초록 ▼

A thermosyphon system is employed in conjunction with compact and/or dense configurations of electrical and/or electronic components to provide cooling. The thermosyphon cooling system is particularly advantageous in those systems in which the compact arrangement of circuit modules precludes the use

A thermosyphon system is employed in conjunction with compact and/or dense configurations of electrical and/or electronic components to provide cooling. The thermosyphon cooling system is particularly advantageous in those systems in which the compact arrangement of circuit modules precludes the use of direct air cooling. The thermosyphon cooling system repositions the air cooling aspect of its cooling function to an exterior cabinet location distant from the circuit modules which can therefore be placed more closely together to shorten signal paths.

대표청구항 ▼

[ The invention claimed is:] [1.]1. A cooling system for electrical or electronic equipment, said cooling system comprising:a single substantially flat, sealable evaporator comprising:a lower inlet port disposed on a lower portion thereof and an upper outlet port disposed on an upper portion thereof

[ The invention claimed is:] [1.]1. A cooling system for electrical or electronic equipment, said cooling system comprising:a single substantially flat, sealable evaporator comprising:a lower inlet port disposed on a lower portion thereof and an upper outlet port disposed on an upper portion thereof;a thermally conductive outer surface;a first internal conduit extending substantially upwardly from said lower inlet port;a second internal conduit extending substantially downwardly from said upper outlet port;a plurality of substantially horizontally oriented evaporation chambers having connections so that said chambers are connected to said internal conduits in flow communication between said first conduit on a first side of said evaporator and said second conduit on an opposite second side of said evaporator and wherein said connections to said conduits are such that the connection to said first conduit is below the connection to said second conduit;a condenser disposed above said evaporator;a vapor line extending from said upper outlet port of said upper portion of said evaporator to an upper portion of said condenser; anda condensate line extending from said lower inlet port of said lower portion of said evaporator to a lower portion of said condenser, wherein when a coolant is placed in said cooling system, said coolant as liquid is convertible to vapor in said evaporator and introducible into said condenser where it returns as liquid and flows back to said evaporator in a closed loop, and wherein said coolant as liquid is flowable through said lower inlet port and upwardly through said first internal conduit and introducible to said evaporation chambers generally along said first side of said evaporator.