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Method of forming a phase change heat sink 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23P-015/26
출원번호 US-0568748 (2000-05-11)
발명자 / 주소
  • McCullough Kevin A.
출원인 / 주소
  • Chip Coolers, Inc.
대리인 / 주소
    Barlow, Josephs & Holmes, Ltd.
인용정보 피인용 횟수 : 52  인용 특허 : 20

초록

A method of forming a phase change passive heat sink, with a base member and heat dissipating members, is provided. The base member is hollow and defines an evaporation chamber therein. A number of heat dissipating members are connected to the base member. Each of the heat dissipating members are su

대표청구항

[ What is claimed is:] [1.]1. A method of forming a phase change heat sink assembly, comprising the steps of:forming a wick frame having a hollow base, with an base chamber, and a plurality of hollow upstanding members, with respective upstanding member chambers; said base chamber being in fluid com

이 특허에 인용된 특허 (20)

  1. Mergler Thomas G. (Bolivar NY), Heat exchanger and heat pipe therefor.
  2. Lindner Friedrich (Leinfelden-Echterdingen DEX), Heat pipe.
  3. Meijer Roelf J. (Ann Arbor MI) Ziph Benjamin (Ann Arbor MI), Heat pipe.
  4. Sakaya Masuji (Narashino JPX) Okiai Ryuichi (Yotsukaido JPX) Mochizuki Masataka (Nagareyama JPX) Mashiko Kouichi (Tokyo JPX), Heat pipe and method of manufacturing the same.
  5. Adkins Douglas Ray ; Shen David S. ; Tuck Melanie R. ; Palmer David W. ; Grafe V. Gerald, Heat pipe with embedded wick structure.
  6. Itoh Satomi (Hyogo JPX), Heat radiating device.
  7. McCullough Kevin A., Heat sink assembly manufactured of thermally conductive polymer material with insert molded metal attachment.
  8. McCullough Kevin A. ; Rife William B., Heat sink assembly with multiple pressure capability.
  9. Austin Thomas A. ; Greer Stephen ; Low Andrew, Integral heat pipe enclosure.
  10. Davidson Howard L. (San Carlos CA) Ettehadieh Ehsan (Albany CA), Integral heat pipe, heat exchanger, and clamping plate.
  11. Camarda Charles J. (Virginia Beach VA) Peterson George P. (College Station TX) Rummler Donald R. (Hampton VA), Method for producing micro heat panels.
  12. McCullough Kevin A., Method of molding a thermally conductive article.
  13. McCullough Kevin Albert (Warwick RI), Mold apparatus for manufacturing a plastic article with interrupted interior threads for securing a heat sink to a heat.
  14. Davidson Howard L. (San Carlos CA) Ettehadieh Ehsan (Albany CA) Schulte John (Mountain View CA), Optimized integral heat pipe and electronic circuit module arrangement.
  15. McCullough Kevin Albert (Warwick RI), Plastic article with interrupted interior threads for securing a threaded heat sink to a heat generating member.
  16. Lee Richard,TWX, Quick defrosting pad.
  17. Progl Curtis L. ; Tracy Mark S. ; Moore David A., System and method for transferring heat between movable portions of a computer.
  18. Larson Ralph I. ; Phillips Richard L., Two-phase thermal bag component cooler.
  19. Shanker Bangalore J. (Santa Clara CA) Belani Jagdish G. (Cupertino CA), Use of a heat pipe integrated with the IC package for improving thermal performance.
  20. Roberts ; Jr. ; Charles C., Variable thermal conductance reflux heat pipe.

이 특허를 인용한 특허 (52)

  1. Chen,Howard; Liu,Hsichang; Hsu,Louis; Mok,Lawrence, Apparatuses for dissipating heat from semiconductor devices.
  2. Katragadda, Sunil; Cole, W. Cary; Levin, Michael; Shaikh, Furqan Zafar; Demitroff, Danrich Henry; Fast, Mathew John, Axle heat absorber.
  3. Reis,Bradley E.; Skandakumaran,Prathib; Smalc,Martin David; Shives,Gary D.; Kostyak,Gary Stephen; Norley,Julian, Base heat spreader with fins.
  4. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Condenser block structures with cavities facilitating vapor condensation cooling of coolant.
  5. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Condenser fin structures facilitating vapor condensation cooling of coolant.
  6. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Condenser fin structures facilitating vapor condensation cooling of coolant.
  7. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Condenser structures with fin cavities facilitating vapor condensation cooling of coolant.
  8. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling.
  9. Chrysler, Gregory M.; Maveety, James G., Die having a via filled with a heat-dissipating material.
  10. Ghosh, Debashis; Bhatti, Mohinder Singh, Domed heat exchanger (porcupine).
  11. Rapp, Robert J, Electronic package whereby an electronic assembly is packaged within an enclosure that is designed to act as a heat pipe.
  12. Sun, Chien-Hung; Liu, Lei-Lei; Zhang, Xiao-Min, Heat dissipater having capillary component.
  13. Lin, Yu-Min; Lan, Wen-Ji, Heat dissipation device.
  14. Zuo, Jon; Ernst, Donald M., Heat pipe having a wick structure containing phase change materials.
  15. Yuyama, Takaharu; Nakanishi, Masakazu, Heat pipe unit and heat pipe type heat exchanger.
  16. Damaraju, Srinivasa Rao; Walters, Joseph; O'Connor, Dalton Seth, Heat sink with an integrated vapor chamber.
  17. Huang,Hong Yuan, Heat sink with built-in heat pipes for semiconductor packages.
  18. Kiley,Richard F.; Bush,Simone, Heat sink, assembly, and method of making.
  19. Eesley, Gary Lynn; Morelli, Donald T.; Bhatti, Mohinder Singh, High performance heat exchange assembly.
  20. Hartke, David J; Dibene, II, Joseph T.; Derian, Edward J.; Broder, James M., Integrated power delivery and cooling system for high power microprocessors.
  21. Cowans,Kenneth W., Lateral temperature equalizing system for large area surfaces during processing.
  22. Cowans,Kenneth W., Lateral temperature equalizing system for large area surfaces during processing.
  23. DiBene, II, Joseph Ted; Hartke, David H., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.
  24. McCullough, Kevin A., Method of manufacturing a heat pipe construction.
  25. Masami Ikeda JP; Masaaki Yamamoto JP; Tatsuhiko Ueki JP; Ken Sasaki JP, Method of manufacturing plate type heat pipe.
  26. Chrysler, Gregory M.; Maveety, James G., Micro-chimney and thermosiphon die-level cooling.
  27. DiBene, II,Joseph T.; Derian,Edward J., Micro-spring interconnect systems for low impedance high power applications.
  28. Chesser, Jason B.; Faneuf, Barrett M.; Montgomery, Stephen W., Modular capillary pumped loop cooling system.
  29. Blasenheim, Barry J.; Kao, H. Pin; Oldham, Mark F., Optical camera alignment.
  30. Blasenheim, Barry J.; Kao, H. Pin; Oldham, Mark F., Optical camera alignment.
  31. Blasenheim, Barry; Kao, H. Pin; Oldham, Mark, Optical camera alignment.
  32. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Parallel thermoelectric heat exchange systems.
  33. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Physically separated hot side and cold side heat sinks in a thermoelectric refrigeration system.
  34. Hartke, David H.; DiBene, II, J. Ted, Right-angle power interconnect electronic packaging assembly.
  35. Fawcett, Adrian, Sample block apparatus and method for maintaining a microcard on a sample block.
  36. Fawcett, Adrian, Sample block apparatus and method for maintaining a microcard on a sample block.
  37. Fawcett, Adrian, Sample block apparatus and method for maintaining a microcard on sample block.
  38. Fawcett,Adrian, Sample block apparatus and method of maintaining a microcard on a sample block.
  39. Pollard, Berwyn Owain; Scott, David Russell, Surface cooler having channeled fins.
  40. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., System and method for processor power delivery and thermal management.
  41. Stanley, Marshall; Barus, Daniel, Systems and methods for operating a thermoelectric module to increase efficiency.
  42. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Systems and methods to mitigate heat leak back in a thermoelectric refrigeration system.
  43. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Thermoelectric heat exchange system comprising cascaded cold side heat sinks.
  44. June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek; Edwards, Jesse W., Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance.
  45. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Thermoelectric refrigeration system control scheme for high efficiency performance.
  46. Refai-Ahmed, Gamal, Three-dimensional thermal spreading in an air-cooled thermal device.
  47. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Two-phase heat exchanger mounting.
  48. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., Ultra-low impedance power interconnection system for electronic packages.
  49. Siu, Wing Ming, Vapor augmented heatsink with multi-wick structure.
  50. Joseph T. Dibene, II ; Farhad Raiszadeh, Vapor chamber with integrated pin array.
  51. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Vapor condenser with three-dimensional folded structure.
  52. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Vapor condenser with three-dimensional folded structure.
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