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A power electronics chassis (10) and liquid-cooled heat sink mounting assembly for electric vehicles and other applications that use liquid coolant to cool power electronic devices (20) contained within an electrically conductive housing (12). The power electronics chassis (10) includes an inverter

A power electronics chassis (10) and liquid-cooled heat sink mounting assembly for electric vehicles and other applications that use liquid coolant to cool power electronic devices (20) contained within an electrically conductive housing (12). The power electronics chassis (10) includes an inverter (18) containing power switching devices (20) that are heat sunk using the liquid-cooled mounting assembly. The mounting assembly includes a heat exchanger (22) and a plastic, electrically non-conductive coolant manifold (16) that has an inlet (26) and outlet (28) for passage of liquid coolant into and out of the electronics housing (12). The power switching devices (20) are attached to a mounting surface (40) of the heat exchanger (22) and are thermally coupled to the coolant within the heat exchanger (22) via the mounting surface (40). The inlet (26) and outlet (28) of the plastic coolant manifold (16) are connected to the heat exchanger (22) by conduits (30,32) to thereby permit circulation of liquid coolant into the chassis housing (12), through the heat exchanger (22), and back out of the chassis housing (12) while maintaining electrical isolation between the liquid coolant and chassis housing (12). This configuration significantly reduces the radiated EMI by significantly reducing the parasitic capacitance between the switching devices (20) and chassis housing (12).

대표청구항 ▼

[ We claim:] [1.]1. A liquid cooled mounting assembly for heat sinking one or more power switching devices within an electrically conductive electronics housing, said mounting assembly comprising:a heat exchanger having a mounting surface and an internal space for containing a volume of liquid coola

[ We claim:] [1.]1. A liquid cooled mounting assembly for heat sinking one or more power switching devices within an electrically conductive electronics housing, said mounting assembly comprising:a heat exchanger having a mounting surface and an internal space for containing a volume of liquid coolant within said heat exchanger, said internal space being defined at least in part by a wall having an inner surface that is thermally coupled to said mounting surface, whereby heat received by said heat exchanger at said mounting surface can be conducted to said internal space;at least one power switching device supported by and thermally coupled to said mounting surface of said heat exchanger, whereby heat generated by said power switching device is thermally coupled to said internal space within said heat exchanger; andan electrically non-conductive coolant manifold coupled to said heat exchanger, said coolant manifold having an inlet and outlet for passage of liquid coolant into and out of the electrically conductive electronics housing, said inlet and outlet being in fluidic communication with said internal space of said heat exchanger, whereby said coolant manifold permits circulation of liquid coolant into the conductive electronics housing, through said heat exchanger, and back out of the electronics housing while maintaining electrical isolation between the liquid coolant and electronics housing.