초록 ▼

A liquid material jetted from a nozzle is supplied onto a surface of the semiconductor substrate with use of an ink-jet mechanism comprising a liquid material receiving section, a driving section and a nozzle section. Since a film material (liquid material) is supplied by an ink-jet method, not only

A liquid material jetted from a nozzle is supplied onto a surface of the semiconductor substrate with use of an ink-jet mechanism comprising a liquid material receiving section, a driving section and a nozzle section. Since a film material (liquid material) is supplied by an ink-jet method, not only the film material only be supplied to a desired region of the semiconductor substrate surface and a supply to an unnecessary region is prevented, but also a variation of a film thickness comes not to be dependent on a pattern on the semiconductor substrate. Therefore, in forming a thin film on a semiconductor substrate, a thin film formation is realized so that utilization efficiency of a film material is increased with reduction in loss thereof and a variation of a thickness of the film formed is not influenced by a pattern on the semiconductor substrate.

대표청구항 ▼

[ What is claimed is:] [1.]1. A method for forming a thin film using an ink-jet mechanism comprising the steps of:disposing a surface of a semiconductor substrate in such a manner that the surface is opposed to a nozzle array of an ink-jet head having plural rows of plural nozzles; andforming a film

[ What is claimed is:] [1.]1. A method for forming a thin film using an ink-jet mechanism comprising the steps of:disposing a surface of a semiconductor substrate in such a manner that the surface is opposed to a nozzle array of an ink-jet head having plural rows of plural nozzles; andforming a film on the surface of the semiconductor substrate by jetting plural liquid materials from selected nozzles among the plural nozzles in plural rows, at least one of the liquid materials being a solvent for control of a viscosity of the film to be formed.