초록 ▼

Disclosed are liquid epoxy encapsulants comprising a basic bisphenol-type epoxy resin with epoxy groups at each end having an epoxy equivalent of 170-300, and an amine curing agent such as 4,4'-Methylene dianiline with the content of 15-30 wt % with respect to epoxy resins and other additives such a

Disclosed are liquid epoxy encapsulants comprising a basic bisphenol-type epoxy resin with epoxy groups at each end having an epoxy equivalent of 170-300, and an amine curing agent such as 4,4'-Methylene dianiline with the content of 15-30 wt % with respect to epoxy resins and other additives such as coloring agents, flame retardants, and catalysts. Alphatic and cycloaliphatic epoxy resins and polyamide curing agents can optionally be added to mix with the bisphenol epoxy resin to modify the properties of the liquid epoxy encapsulants, i.e., to decrease their viscosities and to increase their toughness. The liquid epoxy encapsulants of this invention have characteristics of suitable viscosity, fast curing, high adhesion to polyimides and high reliability in the application of flip-chip-on-board (FCOB) encapsulation as underfill materials. These liquid epoxy resins are also able to be applied in epoxy die attach adhesives and epoxy electrically conductive adhesives in the form of isotropic (ICA) and anisotropic conductive adhesives (ACA), with their excellent properties of fast curing and high adhesion.

대표청구항 ▼

[ I claim:] [1.]1. A liquid encapsulating composition comprisingan epoxy resin, the poly(bisphenol A-co-epichlorohydrin) glycidyl end-capped species characterized by the formula: rein n=0 or 1 and R.sub.1 and R.sub.2 are substituted or unsubstituted monovalent hydrocarbon groups or alkoxy groups, an

[ I claim:] [1.]1. A liquid encapsulating composition comprisingan epoxy resin, the poly(bisphenol A-co-epichlorohydrin) glycidyl end-capped species characterized by the formula: rein n=0 or 1 and R.sub.1 and R.sub.2 are substituted or unsubstituted monovalent hydrocarbon groups or alkoxy groups, and wherein R.sub.1 and R.sub.2 are methyl and n=1 in said epoxy resin, anda curing agent comprising a diamine compound having amine groups at each end of the molecule. [6.]6. The composition of claim 1 which further comprises a filler. [7.]7. The composition of claim 6 wherein said filler is selected from the group consisting of silica, alumina and titania.