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Modular semiconductor workpiece processing tool 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
  • H01L-021/64
  • B65G-049/07
출원번호 US-0680068 (1996-07-15)
발명자 / 주소
  • Berner Robert W.
  • Woodruff Daniel J.
  • Schmidt Wayne J.
  • Coyle Kevin W.
  • Zila Vladimir,CAX
  • Lund Worm
출원인 / 주소
  • Semitool, Inc.
대리인 / 주소
    Polit & Associates, LLC
인용정보 피인용 횟수 : 61  인용 특허 : 33

초록 ▼

The present invention provides for a semiconductor workpiece processing tool. The semiconductor workpiece processing tool includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor work

대표청구항 ▼

[What is claimed is:] [1.]a plurality of workpiece processing modules for processing a workpiece;each of said workpiece processing modules being interchangeable;a workpiece conveyor disposed between said workpiece processing modules and having at least two workpiece transport units, said workpiece p

이 특허에 인용된 특허 (33)

  1. Sakaya Kazuhiro (Yokohama JPX) Kodama Shoichi (Tokyo JPX), Apparatus for transferring semiconductor wafers.
    상세보기
  2. Shiraiwa Hirotsugu (Hino JPX), Apparatus for transferring semiconductor wafers.
    상세보기
  3. Bergman Eric J. (Kalispell MT), Aqueous hydrofluoric acid vapor processing of semiconductor wafers.
    상세보기
  4. Bergman Eric J. (Kalispell MT), Aqueous hydrofluoric and hydrochloric acid vapor processing of semiconductor wafers.
    상세보기
  5. Oehler Henry (Hennef DEX) Peth Norbert (Much DEX) Holpp Hans W. (Hennef DEX) Sass Wolfgang (Hennef DEX), Centrifuging installation.
    상세보기
  6. Matsushita Yoshinari (Hirakata JPX) Fukumoto Kenji (Hirakata JPX), Chemical vapor deposition reaction apparatus having isolated reaction and buffer chambers.
    상세보기
  7. Toshima Masato M. (Sunnyvale CA) Salzman Phil M. (San Jose CA) Murdoch Steven C. (Palo Alto CA) Wang Cheng (San Jose CA) Stenholm Mark A. (San Jose CA) Howard James (San Jose CA) Hall Leonard (San Jo, Dual cassette load lock.
    상세보기
  8. Bergman Eric J. (120 Midale Kalispell MT 59901), Dynamic semiconductor wafer processing using homogeneous chemical vapors.
    상세보기
  9. Bergman Eric J. (Kalispell MT), Dynamic semiconductor wafer processing using homogeneous mixed acid vapors.
    상세보기
  10. Garric George (Perthes FRX) Lafond Andr (Nemours FRX), Fully automated and computerized conveyor based manufacturing line architectures adapted to pressurized sealable transpo.
    상세보기
  11. Ohsawa Tetsu (Sagamihara JPX), Heat treating apparatus.
    상세보기
  12. Chiba Yuji (Isehara JPX) Fujioka Hidehiko (Atsugi JPX) Mizusawa Nobutoshi (Yamato JPX) Kariya Takao (Hino JPX) Shimoda Isamu (Zama JPX), Mask cassette and mask cassette loading device.
    상세보기
  13. Giles Brian A. (Honeoye Falls NY) Schwab Frederick J. (Churchville NY), Method and apparatus for cleaning semiconductor wafers.
    상세보기
  14. Hassan Javathu K. (Hopewell Junction NY) Mack Alfred (Poughkeepsie NY) Wojtaszek Michael R. (Poughkeepsie NY), Method and apparatus for handling workpieces.
    상세보기
  15. Asano Takanobu (Yokohama JPX) Iwai Hiroyuki (Sagamihara JPX) Ono Yuji (Sagamihara JPX), Method of loading and unloading wafer boat.
    상세보기
  16. Bayne Christopher J. (Lightwater GB2), Methods of and apparatus for transferring articles between carrier members.
    상세보기
  17. Bergman Eric J. (Kalispell MT) Reardon Timothy J. (Kalispell MT) Thompson Raymon F. (Lakeside MT) Owczarz Aleksander (Kalispell MT), Multi-station semiconductor processor with volatilization.
    상세보기
  18. Reardon Timothy J. (Kalispell MT) Meuchel Craig P. (Kalispell MT) Oberlitner Thomas H. (Kalispell MT), Semiconductor processing spray coating apparatus.
    상세보기
  19. Thompson Raymon F. (Kalispell MT) Berner Robert W. (Kalispell MT) Curtis Gary L. (Kalispell MT) Culliton Stephen P. (Bozeman MT) Wright Blaine G. (Kalispell MT) Byle Darryl S. (Kalispell MT) Pedersen, Semiconductor processing system with wafer container docking and loading station.
    상세보기
  20. Thompson Raymon F. (Kalispell MT) Berner Robert W. (Kalispell MT) Curtis Gary L. (Kalispell MT) Culliton Stephen P. (Bozeman MT) Wright Blaine G. (Kalispell MT), Semiconductor processing systems.
    상세보기
  21. Bergman Eric J. (Kalispell MT) Reardon Timothy J. (Kalispell MT) Thompson Raymon F. (Lakeside MT) Owczarz Aleksander (Kalispell MT), Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization.
    상세보기
  22. Thompson Raymon F. (Kalispell MT) Owczarz Aleksander (Kalispell MT), Semiconductor processor with extendible receiver for handling multiple discrete wafers without wafer carriers.
    상세보기
  23. Thompson Raymon F. (Lakeside MT) Berner Robert W. (Kalispell MT) Curtis Gary L. (Kila MT) Culliton Stephen P. (Kalispell MT) Wright Blaine G. (Whitefish MT), Semiconductor wafer processing system.
    상세보기
  24. Thompson Raymon F. (Kalispell MT) Gordon Robert W. (Seattle WA) Durado Daniel (Kalispell MT), Single wafer processor.
    상세보기
  25. Thompson Raymon F. (Kalispell MT) Owczarz Aleksander (Kalispell MT), Single wafer processor apparatus.
    상세보기
  26. Tateyama Kiyohisa (Kumamoto JPX) Hasebe Keizo (Kofu JPX), System and method for applying a liquid.
    상세보기
  27. Olbrich Herbert (Rutesheim DEX) Gentischer Joseph (Remshalden DEX) Fruhauf Wolfgang (Gerlingen DEX) Dorner Johann (Deizizau DEX) Breitschwerdt Gnther (Stuttgart DEX) Kunze-Concewitz Horst (Wiernsheim, System for manufacturing semiconductor substrates.
    상세보기
  28. Nishi Hironobu (Sagamihara JPX), Vertical heat-treating apparatus.
    상세보기
  29. Asano Takanobu (Yokohama JPX) Kitayama Hirofumi (Aikawa JPX) Iwai Hiroyuki (Sagamihara JPX) Ono Yuuji (Sagamihara JPX), Vertical heat-treatment apparatus having a wafer transfer mechanism.
    상세보기
  30. Thompson Steven R. (Somers MT) LaBere Rikki S. (Kalispell MT), Wafer transfer apparatus.
    상세보기
  31. Hertel Richard J. (Bradford MA) MacIntosh Edward D. (Gloucester MA), Wafer transfer system.
    상세보기
  32. Asano Takanobu (Yokohama JPX), Wafers transfer device.
    상세보기
  33. Kamikawa Yuuji (Uto JPX) Kuroda Kouki (Kurume JPX) Honda Yoshiyuki (Kumamoto JPX) Mukai Eiichi (Kurume JPX) Nishi Mitsuo (Kurume JPX), Washing system.
    상세보기

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  1. Yokomizo,Kenji, Apparatus and method of securing a workpiece during high-pressure processing.
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  2. Hwang, Hyun Joo; Kim, Seung Hwan, Apparatus for recognizing working position of device transfer system in semiconductor device test handler and method thereof.
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  3. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of a workpiece.
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  4. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of multiple workpieces.
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  5. Hirakida, Jyunichi, Chamber apparatus and processing system.
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  6. Lavitsky, Ilya; Rosenstein, Michael, Cleanroom lift having an articulated arm.
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  7. Abe, Hiroshi; Iida, Joji, Compact bank note dispensing device to prevent duplication releases.
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  8. Vermeer, Adrianus Johannes Petrus Maria; van De Ven, J. T. A, Component placement apparatus, component feeding apparatus and method.
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  9. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.
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  10. Pellegrin,Yvon; Giral,Claude, Device for loading and unloading silicon wafers in an oven from a multiple-cassette station.
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  11. Landau,Uziel, Electro-chemical deposition system and method of electroplating on substrates.
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  12. Chih Hung,Hsieh, Electronic component handling and testing apparatus and method for electronic component handling and testing.
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  14. Sutton, Thomas R.; Biberger, Maximilan A., High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism.
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  15. Jones, William D., High pressure fourier transform infrared cell.
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  16. Biberger, Maximilian A.; Layman, Frederick Paul; Sutton, Thomas Robert, High pressure processing chamber for semiconductor substrate.
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  17. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.
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  18. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
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  19. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
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  20. Gilbertson, Seth; Weber, Jeff; Wilson, Robert, Kinematic design for robotic arm.
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  21. Chen,B. Michelle; Shin,Ho Seon; Dordi,Yezdi; Morad,Ratson; Cheung,Robin, Method and apparatus for annealing copper films.
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  22. Sheydayi,Alexei, Method and apparatus for clamping a substrate in a high pressure processing system.
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  23. Morad, Ratson; Shin, Ho Seon; Cheung, Robin; Kogan, Igor, Method and apparatus for heating and cooling substrates.
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  24. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.
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  25. Hey, Peter; Kwak, Byung-Sung Leo, Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio.
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  26. Flitsch, Frederick A., Method and apparatus to support process tool modules in a cleanspace fabricator.
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  27. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.
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  28. Parent,Wayne M., Method and system for determining flow conditions in a high pressure processing system.
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  29. Parent, Wayne M.; Geshell, Dan R., Method and system for passivating a processing chamber.
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  30. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.
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  31. Zheng, Bo; Bajaj, Rajeev; Wang, Zhonghui Alex, Method for regulating the electrical power applied to a substrate during an immersion process.
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  32. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.
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  34. Zheng, Bo; Wang, Hougong; Dixit, Girish; Chen, Fusen, Method of application of electrical biasing to enhance metal deposition.
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  35. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.
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  37. Sheydayi,Alexei, Non-contact shuttle valve for flow diversion in high pressure systems.
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