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Electro-chemical deposition system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25D-017/00
  • C25B-015/00
  • C25B-013/00
  • C25B-009/00
출원번호 US-0289074 (1999-04-08)
발명자 / 주소
  • Dordi Yezdi
  • Olgado Donald J.
  • Morad Ratson
  • Hey Peter
  • Denome Mark
  • Sugarman Michael
  • Lloyd Mark
  • Stevens Joseph
  • Marohl Dan
  • Shin Ho Seon
  • Ravinovich Eugene
  • Cheung Robin
  • Sinha Ashok K
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Thomason, Moser & Patterson, L.L.P.
인용정보 피인용 횟수 : 240  인용 특허 : 48

초록 ▼

The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical dep

대표청구항 ▼

[ What is claimed is:] [1.]1. An electro-chemical deposition system, comprising:a) a mainframe having a mainframe wafer transfer robot;b) a loading station disposed in connection with the mainframe;c) one or more processing cells disposed in connection with the mainframe; andd) an electrolyte supply

이 특허에 인용된 특허 (48)

  1. Watson Angus (Bricktown NJ), Acid copper electroplating baths containing brightening and leveling additives.
    상세보기
  2. Cheung Robin ; Sinha Ashok ; Tepman Avi ; Carl Dan, Apparatus for electro-chemical deposition with thermal anneal chamber.
    상세보기
  3. Konishi Nobuo (Tokyo JPX) Sekiguchi Kenji (Tokyo JPX), Apparatus for removing process liquid.
    상세보기
  4. Kozai ; Teruo ; Ohara ; Shigeharu ; Suzuki ; Hiroshi ; Yanagihara ; Shin go, Apparatus for washing semiconductor wafers.
    상세보기
  5. Eckles William E. (Cleveland OH) Bishop Craig V. (Cleveland OH) Vaitekunas Peter T. (Cleveland OH), Automatic analyzer and control system for electroplating baths.
    상세보기
  6. Sago Hiroyoshi (Kanagawa JPX) Fujiyama Shigemi (Kanagawa JPX) Kudo Katsuhiko (Kanagawa JPX) Kumazawa Hirotsugu (Kanagawa JPX), Cleaning device for cleaning planar workpiece.
    상세보기
  7. Rattan William D. (San Jose CA) Walwyn Craig M. (San Jose CA), Disc cleaning machine.
    상세보기
  8. Brewer James M. (Austin TX), Edge bead removal process for spin on films.
    상세보기
  9. Poris Jaime, Electrodeposition apparatus with virtual anode.
    상세보기
  10. Mayer Linda J. (Denville NJ) Barbieri Stephen C. (Rutherford NJ), Electrodeposition of bright copper.
    상세보기
  11. Creutz ; deceased ; Hans-Gerhard ; Herr ; Roy W., Electrodeposition of copper.
    상세보기
  12. Izumi Takayuki,JPX ; Okajima Takehiko,JPX, Electroplating apparatus.
    상세보기
  13. Johnston Samuel J. B. (Ashford GB2), Electroplating arrangements.
    상세보기
  14. Uzoh Cyprian E., Electroplating workpiece fixture having liquid gap spacer.
    상세보기
  15. Drummond Geoffrey N. ; Scholl Richard A., Enhanced reactive DC sputtering system.
    상세보기
  16. Martin Sylvia (Shelby Township ; Macomb County MI), Functional fluid additives for acid copper electroplating baths.
    상세보기
  17. Chizinsky George (143 West St. Beverly Farms MA 01915), Heated plate rapid thermal processor.
    상세보기
  18. Crank Sue E. (Coppell TX), Integrated circuit copper metallization process using a lift-off seed layer and a thick-plated conductor layer.
    상세보기
  19. Yamamura Takayoshi (Hamamatsu JPX) Endo Yoshihisa (Hamamatsu JPX) Shinmura Akira (Hamamatsu JPX), Metal plating apparatus.
    상세보기
  20. Shortes Samuel R. (Plano TX) Millis Edwin Graham (Dallas TX), Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water.
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  21. Bunkofske Raymond James, Method and apparatus for coating a semiconductor wafer.
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  22. Quazi Fazle S. (Boulder CO), Method and apparatus for sputtering a dielectric target or for reactive sputtering.
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  23. Thompson Raymon F. (Kalispell MT) Gordon Robert W. (Seattle WA) Durado Daniel (Kalispell MT), Method for single wafer processing in which a semiconductor wafer is contacted with a fluid.
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  24. Goffman Martin (Edison NJ) Kudryk Val (Closter NJ), Method for the electrodeposition of metals.
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  25. Mullarkey Edward J. (5501 Seminary Rd. ; No. 1404 S. Falls Church VA 22041), Method of electroplating a precious metal on a semiconductor device, integrated circuit or the like.
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  26. Kloiber Allan J. (Marshall Township ; Allegheny County PA) Bubien Gary G. (Center PA) Osmanski Gerald S. (Brighton Township ; Beaver County PA), Modular apparatus and method for surface treatment of parts with liquid baths.
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  27. Raistrick Ian D. (Menlo Park CA) Poris Jaime (Portola Valley CA) Huggins Robert A. (Stanford CA granted to U.S. Department of Energy under the provisions of 42 U.S.C. 2182), Molten salt lithium cells.
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  28. Raistrick Ian D. (Menlo Park CA) Poris Jaime (Portola Valley CA) Huggins Robert A. (Stanford CA), Molten salt lithium cells.
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  29. Bergman Eric J. (Kalispell MT) Reardon Timothy J. (Kalispell MT) Thompson Raymon F. (Lakeside MT) Owczarz Aleksander (Kalispell MT), Multi-station semiconductor processor with volatilization.
    상세보기
  30. Ishida Hirofumi (Hiratsuka JPX), Plating device for wafer.
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  31. Ishida Hirofumi (Kanagawa JPX), Plating device for wafer.
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  32. Poris Jaime (Los Gatos CA), Precision weighing to monitor the thickness and uniformity of deposited or etched thin film.
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  33. Sellers Jeff C. (Palmyra NY), Preferential sputtering of insulators from conductive targets.
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  34. Aigo Seiichiro (3-15-13 ; Negishi ; Daito-ku Tokyo JPX), Process for washing and drying a semiconductor element.
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  35. Gronet Christian M. (Palo Alto CA) Gibbons James F. (Palo Alto CA), Rapid thermal heating apparatus and method.
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  36. Cuthbert John D. (Bethlehem PA) Soos Nicholas A. (Lower Macungie Township ; Lehigh County PA), Removal of coating from periphery of a semiconductor wafer.
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  37. Poris Jaime (409 Capitola Ave. Capitola CA 95010), Selective metal electrodeposition process.
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  38. Poris Jaime (21955 Bear Creek Way Los Gatos CA 95030), Selective metal electrodeposition process and apparatus.
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  39. Allen Landon K. (Sunnyvale CA), Selective removal of coating material on a coated substrate.
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  40. Thompson Raymon F. (Kalispell MT) Gordon Robert W. (Seattle WA) Durado Daniel (Kalispell MT), Single wafer processor.
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  41. Thompson Raymon F. (Kalispell MT) Owczarz Aleksander (Kalispell MT), Single wafer processor with a frame.
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  42. Sato ; Masamichi ; Fujii ; Itsuo, Spin coating process.
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  43. Leibovitz Jacques (San Jose CA) Cobarruviaz Maria L. (Cupertino CA) Scholz Kenneth D. (Palo Alto CA) Chao Clinton C. (Redwood City CA), Stacked solid via formation in integrated circuit systems.
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  44. Leibovitz Jacques (San Jose CA) Cobarruviaz Maria L. (Cupertino CA) Scholz Kenneth D. (Palo Alto CA) Chao Clinton C. (Redwood City CA), Stacked solid via formation in integrated circuit systems.
    상세보기
  45. Hayashida Ichiro (Kawagoe JPX) Kakizawa Masahiko (Kawagoe JPX) Umekita Kenichi (Kawagoe JPX) Nawa Hiroyoshi (Kawagoe JPX) Muraoka Hisashi (Yokohama JPX), Surface treating cleaning method.
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  46. Tuchida Junichi (Kanagawa JPX) Takamatsu Toshiyuki (Chiba JPX), Surface treatment method and apparatus for a semiconductor wafer.
    상세보기
  47. Powell Walter W. (Peculiar MO) Seifert Gary A. (Lee\s Summit MO), Vacuum-type article holder and methods of supportively retaining articles.
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  48. Andricacos Panayotis C. (Croton-on-Hudson NY) Berridge Kirk G. (Fishkill NY) Dukovic John O. (Pleasantville NY) Flotta Matteo (Yorktown Heights NY) Ordonez Jose (Pleasant Valley NY) Poweleit Helmut R, Vertical paddle plating cell.
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  3. Sun,Lizhong; Tsai,Stan; Redeker,Fritz, Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus.
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  4. Nemani, Srinivas D.; Koshizawa, Takehito, Air gap process.
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  5. Purayath, Vinod R.; Ingle, Nitin K., Air gaps between copper lines.
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  6. Kang, Sean; Ko, Jungmin; Luere, Oliver, Airgap formation with damage-free copper.
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  7. Lee, Wei Ti; Hassan, Mohd Fadzli Anwar; Guo, Ted; Yu, Sang-Ho, Aluminum contact integration on cobalt silicide junction.
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  8. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K., Aluminum oxide selective etch.
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  10. Xue, Jun; Hsu, Ching-Mei; Li, Zihui; Godet, Ludovic; Wang, Anchuan; Ingle, Nitin K., Anisotropic gap etch.
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  14. Hartz, Helge; Nopper, Markus; Preusse, Axel, Apparatus and method for removing bubbles from a process liquid.
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  15. Hanson,Kyle M., Apparatus and methods for electrochemical processing of microelectronic workpieces.
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  33. Wang, Xikun; Pandit, Mandar; Cui, Zhenjiang; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K.; Liu, Jie, Chlorine-based hardmask removal.
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  34. Maydan, Dan, Coated anode apparatus and associated method.
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