초록 ▼

A filter media for physically separating particles of an abrasive media having a given mean average particle size from a chemical-mechanical polishing (CMP) slurry. The abrasive media has a particle size distribution including particles larger than the mean average particle size. The filter media is

A filter media for physically separating particles of an abrasive media having a given mean average particle size from a chemical-mechanical polishing (CMP) slurry. The abrasive media has a particle size distribution including particles larger than the mean average particle size. The filter media is provided as being formed of at least one sheet of a porous membrane having a first and second surface defining a thickness dimension of the membrane therebetween, and having a plurality of generally cylindrical capillary pores formed through the thickness dimension sized effective to capture the particles larger than the mean average particle size. In service, the slurry is supplied to the first side of the filter media, and is passed through the media to the second side thereof such that at least a portion of the particles of the abrasive media larger than the mean average particle size is retained on the first side of the filter media. Such portion may include particles of the abrasive media which are smaller than the pore size of the membrane.

대표청구항 ▼

[ What is claimed is:] [1.]1. A method of physically separating particles of an abrasive media larger than a specified particle size cutoff limit from a chemical-mechanical polishing (CMP) slurry, said method comprising the steps of:(a) providing a filter media having a first and second side and bei

[ What is claimed is:] [1.]1. A method of physically separating particles of an abrasive media larger than a specified particle size cutoff limit from a chemical-mechanical polishing (CMP) slurry, said method comprising the steps of:(a) providing a filter media having a first and second side and being formed of at least one sheet of a porous membrane having a first and second surface defining a thickness dimension of said membrane therebetween, said membrane having a plurality of generally cylindrical capillary pores formed through said thickness dimension, each of said pores being of about the same diameter, said diameter of said pores being larger than said specified particle size cutoff limit;(b) supplying the CMP slurry to the first side of said filter media; and(c) passing the CMP slurry through said filter media to the second side thereof whereby at least a portion of said particles of said abrasive media larger than said specified particle size cutoff limit is retained on the first side of said filter media, said portion including particles which are smaller than said diameter of said pores of said membrane.