초록 ▼

The addition of a heat slug to a lead frame establishes a heat conduction path from a silicon chip on the lead frame to the heat slug. Hence, when a semiconductor package that encloses the lead frame and the silicon chip is formed, heat produced by the silicon chip can still be channeled away throug

The addition of a heat slug to a lead frame establishes a heat conduction path from a silicon chip on the lead frame to the heat slug. Hence, when a semiconductor package that encloses the lead frame and the silicon chip is formed, heat produced by the silicon chip can still be channeled away through the radiating surface of the heat slug. Furthermore, the heat slug can be bent over to cover burrs outside the package.

대표청구항 ▼

[ What is claimed is:] [1.]1. A lead frame having a packaging area, comprising:a die pad within the packaging area;a plurality of leads around the die pad such that a portion of each lead is located inside the packaging area;a heat slug outside the packaging area; anda plurality of tie bars attached

[ What is claimed is:] [1.]1. A lead frame having a packaging area, comprising:a die pad within the packaging area;a plurality of leads around the die pad such that a portion of each lead is located inside the packaging area;a heat slug outside the packaging area; anda plurality of tie bars attached to the die pad so that at least one tie bar couples the die pad to the heat slug,wherein the heat slug is bent upward or downward around the package body so as to cover burrs formed on an exterior of the lead frame.