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Gate stack structure for variable threshold voltage 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-031/119
출원번호 US-0261274 (1999-03-03)
발명자 / 주소
  • Yu Bin
  • Adem Ercan
출원인 / 주소
  • Advanced Micro Devices, Inc.
대리인 / 주소
    Foley & Lardner
인용정보 피인용 횟수 : 52  인용 특허 : 3

초록

An ultra-large-scale integrated (ULSI) circuit includes MOSFETs which have different threshold voltages and yet have the same channel characteristics. The MOSFETs include gate structures or gate stacks with a silicon and germanium material provided over a seed layer. The seed layer can be a 20-40 .A

대표청구항

[ What is claimed is:] [1.]1. A gate stack structure above a single crystal substrate, the gate stack structure comprising:a gate insulating layer above the single crystal substrate;a thin semiconductor seed layer disposed above the gate insulating layer;a compound semiconductor layer including germ

이 특허에 인용된 특허 (3)

  1. Bulucea Constantin ; Kerr Daniel C., Design and fabrication of semiconductor structure having complementary channel-junction insulated-gate field-effect tra.
  2. Doo Ven Y. (San Jose CA), Epitaxially extended polycrystalline structures utilizing a predeposit of amorphous silicon with subsequent annealing.
  3. Kapoor Ashok K. (Palo Alto CA), Process and structure for reduction of channeling during implantation of source and drain regions in formation of MOS in.

이 특허를 인용한 특허 (52)

  1. Maszara, Witold P.; Wang, HaiHong; Xiang, Qi, Asymmetric semiconductor device having dual work function gate and method of fabrication.
  2. Ibok, Effiong; Zheng, Wei; Tripsas, Nicholas H.; Ramsbey, Mark T.; Cheung, Fred T K, Bi-layer floating gate for improved work function between floating gate and a high-K dielectric layer.
  3. Doris, Bruce B.; Chakravarti, Ashima B.; Chan, Kevin K.; Uriarte, Daniel A., CMOS device structure with improved PFET gate electrode.
  4. Ryu,Hyuk Ju; Kim,Young Wug; Oh,Chang Bong; Kang,Hee Sung, CMOS transistor having different PMOS and NMOS gate electrode structures and method of fabrication thereof.
  5. Jagannathan, Hemanth; Ando, Takashi; Narayanan, Vijay, Control of flatband voltages and threshold voltages in high-k metal gate stacks and structures for CMOS devices.
  6. Jagannathan, Hemanth; Ando, Takashi; Narayanan, Vijay, Control of flatband voltages and threshold voltages in high-k metal gate stacks and structures for CMOS devices.
  7. Jagannathan, Hemanth; Ando, Takashi; Narayanan, Vijay, Control of threshold voltages in high-k metal gate stack and structures for CMOS devices.
  8. Jagannathan, Hemanth; Ando, Takashi; Narayanan, Vijay, Control of threshold voltages in high-k metal gate stack and structures for CMOS devices.
  9. Todd, Michael A., Deposition of amorphous silicon-containing films.
  10. Todd, Michael A., Deposition over mixed substrates using trisilane.
  11. Bin Yu, Dual threshold voltage MOSFET by local confinement of channel depletion layer using inert ion implantation.
  12. Pomarede, Christophe F.; Givens, Michael E.; Shero, Eric J.; Todd, Michael A., Integration of high k gate dielectric.
  13. Pomarede,Christophe F.; Givens,Michael E.; Shero,Eric J.; Todd,Michael A., Integration of high k gate dielectric.
  14. Edge, Lisa F.; Jagannathan, Hemanth; Haran, Balasubramanian S., Integration of multiple threshold voltage devices for complementary metal oxide semiconductor using full metal gate.
  15. Edge, Lisa F.; Jagannathan, Hemanth; Haran, Balasubramanian S., Integration of multiple threshold voltage devices for complementary metal oxide semiconductor using full metal gate.
  16. Greer, Heidi L.; Kim, Seong Dong; Rassel, Robert M.; Vaed, Kunal, MOS varactor with segmented gate doping.
  17. Alieu, Jerome; Hernandez, Caroline; Haond, Michel, MOSFET transistor with short channel effect compensated by the gate material.
  18. Maszara, Witold; Krivokapic, Zoran, Metal gate electrode using silicidation and method of formation thereof.
  19. Jack A. Mandelman ; Ramachandra Divakaruni, Method and apparatus for providing low-GIDL dual workfunction gate doping with borderless diffusion contact.
  20. Amos, Ricky; Barmak, Katayun; Boyd, Diane C.; Cabral, Jr., Cyril; Leong, Meikei; Kanarsky, Thomas S.; Kedzierski, Jakub Tadeusz, Method and process to make multiple-threshold metal gates CMOS technology.
  21. Chaudhry,Samir; Roy,Pradip K., Method and structure for graded gate oxides on vertical and non-planar surfaces.
  22. Brady, David Charles; Ma, Yi; Roy, Pradip Kumar, Method for making an integrated circuit device including a graded, grown, high quality gate oxide layer and a nitride layer.
  23. Chang, Kent Kuohua, Method for preventing gate depletion effects of MOS transistor.
  24. Bojarczuk, Jr.,Nestor Alexander; Copel,Matthew Warren; Guha,Supratik; Narayanan,Vijay, Method of forming lattice-matched structure on silicon and structure formed thereby.
  25. Kumar Pradip Roy ; Ranbir Singh, Method of making bipolar transistor semiconductor device including graded, grown, high quality oxide layer.
  26. Rhee, Hwa-Sung; Bae, Geum-Jong; Choe, Tae-Hee; Kim, Sang-Su; Lee, Nae-In, Method of manufacturing CMOS semiconductor device.
  27. Pierre Hermanus Woerlee NL; Jurriaan Schmitz NL; Andreas Hubertus Montree NL, Method of manufacturing a semiconductor device.
  28. Woerlee, Pierre Hermanus; Schmitz, Jurriaan; Montree, Andreas Hubertus, Method of manufacturing a semiconductor device.
  29. Greene, Brian J.; Chudzik, Michael P.; Han, Shu-Jen; Henson, William K.; Liang, Yue; Maciejewski, Edward P.; Na, Myung-Hee; Nowak, Edward J.; Yu, Xiaojun, Method of providing threshold voltage adjustment through gate dielectric stack modification.
  30. Roy, Kumar Pradip; Singh, Ranbir, Non-volatile memory semiconductor device including a graded, grown, high quality control gate oxide layer and associated methods.
  31. Roy, Kumar Pradip; Singh, Ranbir, Non-volatile memory semiconductor device including a graded, grown, high quality oxide layer and associated methods.
  32. Todd, Michael A., Process for deposition of semiconductor films.
  33. Todd, Michael A.; Hawkins, Mark, Process for deposition of semiconductor films.
  34. Bin Yu, Raised source/drain process by selective SiGe epitaxy.
  35. Phua,Timothy Wee Hong; Tee,Kheng Chok; Hsia,Liang Choo, Selective oxide trimming to improve metal T-gate transistor.
  36. Xiang, Qi; Maszara, Witold P.; Wang, HaiHong, Semiconductor device having multi-work function gate electrode and multi-segment gate dielectric.
  37. Hisamoto, Dai; Kachi, Tsuyoshi, Semiconductor integrated circuit device and method of manufacturing thereof.
  38. Haensch, Wilfried; Koester, Steven; Majumdar, Amlan, Semiconductor structure including gate electrode having laterally variable work function.
  39. Haensch, Wilfried; Koester, Steven; Majumdat, Amlan, Semiconductor structure including gate electrode having laterally variable work function.
  40. Bojarczuk, Jr., Nestor Alexander; Buchanan, Douglas Andrew; Guha, Supratik; Narayanan, Vijay; Ragnarsson, Lars-Ake, Semiconductor structure including mixed rare earth oxide formed on silicon.
  41. Bojarczuk, Jr.,Nestor Alexander; Buchanan,Douglas Andrew; Guha,Supratik; Narayanan,Vijay; Ragnarsson,Lars Ake, Semiconductor structure including mixed rare earth oxide formed on silicon.
  42. Yu, Bin, Semiconductor-on-insulator circuit with multiple work functions.
  43. Krivokapic, Zoran, Straddled gate FDSOI device.
  44. Doris,Bruce B.; Belyansky,Michael P.; Boyd,Diane C.; Chidambarrao,Dureseti; Gluschenkov,Oleg, Stressed semiconductor device structures having granular semiconductor material.
  45. Doris,Bruce B; Belyansky,Michael P; Boyd,Diane C; Chidambarrao,Dureseti; Gluschenkov,Oleg, Stressed semiconductor device structures having granular semiconductor material.
  46. Zhu, Huilong, Structure and method for making high density MOSFET circuits with different height contact lines.
  47. Zhu,Huilong, Structure and method for making high density mosfet circuits with different height contact lines.
  48. Chen, Yuanning; Chetlur, Sundar Srinivasan; Roy, Pradip Kumar, TWO-STEP OXIDATION PROCESS FOR OXIDIZING A SILICON SUBSTRATE WHEREIN THE FIRST STEP IS CARRIED OUT AT A TEMPERATURE BELOW THE VISCOELASTIC TEMPERATURE OF SILICON DIOXIDE AND THE SECOND STEP IS CARRIE.
  49. Forbes, Leonard; Tran, Luan C.; Ahn, Kie Y., Technique to mitigate short channel effects with vertical gate transistor with different gate materials.
  50. Todd, Michael A.; Raaijmakers, Ivo, Thin films and methods of making them.
  51. Greene, Brian J.; Chudzik, Michael P.; Han, Shu-Jen; Henson, William K.; Liang, Yue; Maciejewski, Edward P.; Na, Myung-Hee; Nowak, Edward J.; Yu, Xiaojun, Threshold voltage adjustment through gate dielectric stack modification.
  52. Meng, Shuang; Derderian, Garo J.; Sandhu, Gurtej S., Transistor with reduced depletion field width.
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