초록 ▼

Planarizing machines, carrier heads for planarizing machines and methods for planarizing microelectronic-device substrate assemblies in mechanical or chemical-mechanical planarizing processes. In one embodiment of the invention, a carrier head includes a backing plate, a bladder attached to the back

Planarizing machines, carrier heads for planarizing machines and methods for planarizing microelectronic-device substrate assemblies in mechanical or chemical-mechanical planarizing processes. In one embodiment of the invention, a carrier head includes a backing plate, a bladder attached to the backing plate, and a retaining ring extending around the backing plate. The backing plate has a perimeter edge, a first surface, and a second surface opposite the first surface. The second surface of the backing plate can have a perimeter region extending inwardly from the perimeter edge and an interior region extending inwardly from the perimeter region. The perimeter region, for example, can have a curved section extending inwardly from the perimeter edge of the backing plate or from a flat rim at the perimeter edge. The curved section can curve toward and/or away from the first surface to influence the edge pressure exerted against the substrate assembly during planarization. The second surface of the backing plate is a fixed, permanent surface. The backing plate can further include a permanent, low-friction coating over at least a portion of the perimeter region. The bladder is configured to extend over the second surface of the backing plate to form a fluid cell between the bladder and the second surface.

대표청구항 ▼

[ What is claimed is:] [28.]28. A planarizing machine for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, comprising:a support table;a polishing pad on the support table, the polishing pad having a planarizing surface configured to planarize a microele

[ What is claimed is:] [28.]28. A planarizing machine for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, comprising:a support table;a polishing pad on the support table, the polishing pad having a planarizing surface configured to planarize a microelectronic-device substrate assembly; anda carrier assembly having a drive assembly and a carrier head attached to the drive assembly, the drive assembly moving the carrier head with respect to the polishing pad, and the carrier head including a backing plate, a bladder attached to the backing plate, and a retaining ring extending around the backing plate and the bladder, the backing plate having a perimeter edge, a first surface, and a second surface opposite the first surface, the second surface having an interior region and a perimeter region, and a low-friction coating permanently affixed to at least a portion of the second surface, and the perimeter region having a fixed curved section extending toward or away from first surface, and the bladder being attached to the backing plate to extend over the second surface of the backing plate and form a fluid cell between the bladder and the second surface.