초록 ▼

Method and apparatus for testing integrated circuits at controlled temperatures in a low thermal mass environment. The test system uses heat transfer elements such as Peltier devices inside the test head area to transfer thermal energy from one surface to another. The use of Peltier devices and the

Method and apparatus for testing integrated circuits at controlled temperatures in a low thermal mass environment. The test system uses heat transfer elements such as Peltier devices inside the test head area to transfer thermal energy from one surface to another. The use of Peltier devices and the very low thermal mass of the combined test head and device under test (DUT), allow for fast and accurate temperature reduction of the DUT leads without using liquid Nitrogen. One embodiment of the test system is particulary suitable for low temperature testing of electronic devices that include magnetic sensitive elements such as Hall effect devices.

대표청구항 ▼

[ What is claimed is:] [1.]1. A temperature-controlled testing system comprising:a conveyor mechanism configured to carry a device to be tested;a first temperature control zone adapted to receive the device on the conveyor mechanism, and configured to bring the device to a first temperature;a second

[ What is claimed is:] [1.]1. A temperature-controlled testing system comprising:a conveyor mechanism configured to carry a device to be tested;a first temperature control zone adapted to receive the device on the conveyor mechanism, and configured to bring the device to a first temperature;a second temperature control zone adjacent to the first temperature control zone and adapted to receive the device on the conveyor mechanism, the second temperature control zone including at least one heat transfer element as a heat exchanger to bring the device to a second temperature; anda test zone adjacent to the second temperature control zone, the test zone including a test head arrangement configured to receive the device to be tested and to hold the device to be tested in a known fixed position relative to the test head arrangement, wherein the test head arrangement includes contact means configured to make electrical contact to a plurality of leads of the device to be tested, the test zone further including heat transfer elements attached to the test head arrangement which bring the temperature of the contact means to substantially the second temperature.