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Method and apparatus for drying washed objects 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F26B-003/00
출원번호 US-0291860 (1999-04-14)
우선권정보 JP0100268 (1999-04-07)
발명자 / 주소
  • Tanaka Akinori,JPX
  • Okano Shoichi,JPX
  • Maki Isao,JPX
출원인 / 주소
  • Kaijo Corporation, JPX
대리인 / 주소
    Lerner, David, Littenberg, Krumholz & Mentlik, LLP
인용정보 피인용 횟수 : 52  인용 특허 : 10

초록

A drying apparatus for washed objects is capable of drying the objects in a reduced period of time, effectively preventing contamination of the objects during drying thereof, and attaining energy saving and a reduction in consumption of chemicals used. Mist of an organic solvent is generated by mean

대표청구항

[ What is claimed is:] [1.]1. A drying method for washed objects, comprising the steps of:rinsing the objects which are immersed in water in a water tank;generating mist of an organic solvent at a temperature of from about 20.degree. C. to about 50.degree. C. in an organic solvent mist generating ta

이 특허에 인용된 특허 (10)

  1. McConnell Christopher F. (West Chester PA) Walter Alan E. (Exton PA), Apparatus for rinsing and drying surfaces.
  2. Fujikawa Kazonori (Shiga JPX) Tanaka Masato (Shiga JPX) Muraoka Yusuke (Kyoto JPX), Device for rinsing and drying substrate.
  3. Ferrell Gary W. (608 Terrace Ave. Half Moon Bay CA 94019), Method and apparatus for drying objects using aerosols.
  4. Ferrell Gary W. (608 Terrace Ave. Half Moon Bay CA 94019), Method and apparatus for drying parts and microelectronic components using sonic created mist.
  5. Mohindra Raj (Los Altos Hills CA) Bhushan Abhay (Palo Alto CA) Bhushan Rajiv (Mountain View CA) Puri Suraj (Los Altos CA) Anderson John H. (Milpitas CA) Nowell Jeffrey (San Francisco CA), Method for cleaning and drying a semiconductor wafer.
  6. Schwenkler Robert S., Method for precision cleaning and drying surfaces.
  7. Schwenkler Robert S., Method for the precision cleaning and drying surfaces.
  8. Leenaars Adriaan F. M. (Eindhoven NLX), Method of removing undesired particles from a surface of a substrate.
  9. McConnell Christopher F. (West Chester PA) Walter Alan E. (Exton PA), Process and apparatus for drying surfaces.
  10. Mohindra Raj (Los Altos Hills CA) Bhushan Abhay (Palo Alto CA) Bhushan Rajiv (Mountain View CA) Puri Suraj (Los Altos CA) Anderson ; Sr. John H. (Milpitas CA) Nowell Jeffrey (San Francisco CA), Ultra-low particle semiconductor method.

이 특허를 인용한 특허 (52)

  1. Yokomizo,Kenji, Apparatus and method of securing a workpiece during high-pressure processing.
  2. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of a workpiece.
  3. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of multiple workpieces.
  4. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.
  5. Arena Foster,Chantal J.; Awtrey,Allan Wendell; Ryza,Nicholas Alan; Schilling,Paul, Developing photoresist with supercritical fluid and developer.
  6. Arena-Foster, Chantal J.; Awtrey, Allan Wendell; Ryza, Nicholas Alan; Schilling, Paul, Developing photoresist with supercritical fluid and developer.
  7. Hajime Onoda JP; Kazutoshi Watanabe JP; Hiroki Takahashi JP, Drying apparatus and drying method.
  8. Arena-Foster, Chantal J.; Awtrey, Allan Wendell; Ryza, Nicholas Alan; Schilling, Paul, Drying resist with a solvent bath and supercritical CO2.
  9. Sheydayi,Alexei; Sutton,Thomas, Gate valve for plus-atmospheric pressure semiconductor process vessels.
  10. Aoki, Shigeki; Sakai, Yuichi; Yamashita, Mitsuo; Shinya, Hiroshi, Heat processing apparatus and heat processing method.
  11. Aoki, Shigeki; Sakai, Yuichi; Yamashita, Mitsuo; Shinya, Hiroshi, Heat processing apparatus and heat processing method.
  12. Sutton, Thomas R.; Biberger, Maximilan A., High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism.
  13. Jones, William D., High pressure fourier transform infrared cell.
  14. Biberger, Maximilian A.; Layman, Frederick Paul; Sutton, Thomas Robert, High pressure processing chamber for semiconductor substrate.
  15. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.
  16. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  17. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  18. Sheydayi,Alexei, Method and apparatus for clamping a substrate in a high pressure processing system.
  19. Jih-Churng Twu TW; Ming-Dar Guo TW; Yu-Chien Hsiao TW; Chia-Chun Cheng TW, Method and apparatus for drying wafers after wet bench.
  20. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.
  21. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.
  22. Parent,Wayne M., Method and system for determining flow conditions in a high pressure processing system.
  23. Parent, Wayne M.; Geshell, Dan R., Method and system for passivating a processing chamber.
  24. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.
  25. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.
  26. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method for supercritical processing of multiple workpieces.
  27. Biberger, Maximilian A.; Schilling, Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  28. Biberger,Maximilian A.; Schilling,Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  29. Hillman,Joseph, Method of inhibiting copper corrosion during supercritical COcleaning.
  30. Toma,Dorel Ioan; Schilling,Paul, Method of passivating of low dielectric materials in wafer processing.
  31. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.
  32. Schilling,Paul, Method of treating a composite spin-on glass/anti-reflective material prior to cleaning.
  33. Schilling,Paul, Method of treatment of porous dielectric films to reduce damage during cleaning.
  34. Sheydayi,Alexei, Non-contact shuttle valve for flow diversion in high pressure systems.
  35. Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.
  36. Wuester,Christopher D., Process flow thermocouple.
  37. Mullee,William H.; de Leeuwe,Marc; Roberson, Jr.,Glenn A.; Palmer,Bentley J., Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process.
  38. Bertram, Ronald Thomas; Scott, Douglas Michael, Removal of contaminants from a fluid.
  39. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  40. Nam, Chang-Hyeon; Lee, Seung-Kun, Substrate dryer and a drying method.
  41. Gouk, Roman; Chen, Han-Wen; Verhaverbeke, Steven; Delmas, Jean, Substrate support and baffle apparatus.
  42. Fovell, Richard; Brillhart, Paul; Yi, Sang In; Khan, Anisul H.; Dinev, Jivko; Nevil, Shane, Substrate support temperature control.
  43. Kimura, Masahiro; Takahashi, Hiroaki; Maegawa, Tadashi; Hayashi, Toyohide, Substrate treating method.
  44. Hayashi, Toyohide, Substrate treating method for treating substrates with treating liquids.
  45. Hayashi, Toyohide, Substrate treating method for treating substrates with treating liquids.
  46. Heiko D Moritz ; Jonathan A. Talbott ; Mohan Chandra ; James A. Tseronis ; Ijaz Jafri, Supercritical fluid drying system and method of use.
  47. Gale,Glenn; Hillman,Joseph T.; Jacobson,Gunilla; Palmer,Bentley, System and method for processing a substrate using supercritical carbon dioxide processing.
  48. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
  49. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.
  50. Sakurai, Naoaki; Fujita, Hiroshi, Ultrasonic-wave washing unit, ultrasonic-wave washing apparatus, ultrasonic-wave washing method, method of manufacturing a semiconductor device, and method of manufacturing a liquid crystal display.
  51. Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.
  52. Ferrell,Gary W.; Ratra,Jagjit S., Wafer dryer and method for drying a wafer.
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