초록

Thermoelectric devices are physically incorporated within the IC package using MLC technology.

대표청구항 ▼

[ Thus, having described the invention, what is claimed is:] [1.]1. A thermoelectric device comprising:a heat sink;a plurality of blocks of two different materials arranged thermally in parallel, electrically in series;a lower plate of high thermal conductivity, having a top surface, a bottom surfac

[ Thus, having described the invention, what is claimed is:] [1.]1. A thermoelectric device comprising:a heat sink;a plurality of blocks of two different materials arranged thermally in parallel, electrically in series;a lower plate of high thermal conductivity, having a top surface, a bottom surface, and a plurality of electrically conductive connectors forming electrical connections for said plurality of blocks on the lower plate top surface;a high thermal conductivity ceramic block attached directly to said plurality of blocks of at least two different materials; and,a plurality of channels within said ceramic block containing liquid therein for heat absorption. [5.]5. A thermoelectric device comprising:anintegrated circuit microchip;an electronic package, having an upper surface and a lower surface, comprising high thermal conductivity ceramic and conductive wires, such that when said package lower surface is attached to said integrated circuit microchip it functions as a conduction plate;a plurality of blocks of at least two different materials arranged thermally in parallel and electrically in series;means for electrically connecting one end of said plurality of blocks on said package upper surface;a faceplate having embedded lines and vias for electrically connecting the other end of said plurality of blocks;means for electrically connecting said microchip to said package; and,a heat sink attached to said plurality of blocks opposite said package.