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System for manufacturing a semiconductor device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-016/00
출원번호 US-0258399 (1999-02-26)
우선권정보 JP0249531 (1998-09-03)
발명자 / 주소
  • Nishikawa Kazuyasu,JPX
  • Tomohisa Shingo,JPX
출원인 / 주소
  • Mitsubishi Denki Kabushiki Kaisha, JPX
대리인 / 주소
    McDermott, Will & Emery
인용정보 피인용 횟수 : 25  인용 특허 : 13

초록

A gas supply system for supplying a gas into a reaction chamber is provided with a pulse valve, a mass flow controller and a back pressure controller. The mass flow controller includes a flow meter and a variable flow control valve, and the back pressure controller includes a pressure gauge and a pr

대표청구항

[ What is claimed is:] [1.]1. A system for manufacturing a semiconductor device comprising:a reaction chamber;a gas supply system for supplying a gas into said reaction chamber;a gas flow controller provided on said gas supply system for controlling the flow rate of said gas supplied to said pulse v

이 특허에 인용된 특허 (13)

  1. Conger Darrell R. (Portland OR) Posa John G. (Lake Oswego OR) Wickenden Dennis K. (Lake Oswego OR), Apparatus for depositing material on a substrate.
  2. Yoder Max N. (Falls Church VA), Atomic layer epitaxy (ALE) apparatus for growing thin films of elemental semiconductors.
  3. Iturralde Armando (San Antonio TX), Automatic film deposition control method and system.
  4. Mandel Frederick S. (Chagrin Falls OH), Control system for processes using supercritical fluids.
  5. Stern Howard (Greenlawn NY) Mauro Alex (Wheatley Heights NY) Lee Jay (Kings Park NY), Digital flow control system.
  6. Ono Kouichi (Amagasaki JPX) Oomori Tatsuo (Amagasaki JPX), Dry etching apparatus.
  7. Mosely Roderick C. ; Van Gogh Jim ; Littau Karl A., Forming tin thin films using remote activated specie generation.
  8. Posa John G. (Lake Oswego OR), Method and apparatus for producing a constant flow, constant pressure chemical vapor deposition.
  9. Bengtsson Bengt-Gran (Angered SEX), Method and device for regulating the spraying of coating materials.
  10. Nishizato Hiroshi (Kumamoto JPX) Sivaramakrishnan Visweswaren (Cupertino CA) Zhao Jun (Milpitas CA), Method for in-situ liquid flow rate estimation and verification.
  11. Bothra Subhas, Methods and apparatus for polishing wafers.
  12. Mettes Jacques (Doylestown PA) Kimura Takako (Toyosato JPX) Schack Michael (Dusseldorf DEX), Process for producing low-concentration gas mixtures, and apparatus for producing the same.
  13. McMenamin Joseph C. (Oceanside CA), Vapor mass flow control system.

이 특허를 인용한 특허 (25)

  1. Gealy, Dan; Weimer, Ronald A., Ampoules for producing a reaction gas and systems for depositing materials onto microfeature workpieces in reaction chambers.
  2. Carpenter,Craig M.; Mardian,Allen P.; Dando,Ross S.; Tschepen,Kimberly R.; Derderian,Garo J., Apparatus and method for depositing materials onto microelectronic workpieces.
  3. Mardian, Allen P.; Rodriguez, Santiago R., Apparatus and methods for manufacturing microfeatures on workpieces using plasma vapor processes.
  4. Derderian,Garo J., Apparatus and methods for plasma vapor deposition processes.
  5. Carpenter,Craig M.; Dando,Ross S.; Mardian,Allen P., Apparatus for controlling gas pulsing in processes for depositing materials onto micro-device workpieces.
  6. Bevers,William Daniel; Jones,Robert Francis; Ross,Bennett J.; Buckfeller,Joseph William; Flack,James L., Bypass loop gas flow calibration.
  7. Watanabe, Masayuki; Yamada, Yoshiyuki; Umezawa, Shunsuke, Fluid control system and fluid control method.
  8. Strang, Eric J., Method and apparatus for gas injection system with minimum particulate contamination.
  9. Zheng,Lingyi A.; Doan,Trung T.; Breiner,Lyle D.; Ping,Er Xuan; Beaman,Kevin L.; Weimer,Ronald A.; Kubista,David J.; Basceri,Cem, Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces.
  10. Beaman,Kevin L.; Weimer,Ronald A.; Breiner,Lyle D.; Ping,Er Xuan; Doan,Trung T.; Basceri,Cem; Kubista,David J.; Zheng,Lingyi A., Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambers.
  11. Beaman, Kevin L.; Doan, Trung T.; Breiner, Lyle D.; Weimer, Ronald A.; Ping, Er-Xuan; Kubista, David J.; Basceri, Cem; Zheng, Lingyi A., Methods and systems for controlling temperature during microfeature workpiece processing, E.G. CVD deposition.
  12. Beaman, Kevin L.; Doan, Trung T.; Breiner, Lyle D.; Weimer, Ronald A.; Ping, Er-Xuan; Kubista, David J.; Basceri, Cem; Zheng, Lingyi A., Methods and systems for controlling temperature during microfeature workpiece processing, E.G., CVD deposition.
  13. Beaman,Kevin L.; Doan,Trung T.; Breiner,Lyle D.; Weimer,Ronald A.; Ping,Er Xuan; Kubista,David J.; Basceri,Cem; Zheng,Lingyi A., Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition.
  14. Carpenter,Craig M.; Dynka,Danny, Methods for controlling mass flow rates and pressures in passageways coupled to reaction chambers and systems for depositing material onto microfeature workpieces in reaction chambers.
  15. Dando, Ross S.; Gealy, Dan, Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces.
  16. Dando, Ross S.; Gealy, Dan, Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces.
  17. Zheng,Lingyi A.; Doan,Trung T.; Breiner,Lyle D.; Ping,Er Xuan; Weimer,Ronald A.; Kubista,David J.; Beaman,Kevin L.; Basceri,Cem, Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces.
  18. Basceri,Cem; Doan,Trung T.; Weimer,Ronald A.; Beaman,Kevin L.; Breiner,Lyle D.; Zheng,Lingyi A.; Ping,Er Xuan; Sarigiannis,Demetrius; Kubista,David J., Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces.
  19. Gabriel, Calvin T.; Okada, Lynne A.; Hopper, Dawn M.; Pangrle, Suzette K.; Wang, Fei, Plasma etch process for nonhomogenous film.
  20. Carpenter,Craig M.; Dando,Ross S.; Dynka,Danny, Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces.
  21. Dando, Ross S., Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces.
  22. Miller, Matthew W.; Basceri, Cem, Reactors, systems and methods for depositing thin films onto microfeature workpieces.
  23. Strang, Eric J., Shower head gas injection apparatus with secondary high pressure pulsed gas injection.
  24. Okuda, Kazuyuki; Kagaya, Toru; Sakai, Masanori, Substrate processing apparatus.
  25. Sarigiannis,Demetrius; Meng,Shuang; Derderian,Garo J., Systems and methods for depositing material onto microfeature workpieces in reaction chambers.
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