초록 ▼

An EMI filter feedthrough terminal assembly includes at least one conductive terminal pin, a feedthrough filter capacitor which has a passageway through which the terminal pin extends, and a conductive substrate through which the terminal pin passes in non-conductive relation. The conductive substra

An EMI filter feedthrough terminal assembly includes at least one conductive terminal pin, a feedthrough filter capacitor which has a passageway through which the terminal pin extends, and a conductive substrate through which the terminal pin passes in non-conductive relation. The conductive substrate includes a capture flange having a height that is less than an axial thickness of the capacitor and which is configured to at least partially surround an outer periphery of the capacitor. The height of the capture flange is preferably one-quarter to three-quarters of the axial thickness of the capacitor. A first set of capacitor electrodeplates is conductively coupled to the terminal pin, and a second set of electrode plates is conductively coupled to the capture flange by means of a thermal-setting conductive material disposed between the outer periphery of the capacitor and the capture flange. A related process is provided for manufacturing an EMI filter feedthrough terminal assembly that advantageously utilizes the capture flange.

대표청구항 ▼

[ What is claimed is:] [1.]1. An EMI filter feedthrough terminal assembly, comprising:at least one conductive terminal pin;a feedthrough filter capacitor having first and second sets of electrode plates and a passageway through which the terminal pin extends in conductive relation the first set of e

[ What is claimed is:] [1.]1. An EMI filter feedthrough terminal assembly, comprising:at least one conductive terminal pin;a feedthrough filter capacitor having first and second sets of electrode plates and a passageway through which the terminal pin extends in conductive relation the first set of electrode plates; anda conductive substrate through which the terminal pin passes in non-conductive relation, the conductive substrate including a capture flange having a height that less than an axial thickness of the capacitor and configured to at least partially surround an outer periphery of the capacitor.