초록 ▼

A method and apparatus for substrate processing at lower cost than existing processing systems are disclosed, which by implementing an arrangement using load locks of smaller dimensions or of a non-indexing type, as compared to existing large dimension or indexing load locks, along with a substrate

A method and apparatus for substrate processing at lower cost than existing processing systems are disclosed, which by implementing an arrangement using load locks of smaller dimensions or of a non-indexing type, as compared to existing large dimension or indexing load locks, along with a substrate loading and unloading technique can achieve the fast throughput of existing systems while reducing the size and cost of the load lock apparatus required. A processed substrate is returned by an internal robot from one of its processing modules to the shelf or slot in the small load lock from which the last substrate was removed for processing by the robot, rather than being returned to the original source shelf or slot from which it was removed for processing, as in the prior art. Also venting for a first one of the load locks is started as soon as the second load lock becomes the substrate source for the internal robot rather than waiting until the first load lock has been refilled with processed substrates. By virtue of these improved operations, small dimension load locks, whether of the indexing or non-indexing type, can be used in place of more expensive large dimension indexing type load locks while maintaining comparable substrate throughputs.

대표청구항 ▼

[ What is claimed is:] [1.]1. A method of transporting substrate into and out of a load lock having a plurality of substrate holding locations in a substrate processing apparatus, comprising the steps of:removing a first substrate to be processed from a first substrate holding location in said load

[ What is claimed is:] [1.]1. A method of transporting substrate into and out of a load lock having a plurality of substrate holding locations in a substrate processing apparatus, comprising the steps of:removing a first substrate to be processed from a first substrate holding location in said load lock; andinserting a second substrate that has been processed into said first substrate holding location after said first substrate is removed and before any other substrates are inserted into or removed from said substrate holding location in said load lock.