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Process for making microstructures and microstructures made thereby 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/44
  • H01L-021/48
  • H01L-021/00
  • H01L-021/36
  • H01L-021/46
출원번호 US-0204473 (1998-12-03)
발명자 / 주소
  • Lin Liwei
  • Cheng Yu-Ting
  • Najafi Khalil
  • Wise Kensall D.
출원인 / 주소
  • The Regents of the University of Michigan
대리인 / 주소
    Harness, Dickey & Pierce
인용정보 피인용 횟수 : 124  인용 특허 : 40

초록 ▼

A method for making a microstructure assembly, the method including the steps of providing a first substrate and a second substrate; depositing an electrically conductive material on the second substrate; contacting the second substrate carrying the electrically conductive material with the first su

대표청구항 ▼

[ What is claimed is:] [1.]1. A method for making a microstructure assembly, the method comprising the steps of:(i) providing a first substrate and a second substrate;(ii) depositing an electrically conductive material on the second substrate along a peripheral boundary line path of a predetermined

이 특허에 인용된 특허 (40)

  1. Wallis ; George, Application of field-assisted bonding to the mass production of silicon type pressure transducers.
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  2. Aine Harry E. (Rte. 4 ; Box 767 Sumrall MS 39482), Batch method of making miniature structures assembled in wafer form.
    상세보기
  3. Myers, Donald O., Bonding method adaptable for manufacturing capacitive pressure sensing elements.
    상세보기
  4. Cohen Robert C. ; Vargas Joseph R., Bonding of porous materials to other materials utilizing chemical vapor deposition.
    상세보기
  5. Suzuki Seiko (Hitachioota JPX) Tsuchitani Shigeki (Mito JPX) Miki Masayuki (Katsuta JPX) Matsumoto Masahiro (Hitachi JPX), Capacitance type accelerometer.
    상세보기
  6. Suzuki Seiko (Hitachioota JPX) Tsuchitani Shigeki (Mito JPX) Miki Masayuki (Katsuta JPX) Matsumoto Masahiro (Hitachi JPX), Capacitance type accelerometer.
    상세보기
  7. Ko Wen H. (Cleveland Hts. OH), Capacitive absolute pressure sensor and method.
    상세보기
  8. Schroeder Jon M. (4327 Estate Dr. Stockton CA 95209), Electronic component bonding tape.
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  9. Kurtz Anthony D. (Teaneck NJ) Ned Alexander A. (Bloomingdale NJ), Fusion bonding technique for use in fabricating semiconductor devices.
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  10. DiBattista Michael ; Patel Sanjay V. ; Gland John L. ; Schwank Johannes W., Hot stage for scanning probe microscope.
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  11. Gland John L. (Pinckney MI) Schwank Johannes W. (Ann Arbor MI) Wise Kensall D. (Ann Arbor MI), In-situ monitoring, and growth of thin films by means of selected area CVD.
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  12. Hirose Hisashi (Toyota JPX) Arai Hiroshi (Toyota JPX) Iiyama Hiroshi (Yokosuka JPX) Komiya Hirokazu (Tokyo JPX), Inclinometers.
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  13. Hwang Ming J. (Richardson TX) Dowell Harold J. (McKinney TX), Method and apparatus for performing microelectronic bonding using a laser.
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  14. Keller ; Hans W., Method for batch fabricating semiconductor devices.
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  15. Ohara Fumio (Okazaki JPX) Yoshihara Shinji (Nagoya JPX) Kanamori Katuhiko (Nukata-gun JPX) Kurahashi Takashi (Okazaki JPX), Method for manufacturing a semiconductor acceleration sensor device.
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  16. Kobori Shigeyuki (Hitachi JPX) Yamada Kazuji (Hitachi JPX) Kobayashi Ryoichi (Toukai JPX) Miyazaki Atsushi (Katsuta JPX) Suzuki Seikou (Hitachioota JPX), Method for manufacturing semiconductor absolute pressure sensor units.
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  17. Becker Rolf (Reutlingen DEX) Jaeckel Klaus (Reutlingen DEX) Marek Jiri (Reutlingen DEX) Bantien Frank (Ditzingen DEX) Baumann Helmut (Gomaringen DEX) Weiblen Kurt (Metzingen DEX) Willmann Martin (Reu, Method of assembling micromechanical sensors.
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  18. Dunn William C. (Mesa AZ) Scofield ; Jr. Brooks L. (Tempe AZ), Method of bump bonding and sealing an accelerometer chip onto an integrated circuit chip.
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  19. Albrecht Thomas R. (Stanford CA) Akamine Shinya (Stanford CA) Carver Thomas E. (Mountain View CA) Zdeblick Mark J. (Los Altos Hills CA), Method of forming microfabricated cantilever stylus with integrated pyramidal tip.
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  20. Cho Steve T. (Newport Beach CA), Method of making a micromechanical silicon-on-glass tuning fork gyroscope.
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  21. Knutti James W. (Fremont CA) Allen Henry V. (Fremont CA) Petersen Kurt E. (San Jose CA) Kowalski Carl R. (Fremont CA), Method of making a semiconductor transducer.
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  22. Stokes John F. (Wyoming MN), Method of making an electrostatic silicon accelerometer.
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  23. Kurtz Anthony D. (Teaneck NJ) Nunn Timothy A. (Ridgewood NJ) Weber Richard A. (Denville NJ), Method of making integral transducer structures employing high conductivity surface features.
    상세보기
  24. Beitman Bruce Allan (Palm Bay FL), Method of manufacturing a semiconductor accelerometer.
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  25. Takahashi Yoshiharu (Hyogo JPX) Takemura Seiji (Hyogo JPX) Tsukui Keitaro (Hyogo JPX) Itoh Junko (Hyogo JPX) Nagai Eitaro (Hyogo JPX) Tada Yasuo (Hyogo JPX) Kishimoto Yuuji (Hyogo JPX) Kiguchi Sakae , Method of manufacturing semiconductor pressure sensor device with two semiconductor pressure sensor chips.
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  26. Tanabe Masanori (Hitachi JPX) Shimada Satoshi (Hitachi JPX) Yasukawa Akio (Ibaraki JPX) Nemoto Hideyuki (Katsuta JPX) Nishihara Motohisa (Katsuta JPX) Tsuchiya Masatoshi (Hitachi JPX) Soeno Ko (Hitac, Method of producing semiconductor displacement transducer.
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  27. Uchiyama Makoto (Zushi JPX) Nojiri Hidetoshi (Yokosuka JPX), Method of tightly joining two semiconductor substrates.
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  28. Lin Liwei (Berkeley CA) Nguyen Clark T. (Berkeley CA) Howe Roger T. (Lafayette CA) Pisano Albert P. (Berkeley CA), Microelectromechanical signal processor fabrication.
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  29. Albrecht Thomas R. (Stanford CA) Akamine Shinya (Stanford CA) Carver Thomas E. (Mountain View CA) Zdeblick Mark J. (Los Altos CA), Microfabricated cantilever stylus with integrated pyramidal tip.
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  30. Halstead Linden T., No fixture method to cure die attach for bonding IC dies to substrates.
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  31. Cho Steve T., Process for bonding a shell to a substrate for packaging a semiconductor.
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  32. Garabedian Raffi M. (San Leandro CA) Ismail M. Salleh (Newark CA) Pashby Gary J. (San Jose CA) Wong Jeffrey K. K. (Fremont CA), Process for making a semiconductor sensor with a fusion bonded flexible structure.
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  33. Tam Andrew C. (Saratoga CA) Yeack-Scranton Celia E. (San Jose CA), Pulsed current resistive heating for bonding temperature critical components.
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  34. Jakobsen Henrik (Horten NOX) Kvistery Terje (Horten NOX), Sealed cavity arrangement method.
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  35. Cahill Sean S. (Menlo Park CA), Semiconductor sensor anodic-bonding process, wherein bonding of corrugation is prevented.
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  36. Kwap ; Theodore William ; Magdo ; Ingrid Emese, Semiconductor structure with annular collector/subcollector region.
    상세보기
  37. Mikkor Mati (Ann Arbor MI), Silicon capacitive pressure sensor and method of making.
    상세보기
  38. Wise Kensall D. (Ann Arbor MI) Schwank Johannes W. (Ann Arbor MI) Gland John L. (Pinckney MI), Solid state chemical micro-reservoirs.
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  39. Gordon Gary B. (Saratoga CA) Barth Phillip W. (Palo Alto CA), Thermally-actuated microminiature valve.
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  40. Johnson Christy L. (Ann Arbor MI) Schwank Johannes (Ann Arbor MI) Wise Kensall D. (Ann Arbor MI), Ultrathin-film gas detector.
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