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Fiber optic transmitter and receiver electrical elements are implemented on separate vertical boards in fiber optic modules. A single optical block implements lenses and reflecting surfaces to minimize manufacturing costs. In one embodiment the receiver and transmitter are mounted to receive and tra

Fiber optic transmitter and receiver electrical elements are implemented on separate vertical boards in fiber optic modules. A single optical block implements lenses and reflecting surfaces to minimize manufacturing costs. In one embodiment the receiver and transmitter are mounted to receive and transmit vertical boards respectively to nearly face each other but being offset to avoid optical cross talk. In a second embodiment, receiver and transmitter are mounted parallel with the printed circuit boards to save additional space. The vertical boards have ground planes to minimize electrical cross talk. A shielded housing provides further shielding for EMI. Manufacturing steps of the fiber optic transceiver are disclosed which provide reduced manufacturing costs.

대표청구항 ▼

[ What is claimed is:] [21.]21. A fiber optic transceiver for coupling photons between optoelectronic devices and optical fibers, the fiber optic transceiver comprising:a base having a first slot near one side, a second slot near an opposite side, a first plurality of pin holes near the one side and

[ What is claimed is:] [21.]21. A fiber optic transceiver for coupling photons between optoelectronic devices and optical fibers, the fiber optic transceiver comprising:a base having a first slot near one side, a second slot near an opposite side, a first plurality of pin holes near the one side and a second plurality of pin holes near the opposite side, the base to mount the fiber optic transceiver in a system to couple photons between optoelectronic devices and optical fibers;a first printed circuit board (PCB) inserted into the first slot substantially perpendicular to the base, the first PCB having a plurality of pins inserted into the first plurality of pin holes and a first optoelectronic device, photons to be coupled between the first optoelectronic device and a first optical fiber, the first optoelectronic device having terminals coupled to the first PCB;a second PCB inserted into the second slot substantially perpendicular to the base, the second PCB having a second plurality of pins inserted into the second plurality of pin holes and a second optoelectronic device, photons to be coupled between the second optoelectronic device and a second optical fiber, the second optoelectronic device having terminals coupled to the second PCB; anda shielded housing coupled to the base, the shielded housing to encase the first PCB and the second PCB to reduce electromagnetic interference (EMI).