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특허 상세정보

Dehumidified cooling assembly for IC chip modules

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) F25D-023/12   
미국특허분류(USC) 622/592 ; 620/034 ; 620/032 ; 602/092
출원번호 US-0415732 (1999-10-12)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Gonzalez
인용정보 피인용 횟수 : 33  인용 특허 : 16
초록

A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing which is surrounded by an atmosphere of dehumidified air.

대표
청구항

[ We claim:] [1.]1. A cooling assembly for an integrated circuit chip module mounted on a printed circuit board substrate comprising:an evaporator unit having a thermal interface in thermal communication with said integrated circuit chip module so as to cool said module to a temperature below ambient dew point;an insulated housing having its base attached to said printed circuit board substrate and surrounding the outer perimeter of said integrated circuit module so as to enclose said evaporator unit and said integrated circuit module;an enclosure surrou...

이 특허에 인용된 특허 (16)

  1. Krawec Victor. Atmospheric control system for a humidor. USP2000096116029.
  2. Lebailly Michel (Bollene FRX) Taverdet Jean-Claude (Issirac FRX). Carrier for a card carrying electronic components and of low heat resistance. USP1995045404272.
  3. Porter Warren W. (Escandido CA). Computer component cooling system with local evaporation of refrigerant. USP1994115365749.
  4. Conte Alfred S. (Hollister CA). Cooling multi-chip modules using embedded heat pipes. USP1993125268812.
  5. Ohashi Shingeo (Tsuchiura JPX) Nakajima Tadakatsu (Ibaraki JPX) Kuwahara Heikichi (Ibaraki JPX) Hatada Toshio (Tsuchiura JPX) Matsushima Hitoshi (Ryugasaki JPX) Sato Motohiro (Ibaraki JPX) Inouye Hir. Cooling system of electronic computer using flexible members in contact with semiconductor devices on boards. USP1996045504924.
  6. Moore ; Jr. Raymond W. (Pocasset MA). Cryogenic cooling of circuit boards. USP1992085142443.
  7. Rumbut ; Jr. John T.. Environmentally controlled circuit pack and cabinet. USP1998045740018.
  8. Vader David T. (Mechanicsburg PA) Vasile Vincent C. (Marlboro NY). High performance thermal interface for low temperature electronic modules. USP1995115463872.
  9. Solomon Raymond (Penn Valley CA). Integrated refrigerated computer module. USP1994095349823.
  10. Porter Warren W. (Escondido CA) Lauffer Donald K. (San Diego CA). Method and apparatus for low temperature integrated circuit chip testing and operation. USP1991075028988.
  11. Lee Unkoo (Yongin-Kun KRX). Nose dive preventing front suspension assembly. USP1995035398775.
  12. Bhatia Rakesh. Package with integrated thermoelectric module for cooling of integrated circuits. USP2000086094919.
  13. Cowans Kenneth W. (Fullerton CA). Refrigeration system and method for very large scale integrated circuits. USP1995125471850.
  14. Ito Akishige,JPX ; Funakawa Seiji,JPX. Temperature controller of optical module package. USP2000016009712.
  15. Peterson Brian L.. Temperature-controlled microchip laser assembly and associated submount assembly. USP2000056055815.
  16. Hughes Richard Pierre,CAX ; Zapach Trevor George,CAX ; Song Seaho,CAX. Thermoelectric humidity pump and method for dehumidfying of an electronic apparatus. USP1999035884486.

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  2. Okuda, Noriyuki; Takenaka, Norihiro; Masui, Tomohiro. Air conditioner. USP2015049010142.
  3. Lofy, John. Climate controlled seating assembly with humidity sensor. USP2013088505320.
  4. Lofy, John. Climate controlled seating assembly with sensors. USP2016059335073.
  5. Lin, Pei-Hsi. Computer cooling apparatus. USP2012118302419.
  6. Chu,Richard C.; Ellsworth, Jr.,Michael J.; Schmidt,Roger R.; Simons,Robert E.. Condensate removal system and method for facilitating cooling of an electronics system. USP2006097104081.
  7. Lofy, John. Condensation and humidity sensors for thermoelectric devices. USP20190310228166.
  8. Lofy, John. Condensation and humidity sensors for thermoelectric devices. USP2012098256236.
  9. Lofy, John D.. Condensation and humidity sensors for thermoelectric devices. USP2017059651279.
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  11. Brykalski, Michael J.; Terech, John; Petrovski, Dusko. Environmentally-conditioned bed. USP2017049622588.
  12. Hsiao Chieh-Jen,TWX. Heat-dissipating apparatus for an integrated circuit device. USP2001116324058.
  13. Petrovski, Dusko. Heating and cooling systems for seating assemblies. USP20180610005337.
  14. Bhatia,Rakesh. Integrated circuit cooling apparatus and method. USP2008037342787.
  15. Ouyang, Chien; Gross, Kenneth C.. Intelligent microchannel cooling. USP2010037672129.
  16. Roh, Young Hoon; Kim, Jung Ho; Cho, Jin Cheol; Chang, Jae Won; Kang, Sang Hyuk; Kim, Sang Mahn; Kim, Pan Su. Internet refrigerator having a heat sink plate. USP2004126829904.
  17. Gary F. Goth ; Jody A. Hickey ; Daniel J. Kearney ; Robert Makowicki ; John Loparco. Logic module refrigeration system with condensation control. USP2002096446447.
  18. Goth, Gary F.; Hickey, Jody A.; Kearney, Daniel J.; Makowicki, Robert. Logic module refrigeration system with condensation control. USP2003056564563.
  19. Goth, Gary F.; Hickey, Jody A.; Kearney, Daniel J.; Makowicki, Robert; Loparco, John. Logic module refrigeration system with condensation control. USP2003076595018.
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  22. Goth, Gary F.; Hickey, Jody A.; Kearney, Daniel J.; Makowicki, Robert. Method for controlling a refrigeration unit for evaporator maintenance. USP2004036698216.
  23. Goth, Gary F.; Hickey, Jody A.; Kearney, Daniel J.; Makowicki, Robert. Method for controlling multiple refrigeration units. USP2004036698218.
  24. Goth, Gary F.; Hickey, Jody A.; Kearney, Daniel J.; Makowicki, Robert. Method for operating a logic module refrigeration unit. USP2003126662577.
  25. Goth, Gary F.; Hickey, Jody A.; Kearney, Daniel J.; Makowicki, Robert. Method for shutting down a refrigerating unit. USP2003116644048.
  26. Goth, Gary F.; Hickey, Jody A.; Kearney, Daniel J.; Makowicki, Robert. Method for starting a refrigeration unit. USP2003116644053.
  27. Goth, Gary F.; Hickey, Jody A.; Kearney, Daniel J.; Makowicki, Robert. Method of controlling a refrigeration unit. USP2003116644056.
  28. Brykalski, Michael; Marquette, David. Moisture abatement in heating operation of climate controlled systems. USP2018069989267.
  29. Ouyang, Chien; Gross, Kenneth C.. Multichannel cooling system with magnetohydrodynamic pump. USP2011017870893.
  30. Ouyang,Chien. Thermoelectric cooling device arrays. USP2008107436059.
  31. Petrovski, Dusko; Zheng, Sihai; Maass, Michael. Thermoelectric device controls and methods. USP20190210208990.
  32. Inaba, Masahiko; Clark, Jay Christopher; Comiskey, Brian. Thermoelectric device with internal sensor. USP2018019857107.
  33. Steinman, Adam Joseph; Bunyak, Kenneth James; Orlando, Bruno Antonio. Vehicle headliner assembly for zonal comfort. USP2017059662962.