초록 ▼

Apparatus and methods for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes

Apparatus and methods for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire though-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.

대표청구항 ▼

[ What is claimed is:] [1.]1. A method for placing an array of conductive spheres on prefluxed bond pads of a substrate, said method comprising:providing a substrate having a surface with a first pattern of bond pads;providing a stencil plate having upper and lower surfaces with a second pattern of

[ What is claimed is:] [1.]1. A method for placing an array of conductive spheres on prefluxed bond pads of a substrate, said method comprising:providing a substrate having a surface with a first pattern of bond pads;providing a stencil plate having upper and lower surfaces with a second pattern of through-holes therethrough, said second pattern of through-holes corresponding to said first pattern of bond pads;providing a hopper with an open top and configured to receive, hold and dispense conductive spheres as said hopper is closely moved across said upper surface of said stencil plate;placing said stencil plate over said substrate to align said patterns; andmoving said hopper across the upper surface of said stencil plate to a position beyond said pattern of through-holes to drop conductive spheres through said through-holes onto said bond pads.