초록 ▼

A system is provided for cooling electronic components and for localized cooling of selected electronic components. An air mover is mounted adjacent to an exhaust opening in order to generate a low pressure zone within the cabinet's interior. An inlet opening is defined in a cabinet so that the air

A system is provided for cooling electronic components and for localized cooling of selected electronic components. An air mover is mounted adjacent to an exhaust opening in order to generate a low pressure zone within the cabinet's interior. An inlet opening is defined in a cabinet so that the air mover can generate a serial air flow path extending from the inlet opening to the exhaust opening for cooling of electronic components within the cabinet. At least one secondary opening is defined in the cabinet so that the air mover can generate a parallel air flow path, for cooling of selected electronic components, that extends from the secondary opening and then joins the serial air flow path.

대표청구항 ▼

[What is claimed:] [1.]cabinet enclosing said electronic components and said selected electronic components;an air mover connected to said cabinet and positioned to urge air flow toward an exhaust opening defined in said cabinet;an inlet opening defined in said cabinet through which air is drawn int

[What is claimed:] [1.]cabinet enclosing said electronic components and said selected electronic components;an air mover connected to said cabinet and positioned to urge air flow toward an exhaust opening defined in said cabinet;an inlet opening defined in said cabinet through which air is drawn into said interior of said cabinet, said air mover generating a serial air flow path extending from said inlet opening toward said exhaust opening for general cooling of said electronic components enclosed in said cabinet;secondary openings defined in said cabinet through which air is drawn into said interior of said cabinet, said secondary openings each being positioned proximal to at least one of said selected electronic components;said air mover generating parallel air flow paths extending from said secondary openings, each of said parallel air flow paths extending adjacent said at least one selected electronic component, and then joining said serial air flow path, for localized cooling of said at least one selected electronic component.