초록 ▼

A segmented die assembly comprises a plurality of side-by-side and separate units. Each die unit, includes a manifold segment and a die module mounted thereon. The manifold segments are interconnected and function to deliver process air and polymer melt to the modules. Each module including a nozzle

A segmented die assembly comprises a plurality of side-by-side and separate units. Each die unit, includes a manifold segment and a die module mounted thereon. The manifold segments are interconnected and function to deliver process air and polymer melt to the modules. Each module including a nozzle through which the polymer melt is extruded forming a row of filament(s). The filaments from the array of modules are deposited on a substrate or collector. The die assembly is preferably used to apply a hot melt adhesive to a substrate, but also may be used to produce meltblown webs.

대표청구항 ▼

[ What is claimed is:] [1.]1. A segmented die assembly, comprising:(a) a plurality of manifold segments, each manifold segment having a polymer flow passage and an air flow passage formed therein; said manifold segments being interconnected in side-by-side relationship wherein said air passages and

[ What is claimed is:] [1.]1. A segmented die assembly, comprising:(a) a plurality of manifold segments, each manifold segment having a polymer flow passage and an air flow passage formed therein; said manifold segments being interconnected in side-by-side relationship wherein said air passages and polymer passages are in fluid communication, respectively;(b) a die module mounted on each manifold segment, said die module comprising a die body having a polymer flow passage and an air flow passage in fluid communication with said polymer flow passage and said air flow passage of its associated manifold segment, respectively; and a die tip or nozzle mounted on said die body and having a polymer flow passage in fluid communication with said polymer flow passage of its associated die body for receiving the polymer melt and discharging a filament or filaments therefrom;(c) means for delivering a polymer melt to at least one manifold segment whereby the melt is distributed through said other interconnected manifold segments and flows through each die module discharging as a filament or filaments from each die tip or nozzle; and(d) means for delivering air to at least one manifold segment whereby air is distributed in said interconnected manifold segments and flows through each die module discharging through said die tip or nozzle.