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Apparatus and method for processing the surface of a workpiece with ozone 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-003/02
출원번호 US-0677934 (2000-10-03)
발명자 / 주소
  • Bergman Eric J.
  • Hess Mignon P.
출원인 / 주소
  • Semitool, Inc.
대리인 / 주소
    Lyon & Lyon LLP
인용정보 피인용 횟수 : 44  인용 특허 : 33

초록

An apparatus for supplying a mixture of a treatment liquid and ozone for treatment of a surface of a workpiece, and a corresponding method are set forth. The preferred embodiment of the apparatus comprises a liquid supply line that is used to provide fluid communication between a reservoir containin

대표청구항

[ What is claimed is:] [25.]25. A system for processing a semiconductor wafer, comprising:a process chamber;a rotor assembly in the process chamber, with the rotor having positions for holding a plurality of wafers;a plurality of spray nozzles in the process chamber positioned to spray liquid onto t

이 특허에 인용된 특허 (33)

  1. Schwartzkopf George (Franklin Township ; Warren County NJ), Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened r.
  2. Lyon Richard K. (Pittstown NJ), Apparatus and methods for incineration of toxic organic compounds.
  3. Matthews Robert Roger, Apparatus for the treatment of semiconductor wafers in a fluid.
  4. Mashimo Noriyoshi (Tokyo JPX) Okumura Katsuya (Yokohama JPX), Arrangement for cleaning semiconductor wafers using mixer.
  5. Kaiser Robert (Winchester MA), Automatic precision cleaning apparatus with continuous on-line monitoring and feedback.
  6. Slinn David S. L. (Bristol GB3), Cleaning and drying of electronic assemblies.
  7. Ohmi Tadahiro,JPX ITX 980, Cleaning device and method.
  8. Sugihara Yasuo,JPX ; Tanaka Kazushige,JPX ; Sakuma Ikue,JPX, Cleaning fluid for semiconductor substrate.
  9. Mori Shinichi (27-52 ; Kinugawa 1-chome Otsu-shi ; Shiga JPX) Nomura Tomohiro (1-1-10 ; Tsukamoto Yodogawa-ku ; Osaka-shi ; Osaka JPX), Cleaning process.
  10. Fujikawa Kazonori (Shiga JPX) Tanaka Masato (Shiga JPX) Muraoka Yusuke (Kyoto JPX), Device for rinsing and drying substrate.
  11. Matsukawa Hiroyuki,JPX ; Yonemizu Akira,JPX ; Matsushita Michiaki,JPX ; Fujimoto Akihiro,JPX ; Takekuma Takashi,JPX ; Yaegashi Hidetami,JPX ; Fukuda Takahide,JPX, Double-sided substrate cleaning apparatus and cleaning method using the same.
  12. Bergman Eric J. (Kalispell MT), Dynamic semiconductor wafer processing using homogeneous mixed acid vapors.
  13. Yoneda Kenji,JPX, Equipment for cleaning, etching and drying semiconductor wafer and its using method.
  14. Ohno, Reiko; Matsuoka, Terumi, Film removing method and film removing agent.
  15. Chao Sidney C. ; Purer Edna M. ; Sorbo Nelson W., Liquid carbon dioxide cleaning using jet edge sonic whistles at low temperature.
  16. McConnell Christopher F. (Gulph Mills PA) Walter Alan E. (Exton PA), Method and system for fluid treatment of semiconductor wafers.
  17. Stanford Thomas B. (San Pedro CA) George ; Jr. Richard C. (Topanga CA) Shinno Jennifer I. (Canoga Park CA) Mehta Dhiren C. (Cypress CA) Rodine Gifford W. (El Segundo CA), Method and system for removing contaminants.
  18. Matthews John C. (Gaithersburg MD) Wooten Robert D. (Rockville MD) Ferris David S. (Washington DC) Rounds Stuart N. (Germantown MD), Method for photoresist stripping using reverse flow.
  19. Kashiwase Masaharu (Okayama JPX) Matsuoka Terumi (Okayama JPX), Method for removing organic film.
  20. Koizumi Kootaroo (Kodaira JPX) Tsunekawa Sukeyoshi (Tokorozawa JPX) Kawasumi Kenichi (Oume JPX) Kimura Takeshi (Higashimurayama JPX) Funatsu Keisuke (Hamura JPX), Method of and apparatus for removing an organic film.
  21. Hasebe Keizo (Kofu JPX) Fujimoto Akihiro (Kumamoto-ken JPX) Inada Hiroichi (Kumamoto JPX) Iino Hiroyuki (Nirasaki JPX) Kitamura Shinzi (Kumamoto-ken JPX) Deguchi Masatoshi (Kumamoto JPX) Nambu Mitsuh, Method of forming coating film and apparatus therefor.
  22. Tanaka Masato (Shiga JPX), Method of treating surface of rotating wafer using surface treating gas.
  23. Kosofsky Howard B. ; Shrieber Lawrence A. ; Rhodes Richard O. ; Damron Michael D. ; Garcia Eduardo M., Pressure washing apparatus with ozone generator.
  24. Schellenberger Wilhelm,DEX ; Herrmannsdorfer Dieter,DEX, Procedure for the drying of silicon.
  25. Matthews Robert R. (Richmond CA), Process and apparatus for the treatment of semiconductor wafers in a fluid.
  26. McConnell Christopher F. (Gulph Mills PA) Walter Alan E. (Exton PA), Process and apparatus for treating wafers with process fluids.
  27. Grant Robert W. (Excelsior MN) Torek Kevin (State College PA) Novak Richard E. (Plymouth MN) Ruzyllo Jerzy (State College PA), Process for etching oxide films in a sealed photochemical reactor.
  28. Lampert Ingolf (Burghausen DEX) Gratzl Christa (Neuotting DEX), Process for the wet-chemical surface treatment of semiconductor wafers.
  29. Matthews Robert Roger, Process for treatment of semiconductor wafers in a fluid.
  30. Bergman Eric J. (Kalispell MT) Reardon Timothy J. (Kalispell MT) Thompson Raymon F. (Lakeside MT) Owczarz Aleksander (Kalispell MT), Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization.
  31. Dobson Jesse C. (Oakland CA), Sulfuric acid reprocessor.
  32. Grebinski Thomas J. (Sunnyvale CA), Surface treatment to remove impurities in microrecesses.
  33. Nelson Steven L. ; Christenson Kurt K., System to increase the quantity of dissolved gas in a liquid and to maintain the increased quantity of dissolved gas in.

이 특허를 인용한 특허 (44)

  1. Freer, Erik M.; de Larios, John M.; Mikhaylichenko, Katrina; Ravkin, Michael; Korolik, Mikhail; Redeker, Fred C.; Thomas, Clint; Parks, John, Apparatus and system for cleaning a substrate.
  2. de Larios,John M.; Owczarz,Aleksander; Schoepp,Alan; Redeker,Fritz, Apparatuses and methods for cleaning a substrate.
  3. Gilton, Terry L., Gas assisted method for applying resist stripper and gas-resist stripper combinations.
  4. Gilton, Terry L., Gas assisted method for applying resist stripper and gas-resist stripper combinations.
  5. Gilton, Terry L., Gas assisted method for applying resist stripper and gas-resist stripper combinations.
  6. Gilton, Terry L., Gas assisted method for applying resist stripper and gas-resist stripper combinations.
  7. Gilton,Terry L., Gas assisted method for applying resist stripper and gas-resist stripper combinations.
  8. Terry L. Gilton, Gas assisted method for applying resist stripper and gas-resist stripper combinations.
  9. Gilton,Terry L., Gas-assist systems for applying and moving ozonated resist stripper to resist-bearing surfaces of substrates.
  10. Freer, Erik M.; deLarios, John M.; Mikhaylichenko, Katrina; Ravkin, Michael; Korolik, Mikhail; Redeker, Fred C., Method and apparatus for cleaning a semiconductor substrate.
  11. Freer, Erik M.; deLarios, John M.; Mikhaylichenko, Katrina; Ravkin, Michael; Korolik, Mikhail; Redeker, Fred C., Method and apparatus for cleaning a semiconductor substrate.
  12. de Larios, John M.; Ravkin, Mike; Farber, Jeffrey; Korolik, Mikhail; Redeker, Fred C., Method and apparatus for cleaning a substrate using non-Newtonian fluids.
  13. de Larios, John M.; Ravkin, Mike; Farber, Jeffrey; Korolik, Mikhail; Redeker, Fred C., Method and apparatus for cleaning a substrate using non-newtonian fluids.
  14. de Larios, John M.; Ravkin, Mike; Farber, Jeffrey; Korolik, Mikhail; Redeker, Fritz; Owczarz, Aleksander, Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids.
  15. Freer, Erik M.; de Larios, John M.; Mikhaylichenko, Katrina; Ravkin, Michael; Korolik, Mikhail; Redeker, Fritz C., Method and apparatus for particle removal.
  16. Zhu, Ji; Mendiratta, Arjun; Mui, David, Method and apparatus for removing contaminants from substrate.
  17. Freer, Erik M.; de Larios, John M.; Mikhaylichenko, Katrina; Ravkin, Michael; Korolik, Mikhail; Redeker, Fred C.; Thomas, Clint; Parks, John, Method and apparatus for removing contamination from substrate.
  18. de Larios,John M.; Ravkin,Mike; Parks,John; Korolik,Mikhail; Redeker,Fred C., Method and apparatus for transporting a substrate using non-Newtonian fluid.
  19. Freer, Erik M.; de Larios, John M.; Mikhaylichenko, Katrina; Ravkin, Michael; Korolik, Mikhail; Redeker, Fred C., Method and material for cleaning a substrate.
  20. Korolik, Mikhail; Freer, Erik M.; de Larios, John M.; Mikhaylichenko, Katrina; Ravkin, Mike; Redeker, Fritz, Method and system for using a two-phases substrate cleaning compound.
  21. Korolik, Mikhail; Ravkin, Michael; deLarios, John; Redeker, Fritz C.; Boyd, John M., Method for removing material from semiconductor wafer and apparatus for performing the same.
  22. Gilton, Terry L., Method for removing organic material from a substrate and for oxidizing oxidizable material thereon.
  23. Steven L. Nelson ; Kurt K. Christenson, Method for treating a substrate with heat sensitive agents.
  24. Muraoka, Hisashi, Method of removing contamination adhered to surfaces and apparatus used therefor.
  25. Lianto, Prayudi; Hsiung, Kuma; Bergman, Eric J.; Klocke, John L.; Rafi, Mohamed; Azim, Muhammad; See, Guan Huei; Sundarrajan, Arvind, Methods for chemical mechanical polishing (CMP) processing with ozone.
  26. Bergman, Eric J., Methods for cleaning semiconductor surfaces.
  27. Bergman, Eric J., Methods for cleaning semiconductor surfaces.
  28. Mikhaylichenko, Katrina; Ravkin, Mike; Redeker, Fritz; de Larios, John M.; Freer, Erik M.; Korolik, Mikhail, Methods for contained chemical surface treatment.
  29. Bergman,Eric J., Methods of thinning a silicon wafer using HF and ozone.
  30. Rosko, Michael Scot; Jonte, Patrick B.; DeVries, Adam M.; Thomas, Kurt J.; Sawaski, Joel D., Ozone distribution in a faucet.
  31. Bergman, Eric J., Process and apparatus for treating a workpiece such as a semiconductor wafer.
  32. Gebhart,Thomas Maximilia; Bergman,Eric J., Process and apparatus for treating a workpiece using ozone.
  33. Bergman,Eric J., Process and apparatus for treating a workpiece with gases.
  34. Bergman,Eric J., Processing a workpiece using water, a base, and ozone.
  35. Gilton, Terry L.; Li, Li, Semiconductor fabrication apparatus.
  36. Gilton, Terry L.; Li, Li, Semiconductor fabrication methods and apparatus.
  37. Gilton,Terry L., Semiconductor processing methods.
  38. Son, So-Lip; Lee, Han-Joo, Semiconductor wafer cleaning apparatus.
  39. Freer, Erik M.; deLarios, John M.; Ravkin, Michael; Korolik, Mikhail; Redeker, Fritz C., Substrate cleaning technique employing multi-phase solution.
  40. Freer, Erik M.; de Larios, John M.; Ravkin, Michael; Korolik, Mikhail; Mikhaylichenko, Katrina; Redeker, Fritz C., Substrate preparation using stabilized fluid solutions and methods for making stable fluid solutions.
  41. Toshima,Takayuki; Ueno,Kinya; Yamasaka,Miyako; Tsutsumi,Hideyuki; Iino,Tadashi; Kamikawa,Yuji, Substrate processing apparatus for resist film removal.
  42. Toshima, Takayuki; Ueno, Kinya; Yamasaka, Miyako; Tsutsumi, Hideyuki; Iino, Tadashi; Kamikawa, Yuji, Substrate processing method and apparatus.
  43. Toshima, Takayuki; Shindo, Naoki; Iino, Tadashi, Substrate processing method and substrate processing apparatus.
  44. Bergman,Eric J.; Gebhart,Thomas Maximilian, System and methods for polishing a wafer.
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