초록 ▼

A method of measuring solder bumps formed on a substrate mounting a semiconductor element thereon includes mounting a work to be measured on a work position mechanism, and scanning the work by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct

A method of measuring solder bumps formed on a substrate mounting a semiconductor element thereon includes mounting a work to be measured on a work position mechanism, and scanning the work by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be satisfactory.

대표청구항 ▼

[What is claimed is:] [1.]setting a work to be measured on a table, the work having solder bump rows;irradiating a light beam on predetermined solder bumps of said solder bumps;detecting positions of said solder bumps by receiving light reflected from said predetermined solder bumps;irradiating a li

[What is claimed is:] [1.]setting a work to be measured on a table, the work having solder bump rows;irradiating a light beam on predetermined solder bumps of said solder bumps;detecting positions of said solder bumps by receiving light reflected from said predetermined solder bumps;irradiating a light beam on solder bump rows including said predetermined solder bumps;determining an apex height of each solder bump of said solder bump rows by receiving light reflected from said solder bump rows, and detecting a shift amount of a setting posture of said work;adjusting said setting posture of said table, and correcting the shift amount of said setting posture of said work;irradiating a light beam on each solder bump on said work; andmeasuring an apex height of each solder bump by receiving a light reflected from each solder bump.