage Grove MN), Coated abrasive article and method of making same.
    상세보기
  39. Oxman Joel D. (Minneapolis MN) Ubel ; III F. Andrew (St. Paul MN) Larson Eric G. (White Bear Lake MN), Coated abrasive binder containing ternary photoinitiator system.
    상세보기
  40. Tumey Michael L. (St. Paul MN) Bange Donna W. (Eagan MN) Robbins Aida F. (Maplewood MN), Coated abrasive having radiation curable binder.
    상세보기
  41. Boettcher Thomas E. (Hastings MN) Thalacker Victor P. (Stillwater MN), Coated abrasive product having radiation curable binder.
    상세보기
  42. Hoopman Timothy L. (River Falls WI), Coated abrasive sheet article.
    상세보기
  43. Ott Ronald L. (Lake Elmo MN), Coated abrasive sheet material with loop attachment means.
    상세보기
  44. Ott Ronald L. (Lake Elmo MN) Gorman Michael R. (White Bear Lake MN) Becker Dennis L. (Vadnais Heights MN) Folske Donald W. (Oakdale MN) Melbye William L. (Minneapolis MN) Nestegard Susan K. (Woodbury, Coated abrasive sheet material with loop material for attachment incorporated therein.
    상세보기
  45. Chasman Jonathan N. (Shoreview MN) Hegel Ramon F. (St. Paul MN) Kendall Philip E. (Woodbury MN) Postma Nathan B. (White Bear Lake MN) Spencer Douglas S. (St. Paul MN), Coated abrasive suitable for use as a lapping material.
    상세보기
  46. Supkis Stanley J. (Sand Lake NY) Zador Eugene (Clifton Park NY) Ravipati Sitaramaiah (Colonie NY) Romano Richard A. (Watervliet NY) Yarbrough Walter A. (Stormstown PA), Coated abrasives with rapidly curable adhesives.
    상세보기
  47. Zador Eugene (Ballston Lake NY) Kaczmarek Wesley R. (Burnt Hills NY) Ravipati Sitaramaiah (Latham NY), Coated abrasives with rapidly curable adhesives and controllable curvature.
    상세보기
  48. Kunz Reiner (Waldshut-Tiengen DEX) Dietrich Rainer (Basel CHX), Coated silicon carbide abrasive grain.
    상세보기
  49. Canty George (Woodbury MN), Composite article containing rigid layers.
    상세보기
  50. Lofaro Michael F. (Milton NY), Composite polishing pad.
    상세보기
  51. Palazzotto Michael C. (St. Paul MN) DeVoe Robert J. (St. Paul MN), Energy curable compositions: two component curing agents.
    상세보기
  52. Palazotto Michael C. (St. Paul MN) Brown-Wensley Katherine A. (Lake Elmo MN) DeVoe Robert J. (St. Paul MN), Energy-induced dual curable compositions.
    상세보기
  53. Bloecher Ulrich (St. Paul MN) Duwell Ernest J. (Hudson WI), Erodable agglomerates and abrasive products containing the same.
    상세보기
  54. Bloecher Ulrich (St. Paul MN) Duwell Ernest J. (Hudson WI), Erodable agglomerates and abrasive products containing the same.
    상세보기
  55. Butzke Hilbert C. (North Hudson WI) Harry Dennis W. (Mahtomedi MN), Fining sheet and method of making and using the same.
    상세보기
  56. James David B. ; Budinger William D. ; Roberts John V. H. ; Oliver Michael R. ; Chechik Nina G. ; Levering ; Jr. Richard M. ; Reinhardt Heinz F., Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like.
    상세보기
  57. Wiand Ronald C. (1494 Heatherwood Dr. Troy MI 48098), Flexible abrasive pad with ramp edge surface.
    상세보기
  58. Fisher Wayne G. (Allen TX), Integrated circuit planarization by mechanical polishing.
    상세보기
  59. McLane Jack E. (Port Huron MI) Schenk Raymond L. (Port Huron MI) Rader Robert R. (Port Huron MI) Wirtz John W. (Port Huron MI), Machine for continuously casting battery grids.
    상세보기
  60. Tuttle Mark E. (Boise ID) Doan Trung T. (Boise ID) Fox Angus C. (Boise ID) Sandhu Gurtej S. (Boise ID) Stroupe Hugh E. (Boise ID), Method and apparatus for improving planarity of chemical-mechanical planarization operations.
    상세보기
  61. Leach Michael A. (345 Sheridan #204 Palo Alto CA 94306), Method and structure for polishing a wafer during manufacture of integrated circuits.
    상세보기
  62. Kodera Masako (Kawasaki NY JPX) Yano Hiroyuki (Wappingers Falls NY) Shigeta Atsushi (Yamato JPX) Aoki Riichirou (Tokyo JPX) Yajima Hiromi (Yokohama JPX) Okano Haruo (Tokyo JPX), Method for planarizing a semiconductor device having a amorphous layer.
    상세보기
  63. Lawrence John E. (Cupertino CA), Method for reclaiming substrate from semiconductor wafers.
    상세보기
  64. Beyer Klaus D. (Poughkeepsie NY) Makris James S. (Wappingers Falls NY) Mendel Eric (Poughkeepsie NY) Nummy Karen A. (Newburgh NY) Ogura Seiki (Hopewell Junction NY) Riseman Jacob (Poughkeepsie NY) Ro, Method for removing protuberances at the surface of a semiconductor wafer using a chem-mech polishing technique.
    상세보기
  65. Martin Lawrence L. (St. Paul MN) Storer Jonathan (St. Paul MN) Carpenter Michael W. (St. Paul MN), Method of coating alumina particles with refractory material, abrasive particles made by the method and abrasive product.
    상세보기
  66. Masmar Craig A. (Washington MN) Spencer Douglas S. (Ramsey MN) Edblom Elizabeth C. (Hennepin MN), Method of making a coated abrasive article.
    상세보기
  67. Chesley Jason A. (St. Croix WI) Bell Donald R. (White Bear Township ; Ramsey County MN) Rude Harold E. (Roseville MN) Sheffield William F. (Oakdale MN) Slama David F. (Vadnais Heights MN) Stephens Al, Method of making an abrasive article.
    상세보기
  68. Spurgeon Kathryn M. (River Falls WI) Culler Scott R. (Burnsville MN) Hardy David H. (New Richmond WI) Holmes Gary L. (Vadnais Heights MN), Method of making an abrasive article.
    상세보기
  69. Mucci Michael V. (Hudson WI), Method of providing a patterned surface on a substrate.
    상세보기
  70. Allen Franklin L. (Sherman TX) Davis Eugene C. (Sherman TX) Dyer Lawrence D. (Richardson TX) Medders Jerry B. (Van Alstyne TX) Simpson Vikki S. (Sherman TX) Smith Jerry D. (Sherman TX) Cunningham Mic, Method of surface protection of a semiconductor wafer during polishing.
    상세보기
  71. Lucker James A. (Alameda CA) Strecker Darlene N. (Oakdale MN) Wagle Kathleen A. (Oakdale MN), Method of texturing rigid memory disks using an abrasive article.
    상세보기
  72. Wiand Ronald C. (1494 Heatherwood Dr. Troy MI 48098), Molded abrasive article and process.
    상세보기
  73. Melbye William L. (Maplewood MN) Nestegard Susan K. (Woodbury MN) Wood Leigh E. (Woodbury MN) Lindseth Marvin D. (Prescott MN) Bychinski Dale A. (Fairmont MN), Mushroom-type hook strip for a mechanical fastener.
    상세보기
  74. Markhoff-Matheny Carole J. (Leicester MA) Hay John (Shrewsbury MA) Rostoker David (Sturbridge MA), Nitrified bonded sol gel sintered aluminous abrasive bodies.
    상세보기
  75. Leitheiser Melvin A. (Stillwater MN) Sowman Harold G. (Maplewood MN), Non-fused aluminum oxide-based abrasive mineral.
    상세보기
  76. Budinger William D. (Kennett Square PA) Jensen Elmer W. (Wilmington DE), Pad material for grinding, lapping and polishing.
    상세보기
  77. Ravipati Sitaramaiah (Latham NY) Zador Eugene (Ballston Lake NY) Kaczmarek Wesley R. (Ballston Lake NY) Coleman Ernest A. (Stamford CT) Rostoker David (Sturbridge MA), Patterned coated abrasive for fine surface finishing.
    상세보기
  78. Graves Gordon C. (2764 Nipoma St. San Diego CA 92106), Penetration and fixture freeing agent.
    상세보기
  79. Bilkadi Zayn (Mahtomedi MN), Photocurable abrasion resistant coatings comprising silicon dioxide dispersions.
    상세보기
  80. Kaczmarek Wesley R. (Malta NY) Zador Eugene (Clifton Park NY) Ravipati Sitaramaiah (Colonie NY), Plural layered coated abrasive.
    상세보기
  81. Baldy Andr (Seyssins FRX) Barrois Grard (Le Fontanil FRX) Blanc Henri (Saint Julien de Ratz FRX) Dominiak Marcel (Grenoble FRX), Polishing machine having a taut microabrasive strip and an improved wafer support head.
    상세보기
  82. Takizawa Gisaburo (Aichi JPX) Senda Tetsushi (Aichi JPX) Miura Shiro (Aichi JPX), Polishing method of goods and abrasive pad therefor.
    상세보기
  83. Tuttle Mark E. (Boise ID), Polishing pad.
    상세보기
  84. Robinson Karl M., Polishing pad and a method for making a polishing pad with covalently bonded particles.
    상세보기
  85. Robinson Karl M. (Boise ID), Polishing pad and a method for making a polishing pad with covalently bonded particles.
    상세보기
  86. Yu Tat-Kwan (Austin TX) Yu Chris C. (Austin TX), Polishing pad for chemical-mechanical polishing of a semiconductor substrate.
    상세보기
  87. Thomas Michael E. (Milpitas CA), Polishing pad for planarization.
    상세보기
  88. Tuttle Mark E. (Boise ID), Polishing pad with uniform abrasion.
    상세보기
  89. Wilson Stuart M. (Tangmere ; 192 Hurricane Way Woodley ; Berkshire GB2) Sexton John S. (Bobcat ; West Street Odiham ; Hampshire GB2) Wright Derek N. (5 Eagle Close Heathlake ; Crowthorne ; Bershire G, Polishing tool component.
    상세보기
  90. Bonk Thomas J. (Stillwater MN) Simpson J. Thomas (Lake Elmo MN), Polyolefin substrate coated with acrylic-type normally tacky and pressure-sensitive adhesive and a method of making same.
    상세보기
  91. Wood Leigh E. (Woodbury MN) Noreen Allen L. (Lake Elmo MN), Pressure-sensitive adhesive tape fastener for releasably attaching an object to a fabric.
    상세보기
  92. Kobe James J. (Maplewood MN) Simpson John T. (Lake Elmo MN) Harmon Kimberly K. (Hudson WI) Wright Charles D. (Birchwood MN), Primed polymeric surfaces for cyanoacrylate adhesives.
    상세보기
  93. Bilkadi Zayn (Mahtomedi MN) Guder Harald (Wuppertal DEX), Primer for surfaces containing inorganic oxide.
    상세보기
  94. Schwabel Mark G. (Cottage Grove MN), Process for durable sol-gel produced alumina-based ceramics, abrasive grain and abrasive products.
    상세보기
  95. Culler Scott R. (Burnsville MN), Reduced viscosity slurries, abrasive articles made therefrom and methods of making said articles.
    상세보기
  96. Culler Scott R. (Burnsville MN), Reduced viscosity slurries, abrasive articles made therefrom, and methods of making said articles.
    상세보기
  97. Blackwell, Robert E., Removing slurry residue from semiconductor wafer planarization.
    상세보기
  98. Calhoun Clyde D. (St. Paul MN) Koskenmaki David C. (St. Paul MN), Repositionable pressure-sensitive adhesive tape.
    상세보기
  99. Desai Ankur H. (St. Peters MO) Wisnieski Michael S. (O\Fallon MO) Golland David I. (Chesterfield MO), Semiconductor wafer polisher and method.
    상세보기
  100. Wald Vernon M. (St. Paul MN) Kirk Robert S. (St. Paul MN), Shelling-resistant abrasive grain, a method of making the same, and abrasive products.
    상세보기
  101. Zador Eugene (Ballston Lake NY) Hsu Shyiguei (Watervliet NY) Kaczmarek Wesley R. (Ballston Lake NY) Ravipati Sitaramaiah (Latham NY) Supkis Stanley (Averill Park NY) Vogel Richard H. (Saratoga Spring, Single step, radiation curable ophthalmic fining pad.
    상세보기
  102. Pieper Jon R. (Lindstrom MN) Olson Richard M. (Stillwater MN) Mucci Michael V. (Hudson WI) Holmes Gary L. (Vadnais Heights MN) Heiti Robert V. (St. Paul MN), Structured abrasive article.
    상세보기
  103. Pieper Jon R. (Lindstrom MN) Olson Richard M. (Stillwater MN) Mucci Michael V. (Hudson WI) Holmes Gary L. (Vadnais Heights MN) Heiti Robert V. (St. Paul MN), Structured abrasive article.
    상세보기
  104. Ohishi Michihiro (Sagamihara JPX), Surface finishing tape.
    상세보기
  105. Chikaki Shinichi (Tokyo JPX), Wafer polishing device.
    상세보기

이 특허를 인용한 특허 (140) 인용/피인용 타임라인 분석

  1. Lugg, Paul S.; Fletcher, Timothy D., Abrasive article and method of modifying the surface of a workpiece.
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  2. Schwappach, Karl G.; Boutaghou, Zine-Eddine, Abrasive article with array of composite polishing pads.
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  3. Schwappach, Karl G.; Boutaghou, Zine-Eddine, Abrasive article with array of composite polishing pads.
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  4. Panzarella, Tracy H.; Yener, Doruk O., Abrasive articles including abrasive particulate materials, coated abrasives using the abrasive particulate materials and methods of forming.
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  5. Kollodge,Jeffrey S., Abrasive articles with nanoparticulate fillers and method for making and using them.
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  6. Uchida, Takeshi; Matsuzawa, Jun; Hoshino, Tetsuya; Kamigata, Yasuo; Terazaki, Hiroki; Honma, Yoshio; Kondoh, Seiichi, Abrasive liquid for metal and method for polishing.
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  7. Uchida, Takeshi; Matsuzawa, Jun; Hoshino, Tetsuya; Kamigata, Yasuo; Terazaki, Hiroki; Honma, Yoshio; Kondoh, Seiichi, Abrasive liquid for metal and method for polishing.
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  8. Wang, Jun; Haerle, Andrew G., Abrasive particulate material, and method of planarizing a workpiece using the abrasive particulate material.
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  9. Schwappach, Karl G.; Boutaghou, Zine-Eddine, Abrasive slurry and dressing bar for embedding abrasive particles into substrates.
    상세보기
  10. Cho, Hyun Ju; Kim, Jang Soon; Chang, Suk Ky, Acrylic pressure sensitive adhesive compositions.
    상세보기
  11. Wang, Yuchun; Bajaj, Rajeev; Redeker, Fred C., Additives to CMP slurry to polish dielectric films.
    상세보기
  12. Sayka, Anthony; Sardar, Dhiraj K.; Barrera, Frederick J.; Yow, Raylon M., Apparatus and method for cleaning a wafer.
    상세보기
  13. Lee,Ji Myong, Apparatus and methods of chemical mechanical polishing.
    상세보기
  14. Schwappach, Karl G.; Boutaghou, Zine-Eddine, Array of abrasive members with resilient support.
    상세보기
  15. Sugimoto, Masanobu; Yamada, Kenichi; Hara, Toshihiro; Irie, Masanobu, Bag containing blasting material.
    상세보기
  16. Liu,Zhendong; Quanci,John; Schmidt,Robert E.; Thomas,Terence M., Barrier polishing solution.
    상세보기
  17. Zhou, Renjie; Grumbine, Steven K.; Cherian, Isaac K., Boron-containing polishing system and method.
    상세보기
  18. Zhou,Renjie; Grumbine,Steven K.; Cherian,Issac K., Boron-containing polishing system and method.
    상세보기
  19. Andreas,Michael T., CMP cleaning composition with microbial inhibitor.
    상세보기
  20. Andreas,Michael T., CMP cleaning composition with microbial inhibitor.
    상세보기
  21. Park,Jeong heon; Lee,Jae dong; Kim,Sung jun; Hong,Chang ki, CMP slurry for forming aluminum film, CMP method using the slurry, and method for forming aluminum wiring using the CMP method.
    상세보기
  22. Slutz,David E.; Finke,Steven J., CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same.
    상세보기
  23. Salfelder,Joseph F.; Swart,Wayne; Prabhu,Gopalakrishna B.; Mirmira,Srinivas R.; Economikos,Laertis; Jamin,Fen Fen; Delehanty,Donald J.; Heenan,Daniel; Danza,Joseph M., Carbonation of pH controlled KOH solution for improved polishing of oxide films on semiconductor wafers.
    상세보기
  24. Lin, Juen-Kuen; Chen, Tzu-Shin; Lai, Chien-Hsin; Wei, Yung-Tsung, Carrier head for chemical mechanical polishing.
    상세보기
  25. Gagliardi, John J.; Savu, Patricia M., Chemical mechanical planarization composition, system, and method of use.
    상세보기
  26. Wang, Shumin; Kaufman, Vlasta Brusic, Chemical mechanical polishing systems and methods for their use.
    상세보기
  27. Wang,Shumin; Kaufman,Vlasta Brusic, Chemical mechanical polishing systems and methods for their use.
    상세보기
  28. Her, Yie-Shein; Srinivasan, Ramanathan; Babu, Suryadevara; Ramarajan, Suresh, Chemical-mechanical polishing slurry and method.
    상세보기
  29. Her,Yie Shein; Srinivasan,Ramanathan; Babu,Suryadevara; Ramarajan,Suresh, Chemical-mechanical polishing slurry and method.
    상세보기
  30. Nevoret, Damien Cyrille; Swei, Gwo Shin, Coated abrasives.
    상세보기
  31. Hardy, L. Charles; Kranz, Heather K.; Wood, Thomas E.; Kaisaki, David A.; Gagliardi, John J.; Clark, John C.; Savu, Patricia M.; Clark, Philip G., Compositions and methods for modifying a surface suited for semiconductor fabrication.
    상세보기
  32. McArdle,James L.; Culler,Scott R., Compositions for abrasive articles.
    상세보기
  33. Butterfield, Paul D.; Chen, Liang-Yuh; Hu, Yonqi; Manens, Antoine P.; Mavliev, Rashid; Tsai, Stan D.; Liu, Feng Q.; Wadensweiler, Ralph; Sun, Lizhong; Neo, Siew S.; Duboust, Alain, Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  34. Butterfield,Paul D.; Chen,Liang Yuh; Hu,Yonqi; Manens,Antoine P.; Mavliev,Rashid; Tsai,Stan D.; Liu,Feng Q.; Wadensweiler,Ralph; Sun,Lizhong; Neo,Siew S.; Duboust,Alain, Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  35. Liu,Zhendong, Corrosion-resistant barrier polishing solution.
    상세보기
  36. Yang, Jie; Johnson, Stephen A.; Kausch, William L.; Lu, Ying-Yuh; McMan, Steven J., Curable pressure sensitive adhesive compositions.
    상세보기
  37. Yang,Jie; Johnson,Stephen A.; Kausch,William L.; Lu,Ying Yuh; McMan,Steven J., Curable pressure sensitive adhesive compositions.
    상세보기
  38. Sun, Lizhong; Li, Shijian, Electrochemically assisted chemical polish.
    상세보기
  39. Duboust, Alain; Sun, Lizhong; Liu, Feng Q.; Wang, Yuchun; Wang, Yan; Neo, Siew; Chen, Liang-Yuh, Electrolyte composition and treatment for electrolytic chemical mechanical polishing.
    상세보기
  40. Sun, Lizhong; Liu, Feng Q.; Neo, Siew; Tsai, Stan; Chen, Liang-Yuh, Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP.
    상세보기
  41. Sun,Lizhong; Liu,Feng Q.; Neo,Siew; Tsai,Stan; Chen,Liang Yuh, Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP.
    상세보기
  42. Farrar,Paul A., Electronic apparatus having a core conductive structure within an insulating layer.
    상세보기
  43. Chung, Kwang Choon; Cho, Hyun-Nam; Seo, Young-Kwan, Etching solutions.
    상세보기
  44. Sinha, Nishant, Filling plugs through chemical mechanical polish.
    상세보기
  45. Sinha, Nishant, Filling plugs through chemical mechanical polish.
    상세보기
  46. Sinha, Nishant, Filling plugs through chemical mechanical polish.
    상세보기
  47. Chopra, Dinesh; Sabde, Gundu, Fixed-abrasive chemical-mechanical planarization of titanium nitride.
    상세보기
  48. Chopra,Dinesh; Sabde,Gundu, Fixed-abrasive chemical-mechanical planarization of titanium nitride.
    상세보기
  49. Chopra,Dinesh; Sabde,Gundu, Fixed-abrasive chemical-mechanical planarization of titanium nitride.
    상세보기
  50. Liu,Feng Q.; Chen,Liang Yuh; Tsai,Stan D.; Hu,Yongqi, Full sequence metal and barrier layer electrochemical mechanical processing.
    상세보기
  51. Liu,Feng Q.; Chen,Liang Yuh; Tsai,Stan D.; Hu,Yongqi, Full sequence metal and barrier layer electrochemical mechanical processing.
    상세보기
  52. Miller, Anne E.; Feller, A. Daniel; Cadien, Kenneth, High pH slurry for chemical mechanical polishing of copper.
    상세보기
  53. Li,Shijian; Redeker,Fred C.; White,John; Emami,Ramin, High through-put Cu CMP with significantly reduced erosion and dishing.
    상세보기
  54. Farrar,Paul A., Hplasma treatment.
    상세보기
  55. Yang, Jie; Salnikov, Dmitriy; Balich, Jason W., Hybrid adhesives, articles, and methods.
    상세보기
  56. Wang,Yan; Liu,Feng Q.; Duboust,Alain; Neo,Siew S.; Chen,Liang Yuh; Hu,Yongqi, Hydrogen bubble reduction on the cathode using double-cell designs.
    상세보기
  57. Gagliardi,John J.; Rueb,Chris J., In situ activation of a three-dimensional fixed abrasive article.
    상세보기
  58. Farrar, Paul A., Integrated circuit and seed layers.
    상세보기
  59. Farrar,Paul A., Integrated circuit and seed layers.
    상세보기
  60. Hsu,Wei Yung; Chen,Liang Yuh; Morad,Ratson; Carl,Daniel A.; Somekh,Sasson, Integrated multi-step gap fill and all feature planarization for conductive materials.
    상세보기
  61. Nuytkens,Peter R.; Popeko,Ilya E.; Kulinets,Joseph M., Interconnect circuitry, multichip module, and methods for making them.
    상세보기
  62. Nuytkens, Peter R.; Popeko, Ilya E.; Kulinets, Joseph M., Interconnect circuitry, multichip module, and methods of manufacturing thereof.
    상세보기
  63. Nuytkens,Peter R.; Popeko,Ilya E.; Kulinets,Joseph M., Interconnect circuitry, multichip module, and methods of manufacturing thereof.
    상세보기
  64. Uchida, Takeshi; Hoshino, Tetsuya; Terazaki, Hiroki; Kamigata, Yasuo; Koyama, Naoyuki; Honma, Yoshio; Kondoh, Seiichi, Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same.
    상세보기
  65. Schwappach, Karl; Boutaghou, Zine-Eddine, Method and apparatus for polishing with abrasive charged polymer substrates.
    상세보기
  66. Schwappach, Karl; Boutaghou, Zine-Eddine, Method and apparatus for processing sliders for disk drives, and to various processing media for the same.
    상세보기
  67. Liu,Feng Q.; Du,Tianbao; Duboust,Alain; Hsu,Wei Yung, Method and composition for electrochemical mechanical polishing processing.
    상세보기
  68. Jia,Renhe; Liu,Feng Q.; Tsai,Stan D.; Chen,Liang Yuh, Method and composition for polishing a substrate.
    상세보기
  69. Liu,Feng Q.; Chen,Liang Yuh; Tsai,Stan D.; Duboust,Alain; Neo,Siew S.; Hu,Yongqi; Wang,Yan; Butterfield,Paul D., Method and composition for polishing a substrate.
    상세보기
  70. Liu,Feng Q.; Du,Tianbao; Duboust,Alain; Wang,Yan; Hu,Yongqi; Tsai,Stan D.; Chen,Liang Yuh; Tu,Wen Chiang; Hsu,Wei Yung, Method and composition for polishing a substrate.
    상세보기
  71. Liu,Feng Q.; Tsai,Stan D.; Hu,Yongqi; Neo,Siew S.; Wang,Yan; Duboust,Alain; Chen,Liang Yuh, Method and composition for polishing a substrate.
    상세보기
  72. Liu,Feng Q.; Tsai,Stan D.; Hu,Yongqi; Neo,Siew S.; Wang,Yan; Duboust,Alain; Chen,Liang Yuh, Method and composition for polishing a substrate.
    상세보기
  73. Thomas, Terence M.; Ye, Qianqiu Christine; So, Joseph K.; Goldberg, Wendy B.; Godfrey, Wade, Method and composition for polishing by CMP.
    상세보기
  74. Tsai, Stan; Sun, Lizhong; Li, Shijian, Method and composition for the selective removal of residual materials and barrier materials during substrate planarization.
    상세보기
  75. Lizhong Sun ; Shijian Li ; Fritz Redeker, Method for abrasive-free metal CMP in passivation domain.
    상세보기
  76. Cooper, Emanuel I.; Furman, Bruce; Rath, David L., Method for isotropic etching of copper.
    상세보기
  77. Grant, John M.; Kobayashi, Thomas S., Method for making a semiconductor device by variable chemical mechanical polish downforce.
    상세보기
  78. Ahn,Kie Y.; Forbes,Leonard, Method for making integrated circuits.
    상세보기
  79. Kessel, Carl R.; Boardman, Larry D.; Webb, Richard J., Method for manufacturing thin substrate using a laminate body.
    상세보기
  80. Lee, Kang-Hua; Liu, Wen-Cheng, Method for polishing through-silicon via (TSV) wafers and a polishing composition used in the method.
    상세보기
  81. Woo,Edward J.; Bange,Donna W.; Lamphere,Craig F., Method of abrading a workpiece.
    상세보기
  82. Poris, Jaime, Method of generating calibration data for relative height measurement.
    상세보기
  83. Yau, Wai-Fan; Cheung, David; Chopra, Nasreen Gazala; Lu, Yung-Cheng; Mandal, Robert; Moghadam, Farhad, Method of improving moisture resistance of low dielectric constant films.
    상세보기
  84. Fukushima,Dai; Minamihaba,Gaku; Yano,Hiroyuki; Tateyama,Yoshikuni, Method of making semiconductor device by polishing with intermediate clean polishing.
    상세보기
  85. Minamihaba, Gaku; Yano, Hiroyuki, Method of manufacturing a semiconductor device using a slurry for chemical mechanical polishing of copper.
    상세보기
  86. Nuytkens,Peter R.; Popeko,Ilya E.; Kulinets,Joseph M., Method of manufacturing planar inductors.
    상세보기
  87. Poris, Jaime, Method of measuring dishing.
    상세보기
  88. Poris, Jaime, Method of measuring dishing using relative height measurements.
    상세보기
  89. Carter, Phillip W.; Johns, Timothy P., Method of polishing a silicon-containing dielectric.
    상세보기
  90. Carter,Phillip W.; Johns,Timothy P., Method of polishing a silicon-containing dielectric.
    상세보기
  91. Carter,Phillip W; Johns,Timothy P, Method of polishing a silicon-containing dielectric.
    상세보기
  92. Vacassy,Robert; Khanna,Dinesh N.; Simpson,Alexander, Method of polishing a tungsten-containing substrate.
    상세보기
  93. Webb,Richard J.; Clark,John C.; Rueb,Christopher J.; Gagliardi,John J., Method of polishing a wafer.
    상세보기
  94. Miyairi, Noriko; Inada, Yasuo; Hasegawa, Tsuyoshi; Terashima, Yuji; Sakai, Kenji; Kitamura, Tadahiro; Umeda, Takahiro, Method of polishing copper layer of substrate.
    상세보기
  95. Prasad, Abaneshwar; Myers, Ronald E., Method of preparing a conductive film.
    상세보기
  96. Egitto,Frank D.; Krasniak,Stephen; Lauffer,John M.; Markovich,Voya R.; Matienzo,Luis J., Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof.
    상세보기
  97. Gagliardi, John J., Method of using a soft subpad for chemical mechanical polishing.
    상세보기
  98. Gracias, David H., Method to increase electromigration resistance of copper using self-assembled organic thiolate monolayers.
    상세보기
  99. Gracias,David H., Method to increase electromigration resistance of copper using self-assembled organic thiolate monolayers.
    상세보기
  100. Gracias,David H., Method to increase electromigration resistance of copper using self-assembled organic thiolate monolayers.
    상세보기
  101. Gracias,David H., Method to increase electromigration resistance of copper using self-assembled organic thiolate monolayers.
    상세보기
  102. Ahn, Kie Y.; Forbes, Leonard, Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals.
    상세보기
  103. Kesari, Susrut; Lamanna, William M.; Parent, Michael J.; Zazzera, Lawrence A., Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor.
    상세보기
  104. Zazzera, Lawrence A.; Parent, Michael J.; Lamanna, William M.; Kesari, Susrut, Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor.
    상세보기
  105. Barnes, Jeffrey A.; Liu, Jun; Zhang, Peng, Non-amine post-CMP composition and method of use.
    상세보기
  106. Xie, Ya-Hong; Wang, Pu, Optical fiber-based hybrid SERS platform for in vivo detection of bio-molecules.
    상세보기
  107. Kollodge,Jeffrey S.; Loesch,Christopher N., Pad constructions for chemical mechanical planarization applications.
    상세보기
  108. Chen, Liang-Yuh; Hsu, Wei-Yung; Duboust, Alain; Morad, Ratson; Carl, Daniel A., Planarization of substrates using electrochemical mechanical polishing.
    상세보기
  109. Boyd,Steven D.; Kesari,Susrut; Lamanna,William M.; Parent,Michael J.; Zazzera,Lawrence A.; Zhang,Haiyan, Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor.
    상세보기
  110. Matsuda,Tsuyoshi; Hirano,Tatsuhiko; Oh,Junhui; Kawamura,Atsunori; Sakai,Kenji, Polishing composition.
    상세보기
  111. Vacassy, Robert; Khanna, Dinesh N.; Simpson, Alexander, Polishing composition for a tungsten-containing substrate.
    상세보기
  112. Wang, Shumin; Grumbine, Steven K.; Streinz, Christopher C.; Hoglund, Eric W. G., Polishing composition for metal CMP.
    상세보기
  113. Wang, Shumin; Grumbine, Steven K.; Streinz, Christopher C.; Hoglund, Eric W. G., Polishing composition for metal CMP.
    상세보기
  114. Uchida,Takeshi; Kamigata,Yasuo; Terasaki,Hiroki; Kurata,Yasushi; Hoshino,Tetsuya; Igarashi,Akiko, Polishing compound for chemimechanical polishing and polishing method.
    상세보기
  115. Kollodge, Jeffrey S., Polishing fluids and methods for CMP.
    상세보기
  116. Kollodge,Jeffrey S., Polishing fluids and methods for CMP.
    상세보기
  117. Hasegawa, Kou, Polishing method.
    상세보기
  118. Lefevre, Paul Andre; Allison, William C.; Scott, Diane; LaCasse, James P., Polishing pad with grooved foundation layer and polishing surface layer.
    상세보기
  119. Bajaj, Rajeev; Huang, Ping; Kerprich, Robert; Allison, William C.; Frentzel, Richard; Scott, Diane, Polishing pad with homogeneous body having discrete protrusions thereon.
    상세보기
  120. Juy-Lung Li ; Tse-Yong Yao ; Fred C. Redeker ; Rajeev Bajaj ; Yutao Ma, Post CU CMP polishing for reduced defects.
    상세보기
  121. Chad R. Binkerd ; Jose L. Cruz ; Timothy C. Krywanczyk ; Brian D. Pfeifer ; Rosemary A. Previti-Kelly ; Patricia Schink ; Amye L. Wells, Prevention of slurry build-up within wafer topography during polishing.
    상세보기
  122. Wang, Zhihong; Wang, You; Mao, Daxin; Jia, Renhe; Tsai, Stan D.; Hu, Yongqi; Tian, Yuan A.; Chen, Liang Yuh, Process and composition for conductive material removal by electrochemical mechanical polishing.
    상세보기
  123. Dordi, Yezdi; Boyd, John; Arunagiri, Tiruchirapalli; Yoon, Hyungsuk Alexander; Redeker, Fritz C.; Thie, William; Howald, Arthur M., Processes and systems for engineering a barrier surface for copper deposition.
    상세보기
  124. Dordi, Yezdi; Boyd, John; Arunagiri, Tiruchirapalli; Redeker, Fritz C.; Thie, William; Howald, Arthur M., Processes and systems for engineering a copper surface for selective metal deposition.
    상세보기
  125. Nakagawa, Kanae; Mizukoshi, Masataka; Teshirogi, Kazuo, Semiconductor device, wiring substrate forming method, and substrate processing apparatus.
    상세보기
  126. Nakagawa, Kanae; Mizukoshi, Masataka; Teshirogi, Kazuo, Semiconductor device, wiring substrate forming method, and substrate processing apparatus.
    상세보기
  127. Nakagawa,Kanae; Mizukoshi,Masataka; Teshirogi,Kazuo, Semiconductor device, wiring substrate forming method, and substrate processing apparatus.
    상세보기
  128. Noda, Kazuki, Semiconductor surface protecting method.
    상세보기
  129. Taiji,Toshiji; Tsuchiya,Yasuaki; Ito,Tomoyuki; Aoyagi,Kenichi; Sakurai,Shin, Slurry for chemical mechanical polishing.
    상세보기
  130. Minamihaba,Gaku; Yano,Hiroyuki, Slurry for chemical mechanical polishing for copper and method of manufacturing semiconductor device using the slurry.
    상세보기
  131. Sun, Lizhong; Tsai, Stan D; Li, Shijian; White, John M, Solution to metal re-deposition during substrate planarization.
    상세보기
  132. Collins,Stanley B.; Haas,John D., Structured abrasive with parabolic sides.
    상세보기
  133. Farrar, Paul A., Structures and methods to enhance copper metallization.
    상세보기
  134. Farrar, Paul A., Structures and methods to enhance copper metallization.
    상세보기
  135. Farrar,Paul A., Structures and methods to enhance copper metallization.
    상세보기
  136. Farrar,Paul A., Structures and methods to enhance copper metallization.
    상세보기
  137. Sun,Lizhong; Tsai,Stan D.; Li,Shijian; Liu,Feng, Tantalum removal during chemical mechanical polishing.
    상세보기
  138. Palmgren, Gary M., Undulated pad conditioner and method of using same.
    상세보기
  139. Rueb,Christopher J.; Webb,Richard J.; Velamakanni,Bhaskar V., Wafer planarization composition and method of use.
    상세보기
  140. Rueb,Christopher J.; Webb,Richard J.; Velamakanni,Bhaskar V., Wafer planarization composition and method of use.
    상세보기

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