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An apparatus for mass fabrication of a semiconductor assembly comprising optical sources for supplying radiant energy for rapid and controlled heating of a multitude of integrated circuit chips and substrates. The resultant thermal profile is applied to reflowing solder interconnections as well as t

An apparatus for mass fabrication of a semiconductor assembly comprising optical sources for supplying radiant energy for rapid and controlled heating of a multitude of integrated circuit chips and substrates. The resultant thermal profile is applied to reflowing solder interconnections as well as to filling chip-to-substrate gaps with polymeric precursors whereby any mechanical stress detrimental to mechanically weak solder joints and dielectric layers is avoided. The apparatus contains dispensing equipment with multiple degrees of freedom so that the chips and substraters to be assembled do not have to be moved within or from the apparatus. Processing in controlled environment is feasible.

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[ What is claimed is:] [1.]1. An apparatus for the fabrication of a semiconductor assembly comprising:means for positioning a plurality of electrically insulating substrates on a support, each substrate having interconnecting wiring strips and a pattern of metal contact pads;means for positioning on

[ What is claimed is:] [1.]1. An apparatus for the fabrication of a semiconductor assembly comprising:means for positioning a plurality of electrically insulating substrates on a support, each substrate having interconnecting wiring strips and a pattern of metal contact pads;means for positioning one semiconductor integrated circuit chip aligned to each of said substrates;said chips having a pattern of metal contact pads mirror-imaging said pattern of contact pads of said substrates, and having further interconnecting metallic entities between each of said contact pads;means for supplying radiant energy to said substrates and said chips to achieve specific profiles of temperature cycling;means for measuring and controlling temperature;means for controlling the height of said metallic entities to maintain a uniform gap spacing said chips and said substrates apart;means for moving a dispensing equipment having multiple independent degrees of freedom whereby a polymeric precursor can be dispensed for filling said gaps of each of said assemblies; andmeans for measuring and controlling temperature during and after said dispensing process.