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Apparatus for dissipating heat from a circuit board having a multilevel surface 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0495164 (2000-01-31)
발명자 / 주소
  • Gonsalves Daniel D.
  • Antonuccio Robert S.
  • Carney James M.
  • Montagna Joseph J.
출원인 / 주소
  • Sun Microsystems, Inc.
대리인 / 주소
    Kudirka & Jobse, LLP
인용정보 피인용 횟수 : 115  인용 특허 : 17

초록 ▼

For a circuit board populated with numerous components having different heights, the need for numerous individual heatsinks to accommodate the circuit board's multilevel surface is eliminated. Instead, heat is transferred to a single integral heatsink via a thermal-conductive material (i.e., a therm

대표청구항 ▼

[What is claimed is:] [1.]a single integral heat dissipating member;thermal-conductive resilient, gap filling material sandwiched between the heat dissipating member and the multilevel surface; anda fastener which secures the heat dissipating member with the circuit board, the fastener compressing t

이 특허에 인용된 특허 (17)

  1. McIntyre Gerald L., Adjustable-pressure mount heatsink system.
    상세보기
  2. Berenholz Jack (Lexington MA) Bowman John K. (Brighton MA), Air cooled heat exchanger for multi-chip assemblies.
    상세보기
  3. Corbin ; Jr. John Saunders ; Ramirez Ciro Neal, Apparatus for attaching heatsinks.
    상세보기
  4. Freeland Mark, Bonding material and phase change material system for heat burst dissipation.
    상세보기
  5. Heilbronner Heinrich (Stein DEX) Tursky Werner (Schwabach DEX) Goebl Christian (Nrnberg DEX) Frank Thomas (Nrnberg DEX), Circuit arrangement with a cooling member.
    상세보기
  6. Yamamoto Haruhiko (Yokohama JPX) Suzuki Masahiro (Tokyo JPX) Udagawa Yoshiaki (Tokyo JPX) Nakata Mitsuhiko (Kawasaki JPX) Katsuyama Koji (Yokohama JPX) Ono Izumi (Hachioji JPX) Kikuchi Shunichi (Yoko, Cooling system for an electronic circuit device.
    상세보기
  7. Kirby Peter L. (Newcastle Upon Tyne GB2), Electrical assembly.
    상세보기
  8. Wheaton Chris, Electromagnetic interference shielding enclosure and heat sink with compression coupling mechanism.
    상세보기
  9. Alcoe David James ; Sathe Sanjeev Balwant, Electronic package with compressible heatsink structure.
    상세보기
  10. Xie Hong, Heat pipe lid for electronic packages.
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    상세보기
  12. Saaski Elric (Kirkland WA) Hannemann Robert J. (Wellesley MA) Fox Leslie R. (Acton MA), Integral heat pipe module.
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  14. Saneinejad Mohsen ; Kim David K. J. ; Waters Mark H., Pressure compliantly protected heatsink for an electronic device.
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  15. Patel Chandrakant (Fremont CA) Obermaier Hannsjrg (Los Gotos CA), Spring-biased heat sink assembly for a plurality of integrated circuits on a substrate.
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  16. Brunet Patrice (Courbevoie FRX) Avignon Gilles (Argenteuil FRX) Heron Franck (Antony FRX), System for dissipating heat energy generated by an electronic component and sealed enclosure used in a system of this ki.
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  17. Hanrahan James R., Thermally conductive polytrafluoroethylene article.
    상세보기

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