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Method of and apparatus for controlling fluid flow and electric fields involved in the electroplating of substantially flat workpieces and the like and more generally controlling fluid flow in the pr 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25D-005/08
  • C25D-005/22
  • C25D-021/10
  • C25D-007/12
출원번호 US-0390110 (1999-09-03)
발명자 / 주소
  • Keigler Arthur
대리인 / 주소
    Rines and Rines
인용정보 피인용 횟수 : 71  인용 특허 : 6

초록 ▼

A novel method and apparatus of wet processing workpieces, such as electroplating semiconductor wafers and the like, that incorporates reciprocating processing fluid agitation to control fluid flow at the workpiece, and where electric fields are involved as in such electroplating, controlling the el

대표청구항 ▼

[ What is claimed is:] [1.]1. In an electroplating process for a cathodically connected fixed thin workpiece between which and a fixed parallel anode an electric field is established within an electroplating fluid chamber, a method of improving the control of fluid flow and uniformity of electroplat

이 특허에 인용된 특허 (6)

  1. Kim Sung-Min,KRX, Agitator mechanism for a clothes washing machine.
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  2. Lowery Kenneth J. (San Dimas CA), Electrolytic plating apparatus and method.
    상세보기
  3. Broadbent Eliot K., Electroplating system with shields for varying thickness profile of deposited layer.
    상세보기
  4. Quigg Daniel F. (Ventura CA), Magnetic mixer.
    상세보기
  5. Arken David M. ; Chiu Andrew ; Fatula ; Jr. Joseph John ; Hitzfield Robert William ; Hsiao Wen-Chien David ; Hsiao Yiping, Rotary plater with radially distributed plating solution.
    상세보기
  6. Andricacos Panayotis C. (Croton-on-Hudson NY) Berridge Kirk G. (Fishkill NY) Dukovic John O. (Pleasantville NY) Flotta Matteo (Yorktown Heights NY) Ordonez Jose (Pleasant Valley NY) Poweleit Helmut R, Vertical paddle plating cell.
    상세보기

이 특허를 인용한 특허 (71)

  1. Van Valkenburg, Paul; Mikkola, Robert; Klocke, John L.; McHugh, Paul R.; Wilson, Gregory J.; Hanson, Kyle Moran; Bergman, Eric J., Adaptive electric field shielding in an electroplating processor using agitator geometry and motion control.
    상세보기
  2. Yokomizo,Kenji, Apparatus and method of securing a workpiece during high-pressure processing.
    상세보기
  3. Keigler, Arthur; Harrell, John; Liu, Zhenqiu; Wu, Qunwei, Apparatus for fluid processing a workpiece.
    상세보기
  4. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of a workpiece.
    상세보기
  5. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of multiple workpieces.
    상세보기
  6. Keigler, Arthur; Wu, Qunwei; Liu, Zhenqiu; Harrell, John, Balancing pressure to improve a fluid seal.
    상세보기
  7. Keigler, Arthur; Wu, Qunwei; Liu, Zhenqiu; Harrell, John, Balancing pressure to improve a fluid seal.
    상세보기
  8. Chan, Kang Cheung; Yung, Kam Chuen; Yue, Tai Men, Complex waveform electroplating.
    상세보기
  9. Kovarsky,Nicolay; Yang,Michael; Lubomirsky,Dmitry, Contact plating apparatus.
    상세보기
  10. Herchen,Harald, Contact ring with embedded flexible contacts.
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  11. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.
    상세보기
  12. Yasuhiko Sakaki JP, Cup shaped plating apparatus with a disc shaped stirring device having an opening in the center thereof.
    상세보기
  13. Sakaki,Yasuhiko, Cup type plating apparatus.
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  14. Yasuhiko Sakaki JP, Cup type plating apparatus.
    상세보기
  15. Arena Foster,Chantal J.; Awtrey,Allan Wendell; Ryza,Nicholas Alan; Schilling,Paul, Developing photoresist with supercritical fluid and developer.
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  16. Arena-Foster, Chantal J.; Awtrey, Allan Wendell; Ryza, Nicholas Alan; Schilling, Paul, Developing photoresist with supercritical fluid and developer.
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  17. Arena-Foster, Chantal J.; Awtrey, Allan Wendell; Ryza, Nicholas Alan; Schilling, Paul, Drying resist with a solvent bath and supercritical CO2.
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  18. Griego, Thomas P.; Eichman, III, John W.; Velasquez, Geronimo, Electrodeposition apparatus and method using magnetic assistance and rotary cathode for ferrous and magnetic particles.
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  19. Sheydayi,Alexei; Sutton,Thomas, Gate valve for plus-atmospheric pressure semiconductor process vessels.
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  20. Sutton, Thomas R.; Biberger, Maximilan A., High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism.
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  21. Jones, William D., High pressure fourier transform infrared cell.
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  22. Biberger, Maximilian A.; Layman, Frederick Paul; Sutton, Thomas Robert, High pressure processing chamber for semiconductor substrate.
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  23. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.
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  24. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
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  25. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
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  26. McHugh,Paul R.; Wilson,Gregory J.; Woodruff,Daniel J.; Zimmerman,Nolan; Erickson,James J., Integrated microfeature workpiece processing tools with registration systems for paddle reactors.
    상세보기
  27. Woodruff,Daniel J.; Mattson,David P.; Erickson,James J.; Egloff,Matthew C., Integrated tool with automated calibration system and interchangeable wet processing components for processing microfeature workpieces.
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  28. Davis,Jeffry Alan; Harris,Randy A., Integrated tool with interchangeable wet processing components for processing microfeature workpieces.
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  29. James, Jerome, Metal plating method and apparatus.
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  30. James, Jerome, Metal plating method and apparatus.
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  31. Thomas R. Sutton ; Robert Koch, Method and apparatus for agitation of workpiece in high pressure environment.
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  32. Sheydayi,Alexei, Method and apparatus for clamping a substrate in a high pressure processing system.
    상세보기
  33. Goshi,Gentaro, Method and apparatus for cooling motor bearings of a high pressure pump.
    상세보기
  34. Keigler, Arthur; Harrell, John; Liu, Zhenqiu; Wu, Qunwei, Method and apparatus for fluid processing a workpiece.
    상세보기
  35. Keigler, Arthur; Harrell, John; Liu, Zhenqiu; Wu, Qunwei, Method and apparatus for fluid processing a workpiece.
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  36. Keigler,Arthur; Harrell,John; Liu,Zhenqiu; Wu,Qunwei, Method and apparatus for fluid processing a workpiece.
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  37. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.
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  38. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.
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  39. Parent,Wayne M., Method and system for determining flow conditions in a high pressure processing system.
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  40. Parent, Wayne M.; Geshell, Dan R., Method and system for passivating a processing chamber.
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  41. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.
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  42. Keigler, Arthur; Harrell, John; Liu, Zhenqiu; Wu, Qunwei, Method for fluid processing a workpiece.
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  43. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.
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  44. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method for supercritical processing of multiple workpieces.
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  45. Biberger, Maximilian A.; Schilling, Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
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  46. Biberger,Maximilian A.; Schilling,Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
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  47. Hillman,Joseph, Method of inhibiting copper corrosion during supercritical COcleaning.
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  48. Toma,Dorel Ioan; Schilling,Paul, Method of passivating of low dielectric materials in wafer processing.
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  49. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.
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  50. Schilling,Paul, Method of treating a composite spin-on glass/anti-reflective material prior to cleaning.
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  51. Schilling,Paul, Method of treatment of porous dielectric films to reduce damage during cleaning.
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  52. Gonzalez, Jr., David; Losey, Matthew W., Methods and apparatus for improved current density and feature fill control in ECD reactors.
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  53. Oberlitner, Thomas H.; Hanson, Kyle M., Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece.
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  54. Oberlitner,Thomas H.; Hanson,Kyle M., Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece.
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  55. Sheydayi,Alexei, Non-contact shuttle valve for flow diversion in high pressure systems.
    상세보기
  56. McHugh,Paul R.; Wilson,Gregory J.; Woodruff,Daniel J.; Zimmerman,Nolan; Erickson,James J., Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces.
    상세보기
  57. Sakaki, Yasuhiko, Plating apparatus for wafer.
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  58. Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.
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  59. Wuester,Christopher D., Process flow thermocouple.
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  60. Woodruff, Daniel; Eudy, Steve; Erickson, James; Oberlitner, Thomas; Egloff, Matthew, Processing apparatus including a reactor for electrochemically etching a microelectronic workpiece.
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  61. Woodruff, Daniel; Eudy, Steve; Erickson, James; Oberlitner, Thomas; Egloff, Matthew, Processing apparatus including a reactor for electrochemically etching microelectronic workpiece.
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  62. McHugh,Paul R.; Wilson,Gregory J.; Woodruff,Daniel J.; Zimmerman,Nolan; Erickson,James J., Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods.
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  63. Mullee,William H.; de Leeuwe,Marc; Roberson, Jr.,Glenn A.; Palmer,Bentley J., Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process.
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  64. Bertram, Ronald Thomas; Scott, Douglas Michael, Removal of contaminants from a fluid.
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  65. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
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  66. Patton, Evan E.; Cacouris, Theodore; Broadbent, Eliot; Mayer, Steven T., Sequential station tool for wet processing of semiconductor wafers.
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  67. Patton, Evan E.; Cacouris, Theodore; Broadbent, Eliot; Mayer, Steven T., Sequential station tool for wet processing of semiconductor wafers.
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  68. Gale,Glenn; Hillman,Joseph T.; Jacobson,Gunilla; Palmer,Bentley, System and method for processing a substrate using supercritical carbon dioxide processing.
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  69. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
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  70. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.
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  71. Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.
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