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Method of forming a transparent window in a polishing pad 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-049/00
  • B24B-051/00
출원번호 US-0519156 (2000-03-06)
발명자 / 주소
  • Birang Manoocher
  • Gleason Allan
  • Guthrie William L.
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Fish & Richardson
인용정보 피인용 횟수 : 90  인용 특허 : 14

초록 ▼

The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second

대표청구항 ▼

[ What is claimed is:] [1.]1. A method of forming a window in a polishing pad, comprising:forming an aperture in a polishing pad, the aperture including a first section with a first cross-sectional dimension adjacent a first surface of the pad and a second section with a second, different cross-sect

이 특허에 인용된 특허 (14)

  1. Birang Manoocher ; Pyatigorsky Grigory, Apparatus and method for in-situ monitoring of chemical mechanical polishing operations.
    상세보기
  2. Birang Manoocher ; Gleason Allan ; Guthrie William L., Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus.
    상세보기
  3. Birang Manoocher ; Gleason Allan ; Guthrie William L., Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus.
    상세보기
  4. Lustig Naftali E. (Croton-on-Hudson NY) Saenger Katherine L. (Ossining NY) Tong Ho-Ming (Yorktown Heights NY), In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing.
    상세보기
  5. Schultz Laurence D. (Boise ID), Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer.
    상세보기
  6. Koos Daniel A. (Boise ID) Meikle Scott (Boise ID), Optical end point detection methods in semiconductor planarizing polishing processes.
    상세보기
  7. Tuttle Mark E. (Boise ID), Polishing pad.
    상세보기
  8. Manzonie Adam ; Akram Salman, Polishing pad for chemical-mechanical planarization of a semiconductor wafer.
    상세보기
  9. Tuttle Mark E. (Boise ID), Polishing pad with controlled abrasion rate.
    상세보기
  10. Tuttle Mark E. (Boise ID), Polishing pad with uniform abrasion.
    상세보기
  11. Roberts John V. H. (Newark DE), Polishing pads.
    상세보기
  12. Yu Chris C. (Austin TX), Polishing pads used to chemical-mechanical polish a semiconductor substrate.
    상세보기
  13. Allen Franklin L. (Sherman TX) Smith William L. (Howe TX) Debner Thomas G. (Howe TX) Olmstead Dennis L. (Sherman TX), Semiconductor polishing pad.
    상세보기
  14. Otruba Svatoboj (Ceres CA), Universal roll-fed label cutter.
    상세보기

이 특허를 인용한 특허 (90)

  1. Roberts, John V. H., Anti-scattering layer for polishing pad windows.
    상세보기
  2. Birang, Manoocher; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
    상세보기
  3. Birang, Manoocher; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
    상세보기
  4. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
    상세보기
  5. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
    상세보기
  6. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
    상세보기
  7. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for semiconductor processing operations.
    상세보기
  8. Dunegan, Harold L., Apparatus and methods for measuring surface roughness.
    상세보기
  9. Tang, Wallace T. Y., Apparatus for detection of thin films during chemical/mechanical polishing planarization.
    상세보기
  10. Allison, William; Huang, Ping; Scott, Diane; Frentzel, Richard; Kerprich, Robert, CMP pad with local area transparency.
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  11. Lefevre, Paul; Hsu, Oscar K.; Wells, David Adam; Aldeborgh, John Erik; Jin, Marc C., Chemical-mechanical planarization pad having end point detection window.
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  12. Roy, Pradip K.; Deopura, Manish; Misra, Sudhanshu, Customized polishing pads for CMP and methods of fabrication and use thereof.
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  13. Roy, Pradip K.; Deopura, Manish; Misra, Sudhanshu, Customized polishing pads for CMP and methods of fabrication and use thereof.
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  14. Roy, Pradip K.; Deopura, Manish; Misra, Sudhanshu, Customized polishing pads for CMP and methods of fabrication and use thereof.
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  15. Roy, Pradip K; Deopura, Manish; Misra, Sudhanshu, Customized polishing pads for CMP and methods of fabrication and use thereof.
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  16. Wiswesser,Andreas Norbert; Schoenleber,Walter, Endpoint detection with multiple light beams.
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  17. Birang,Manoocher; Gleason,Allan; Guthrie,William L., Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus.
    상세보기
  18. Tang, Wallace T. Y., In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization.
    상세보기
  19. Tang,Wallace T. Y., In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization.
    상세보기
  20. Tang, Wallace T. Y., In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization.
    상세보기
  21. Tang,Wallace T. Y., In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization.
    상세보기
  22. Ushio, Yoshijiro; Ueda, Takehiko, Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same.
    상세보기
  23. Ushio,Yoshijiro; Ueda,Takehiko, Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same.
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  24. Redeker,Fred C.; Birang,Manoocher; Li,Shijian; Somekh,Sasson, Linear polishing sheet with window.
    상세보기
  25. Parikh, Prabodh J., Method and apparatus for endpoint detection during chemical mechanical polishing.
    상세보기
  26. Birang, Manoocher; Swedek, Boguslaw A.; Kim, Hyeong Cheol, Method and apparatus of eddy current monitoring for chemical mechanical polishing.
    상세보기
  27. Birang,Manoocher; Swedek,Boguslaw A.; Kim,Hyeong Cheol, Method and apparatus of eddy current monitoring for chemical mechanical polishing.
    상세보기
  28. Jones, Jeremy; Sevilla, Roland K., Method for manufacturing a polishing pad having a compressed translucent region.
    상세보기
  29. Fukuda, Takeshi; Watanabe, Tsuguo; Hirose, Junji; Nakamura, Kenji; Doura, Masato, Method for manufacturing polishing pad.
    상세보기
  30. Fukuda, Takeshi; Watanabe, Tsuguo; Hirose, Junji; Nakamura, Kenji; Doura, Masato, Method for manufacturing polishing pad.
    상세보기
  31. Ping-Yi Chang TW, Method of CMP endpoint detection.
    상세보기
  32. Swedek,Boguslaw A.; Birang,Manoocher, Method of forming a polishing pad for endpoint detection.
    상세보기
  33. Birang, Manoocher; Gleason, Allan; Guthrie, William L., Method of forming a transparent window in a polishing pad.
    상세보기
  34. Lefevre, Paul; Hsu, Oscar K.; Wells, David Adam; Aldeborgh, John Erik; Jin, Marc C.; Wu, Guangwei; Mathew, Anoop, Method of grooving a chemical-mechanical planarization pad.
    상세보기
  35. Wiswesser, Andreas Norbert; Oshana, Ramiel; Hughes, Kerry F.; Rohde, Jay; Huo, David Datong; Benvegnu, Dominic J., Method of making and apparatus having polishing pad with window.
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  36. Lehman,Kurt; Chen,Charles; Allen,Ronald L.; Shinagawa,Robert; Sethuraman,Anantha; Bevis,Christopher F.; Trikas,Thanassis; Chen,Haiguang; Meng,Ching Ling, Methods and systems for detecting a presence of blobs on a specimen during a polishing process.
    상세보기
  37. Lehman,Kurt; Chen,Charles; Allen,Ronald L.; Shinagawa,Robert; Sethuraman,Anantha; Bevis,Christopher F.; Trikas,Thanassis; Chen,Haiguang; Meng,Ching Ling, Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device.
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  38. Lehman, Kurt; Chen, Charles; Allen, Ronald L.; Shinagawa, Robert; Sethuraman, Anantha; Bevis, Christopher F.; Trikas, Thanassis; Chen, Haiguang; Meng, Ching Ling, Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing.
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  39. Lehman, Kurt; Chen, Charles; Allen, Ronald L.; Shinagawa, Robert; Sethuraman, Anantha; Bevis, Christopher F.; Trikas, Thanassis; Chen, Haiguang; Meng, Ching Ling, Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool.
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  40. Lehman, Kurt; Chen, Charles; Allen, Ronald L.; Shinagawa, Robert; Sethuraman, Anantha; Bevis, Christopher F.; Trikas, Thanassis; Chen, Haiguang; Meng, Ching Ling, Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool.
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  41. Lehman,Kurt; Chen,Charles; Allen,Ronald L.; Shinagawa,Robert; Sethuraman,Anantha; Bevis,Christopher F.; Trikas,Thanassis; Chen,Haiguang; Meng,Ching Ling, Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool.
    상세보기
  42. Lehman,Kurt; Chen,Charles; Allen,Ronald L.; Shinagawa,Robert; Sethuraman,Anantha; Bevis,Christopher F.; Trikas,Thanassis; Chen,Haiguang; Meng,Ching Ling, Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool.
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  43. Duboust, Alain; Chang, Shou-Sung; Lu, Wei; Neo, Siew; Wang, Yan; Manens, Antoine P.; Moon, Yongsik, Multi-layer polishing pad for low-pressure polishing.
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  44. Tolles, Robert D., Multilayer polishing pad and method of making.
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  45. Jung, Won-Young, Optimization methods for on-chip interconnect geometries suitable for ultra deep sub-micron processes.
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  46. Kimura, Norio; Isobe, Hideji; Shimizu, Kazuo; Osawa, Hiroyuki, Polishing apparatus.
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  49. Birang,Manoocher; Gleason,Allan; Guthrie,William L., Polishing assembly with a window.
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  50. Akira Ihsikawa JP; Tatsuya Senga JP; Akira Miyaji JP; Yoshijiro Ushio JP, Polishing body, polishing apparatus, polishing apparatus adjustment method, polished film thickness or polishing endpoint measurement method, and semiconductor device manufacturing method.
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  51. Ogawa, Kazuyuki; Kazuno, Atsushi; Kimura, Tsuyoshi; Shimomura, Tetsuo, Polishing pad.
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  52. Ogawa, Kazuyuki; Shimomura, Tetsuo; Kazuno, Atsushi; Nakai, Yoshiyuki; Watanabe, Masahiro; Yamada, Takatoshi; Nakamori, Masahiko, Polishing pad.
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  53. Kim,Jin Kook; Boo,Jae Phil; Lee,Sang Seon; Kim,Jong Bok, Polishing pad for chemical mechanical polishing apparatus.
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  54. Swedek, Boguslaw A.; Birang, Manoocher, Polishing pad for endpoint detection and related methods.
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  55. Birang, Manoocher; Gleason, Allan, Polishing pad for in-situ endpoint detection.
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  56. Cooper, Richard D.; Fathauer, Paul; Mroczek-Petroski, Angela; Perry, David; Petroski, James J., Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same.
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  57. Petroski, Angela; Copper, Richard D.; Fathauer, Paul; Perry, David, Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making.
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  58. Saikin,Alan H., Polishing pad having a window with reduced surface roughness.
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  59. Doura, Masato; Hirose, Junji; Nakamura, Kenji; Fukuda, Takeshi; Sato, Akinori, Polishing pad manufacturing method.
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  60. Roberts,John V. H., Polishing pad with high optical transmission window.
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  76. Robert D. Tolles, Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same.
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