초록 ▼

A plastic card, such as a radio frequency identification card, including at least one electronic element embedded therein and a hot lamination process for the manufacture of radio frequency identification cards and other plastic cards including a micro-chip embedded therein. The process results in a

A plastic card, such as a radio frequency identification card, including at least one electronic element embedded therein and a hot lamination process for the manufacture of radio frequency identification cards and other plastic cards including a micro-chip embedded therein. The process results in a card having an overall thickness in the range of 0.028 inches to 0.032 inches with a surface suitable for receiving dye sublimation printing--the variation in card thickness across the surface is less than 0.0005 inches. A card manufactured in accordance with the present invention also complies with all industry standards and specifications. Also, the hot lamination process of the present invention results in an aesthetically pleasing card. The invention also relates to a plastic card formed in accordance with the hot lamination process of the present invention.

대표청구항 ▼

[ What is claimed is:] [1.]1. A process for incorporating at least one electronic element in the manufacture of a plastic card, comprising the steps of:(a) providing first and second plastic core sheets;(b) positioning said at least one electronic element in the absence of a non-electronic carrier d

[ What is claimed is:] [1.]1. A process for incorporating at least one electronic element in the manufacture of a plastic card, comprising the steps of:(a) providing first and second plastic core sheets;(b) positioning said at least one electronic element in the absence of a non-electronic carrier directly between said first and second plastic core sheets to form a core, said plastic core sheets defining a pair of inner and outer surfaces of said core;(c) positioning said core in a laminator apparatus, and subjecting said core to a heat and pressure cycle, said heat and pressure cycle comprising the steps of:(i) heating said core for a first period of time;(ii) applying a first pressure to said core for a second period of time such that said at least one electronic element is encapsulated by said core;(iii) cooling said core while applying a second pressure to said core,(d) applying a layer of overlaminate film to at least one of said outer surfaces of said core.