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Planarization of non-planar surfaces in device fabrication 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/311
출원번호 US-0177019 (1998-10-22)
발명자 / 주소
  • Marsh Eugene P.
출원인 / 주소
  • Micron Technology, Inc.
대리인 / 주소
    Trask Britt
인용정보 피인용 횟수 : 147  인용 특허 : 40

초록 ▼

A method of planarizing a surface of a wafer includes providing a planarization material on the wafer surface and bringing a substantially flat surface into contact with the planarization material on the wafer. The planarization material is exposed to radiation at a first wavelength to cure the plan

대표청구항 ▼

[ What is claimed is:] [1.]1. A method of planarizing a surface of a wafer, the method comprising:providing a planarization material on the wafer surface;bringing a substantially flat surface into contact with the planarization material on the wafer surface;exposing the planarization material to rad

이 특허에 인용된 특허 (40)

  1. Choinski Edward J. (Wayland MA), Apparatus and method for temporarily sealing holes in printed circuit boards.
    상세보기
  2. Kishii Sadahiro (Kawasaki JPX) Arimoto Yoshihiro (Kawasaki JPX), Apparatus and method for uniformly polishing a wafer.
    상세보기
  3. Inselmann Jrgen (Lhne DEX), Apparatus for bonding textile sheet-like structures.
    상세보기
  4. Shendon Norman (San Carlos CA), Chemical mechanical polishing apparatus with improved carrier and method of use.
    상세보기
  5. Shimomura Mariko (Yokohama JPX) Miyashita Naoto (Yokohama JPX) Ohashi Hiroyuki (Kamakura JPX), Chemical-mechanical polishing (CMP) method for controlling polishing rate using ionized water, and CMP apparatus.
    상세보기
  6. Chen Lai-Juh (Hsin-Chu TWX), Chemical/mechanical polish (CMP) thickness monitor.
    상세보기
  7. Bunch Jesse C. (Silver Spring MD), Cube press.
    상세보기
  8. Prybyla Judith Ann ; Taylor Gary Newton, Device fabrication involving planarization.
    상세보기
  9. Weling Milind G. (San Jose CA) Bothra Subhas (San Jose CA) Gabriel Calvin T. (Cupertino CA), Dummy underlayers for improvement in removal rate consistency during chemical mechanical polishing.
    상세보기
  10. Miyashita Akimi (Toride JPX) Fujii Mutsumasa (Ibaraki-ken JPX) Mishina Haruo (Ushiku JPX), Hot press with pressure vessels to uniformly distribute pressure to the work piece.
    상세보기
  11. Sandhu Gurtej S. (Boise ID) Yu Chris C. (Austin TX), IC chemical mechanical planarization process incorporating slurry temperature control.
    상세보기
  12. Lee Ruojia (Boise ID) Gonzalez Fernando (Boise ID), Insulated-gate vertical field-effect transistor with high current drive and minimum overlap capacitance.
    상세보기
  13. Lee Ruojia (Boise ID) Gonzalez Fernando (Boise ID), Insulated-gate vertical field-effect transistor with high current drive and minimum overlap capacitance.
    상세보기
  14. Yu Chris C. (Boise ID) Sandhu Gurtej S. (Boise ID) Doan Trung T. (Boise ID), Integrated circuit polishing method.
    상세보기
  15. Chou Richard Tien-Hua (Wilmington DE), Ionomers based on copolymers of ethylene with both mono-and dicarboxylic acids.
    상세보기
  16. Tuttle Mark E. (Boise ID) Doan Trung T. (Boise ID) Fox Angus C. (Boise ID) Sandhu Gurtej S. (Boise ID) Stroupe Hugh E. (Boise ID), Method and apparatus for improving planarity of chemical-mechanical planarization operations.
    상세보기
  17. Hamamura Fumio (Kanagawa JPX) Oka Yukio (Yamaguchi JPX), Method and apparatus for pressure sticking a thin film to a base plate.
    상세보기
  18. Reavill Joseph A. (Mira Loma CA) Arachi John M. (Riverside CA), Method and apparatus for vacuum lamination of flex circuits.
    상세보기
  19. Tsunoda Kazuyoshi (Yuki JPX) Tonoki Kenji (Yuki JPX) Yokono Haruki (Yuki JPX) Kono Hisao (Yuki JPX) Yokoyama Ryoji (Musashino JPX) Kobayashi Kazuo (Shimodate JPX), Method and device for manufacturing a laminated material.
    상세보기
  20. Paranjpe Ajit P. (Plano TX), Method for planarization.
    상세보기
  21. Kim Sung C. (Boise ID) Meikle Scott (Boise ID), Method for shaping features of a semiconductor structure using chemical mechanical planarization (CMP).
    상세보기
  22. Hayashi Yoshihiro (Tokyo JPX), Method of flattening the surface of a semiconductor device by polishing.
    상세보기
  23. Blalock Guy (Boise ID) Wald Phillip G. (Boise ID), Method of forming a stacked capacitor with striated electrode.
    상세보기
  24. Tola Jeffry (Morrison IL), Method of making diaphragm-type pressure transducers.
    상세보기
  25. Matsuda Tetsuo (Poughkeepsie NY) Okumura Katsuya (Poughkeepsie NY), Method of planarizing a semiconductor workpiece surface.
    상세보기
  26. Schwarzbauer Herbert (Munich DEX), Method of securing electronic components to a substrate.
    상세보기
  27. Doan Trung T. (Boise ID) Yu Chris C. (Boise ID), Multiple step method of chemical-mechanical polishing which minimizes dishing.
    상세보기
  28. Kudo Takanori (Sayama JPX) Masuda Seiya (Tokorozawa JPX) Kinoshita Yoshiaki (Tokyo JPX) Przybilla Klaus (Frankfurt DEX) Endo Natsumi (Kawagoe JPX) Suehiro Natsumi (Kawagoe JPX) Okazaki Hiroshi (Kawag, Pattern forming material including photoacid and photobase generators for large exposure latitude.
    상세보기
  29. Stroupe Hugh (Boise ID) Sharan Sujit (Boise ID) Sandhu Gurtej S. (Boise ID), Polishing apparatus, a polishing wafer carrier apparatus, a replacable component for a particular polishing apparatus an.
    상세보기
  30. Katakabe Ichiro (Kanagawa-ken JPX) Miyashita Naoto (Kanagawa-ken JPX) Akiyama Tatsuo (Tokyo JPX), Polishing method and apparatus for detecting a polishing end point of a semiconductor wafer.
    상세보기
  31. Robinson Karl M. (Boise ID), Polishing pad and a method for making a polishing pad with covalently bonded particles.
    상세보기
  32. Talieh Homayoun (San Jose CA) Weldon David E. (Los Gatos CA), Polishing pad cluster for polishing a semiconductor wafer.
    상세보기
  33. Karlsrud Chris (Chandler AZ), Polishing pad conditioning.
    상세보기
  34. Winkle Mark Robert (Lansdale PA), Positive acting photoresist comprising a photoacid, a photobase and a film forming acid-hardening resin system.
    상세보기
  35. Namysl Edmond (1907 Frederick Placentia CA 92670), Printed circuit board laminating machine.
    상세보기
  36. Jacob Adir (23 Juniper La. Framingham MA 01701), Process for dry sterilization of medical devices and materials.
    상세보기
  37. Blalock Guy (Boise ID) Wald Phillip G. (Boise ID), Stacked capacitor construction.
    상세보기
  38. Iijima Nobuo (Kawasaki JPX) Hayashida Akihisa (Kawasaki JPX), Tape-on-wafer mounting apparatus and method.
    상세보기
  39. Pasch Nicholas F. (Pacifica CA) Mallon Thomas G. (Santa Clara CA) Franklin Mark A. (Scott\s Valley CA), Techniques for assembling polishing pads for chemi-mechanical polishing of silicon wafers.
    상세보기
  40. Clover Richmond B. (1199 W. Vanderbilt Ct. Sunnyvale CA 94087), Vertically stacked planarization machine.
    상세보기

이 특허를 인용한 특허 (147)

  1. GanapathiSubramanian,Mahadevan; Sreenivasan,Sldlgata V., Adaptive shape substrate support method.
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  7. Ramarajan, Suresh, Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces.
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  10. Agarwal,Vishnu K., Apparatuses and methods for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies.
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  14. McCutcheon, Jeremy; Lamb, III, James E., Automated process and apparatus for planarization of topographical surfaces.
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  20. Chandrasekaran,Nagasubramaniyan, Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces.
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  21. Elledge,Jason B., Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces.
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  23. Cherala, Anshuman; Choi, Byung Jin; Lad, Pankaj B.; Shackleton, Steven C., Chucking system comprising an array of fluid chambers.
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