초록 ▼

A radio frequency identification device (100, 200, 300, 350, 400, 500, 700) includes a substrate member (110) having a first surface (109) and a second surface (111). Disposed on the first surface of the substrate member are a first antenna element (112) and a second antenna element (114). The first

A radio frequency identification device (100, 200, 300, 350, 400, 500, 700) includes a substrate member (110) having a first surface (109) and a second surface (111). Disposed on the first surface of the substrate member are a first antenna element (112) and a second antenna element (114). The first and second antenna elements are electrically isolated from each other and are coupled to two separate pads on an integrated circuit (116, 116'). The integrated circuit includes a power circuit (814) that produces a supply voltage for electronics on the integrated circuit in response to voltages coupled over the air to the pads on the integrated circuit via the first and second antenna element. Adhesive (118) is applied on the first surface of the substrate, the first and second antenna elements and the integrated circuit for securing the tag to a person or thing.

대표청구항 ▼

[ We claim:] [1.]1. A radio frequency identification (RFID) device comprising:a substrate having a first surface and a second surface;a first antenna element disposed on the first surface of the substrate;a second antenna element disposed on the first surface of the substrate and electrically isolat

[ We claim:] [1.]1. A radio frequency identification (RFID) device comprising:a substrate having a first surface and a second surface;a first antenna element disposed on the first surface of the substrate;a second antenna element disposed on the first surface of the substrate and electrically isolated from the first antenna element;a circuit that is electrically connected with the first antenna element and the second antenna element; andan adhesive on at least a portion of one of the first antenna element, second antenna element, circuit and first surface of the substrate,wherein the circuit includes a power circuit that produces a supply voltage from voltage differences between the first and second antenna elements, andwherein the circuit is coupled to the first and second antenna elements by an interposer comprising:an interposer substrate;a first connecting pad disposed on the interposer substrate;a second connecting pad disposed on the interposer substrate and electrically isolated from the first connecting pad; andwherein the circuit is coupled to the first and second connecting pads and the first and second connecting pads are coupled to the first and second antenna elements, respectively.