초록 ▼

A package for an integrated circuit device having an optical cell is disclosed. A method of making the package also is disclosed. The package includes a base of molded encapsulant material. A metal leadframe is embedded in the plastic base at the upper surface of the base. Encapsulant material cover

A package for an integrated circuit device having an optical cell is disclosed. A method of making the package also is disclosed. The package includes a base of molded encapsulant material. A metal leadframe is embedded in the plastic base at the upper surface of the base. Encapsulant material covers the lower and side surfaces of the die pad and the leads of the leadframe, but does not cover the upper surfaces of the die pad and leads. The side surfaces of the die pad and leads have locking features for engaging the encapsulant material. An optical integrated circuit device is attached to the exposed surface of the die pad. An adhesive bead is applied around the optical device on the exposed upper surface of the leads. An optically clear cover is placed on and, in some embodiments, pressed into the still-viscous adhesive bead. When hardened, the bead supports the cover above the optical device. The side surfaces of the optically clear cover, or the surface of the cover facing the optical device, are provided with locking features that engage the adhesive bead and strengthen the connection between the cover and the adhesive bead.

대표청구항 ▼

[ What is claimed is:] [1.]1. A package for an integrated circuit device comprising:a base of molded insulative material having a planar first surface;a die pad in an embedded connection with said base at the first surface of said base, wherein a first surface of the die pad is not covered by the in

[ What is claimed is:] [1.]1. A package for an integrated circuit device comprising:a base of molded insulative material having a planar first surface;a die pad in an embedded connection with said base at the first surface of said base, wherein a first surface of the die pad is not covered by the insulative material of the base;a plurality of leads, said leads having a first portion in an embedded connection with said base at the first surface of said base, and a second portion extending from said base, wherein a first surface of the first portion of each lead is not covered by the insulative material of the base;an integrated circuit device having a first surface and an opposite second surface, wherein the first surface of the integrated circuit device includes a light sensitive portion, and the second surface of the integrated circuit device is on the first surface of the die pad;a bead of a first adhesive material, said bead on the first surface of the base around the integrated circuit device; andan optically clear package cover having a planar first surface, wherein said first surface of the cover is connected to the adhesive bead around the integrated circuit device and is supported above the first surface of the integrated circuit device by the bead.