초록 ▼

A method for operating a microwave amplifier wherein a packaging arrangement is provided. The packaging arrangement includes: (i) a mounting thermally conducting mounting flange; (ii) an isomorphic, thermally conductive material disposed on the flange; (iii) a circuit comprising a semiconductor chip

A method for operating a microwave amplifier wherein a packaging arrangement is provided. The packaging arrangement includes: (i) a mounting thermally conducting mounting flange; (ii) an isomorphic, thermally conductive material disposed on the flange; (iii) a circuit comprising a semiconductor chip having a transistor arranged as the amplifier, such amplifier being adapted to operate at a nominal microwave frequency with a band of frequencies, disposed on a portion of a surface of the isomorphic, thermally conductive material, other surface portions of the thermally conductive material extending laterally beyond the portion of the material having the semiconductor chip disposed thereon; (iv) a corral having an aperture through an inner region thereof, the isothermal material being disposed within the aperture, such corral having an outer region thereon mounted to surface portions of the flange. The amplifier is biased for Class C operation. The method includes feeding pulsed microwave signals to the amplifier for amplification thereby. The pulses have pulse widths greater than 750 microseconds and have a duty cycle of about 25 percent or more. Thus, the amplifier is now able to operate with a substantially continuous wave input signal.

대표청구항 ▼

[ What is claimed is:] [1.]1. A packaging arrangement, comprising:mounting thermally conducting mounting flange;an isomorphic, thermally conductive material disposed on the flange;a circuit comprising a semiconductor chip having a transistor arranged as an amplifier adapted to operate at a normal mi

[ What is claimed is:] [1.]1. A packaging arrangement, comprising:mounting thermally conducting mounting flange;an isomorphic, thermally conductive material disposed on the flange;a circuit comprising a semiconductor chip having a transistor arranged as an amplifier adapted to operate at a normal microwave frequency with a band of frequencies, disposed on a portion of a surface of the isomorphic, thermally conductive material, other surface portions of the thermally conductive material extending laterally beyond the portion of the material having the semiconductor chip disposed thereon; anda corral having an aperture through an inner region thereof, the isothermal material being disposed within the aperture, such corral having an outer region thereon mounted to surface portions of the flange;wherein the aperture has a length less than .lambda./4, where .lambda. is the wavelength of the nominal operating microwave frequency of the amplifier;wherein the circuit is configured to bias the amplifier for Class C operation; andwherein the amplifier is configured to amplify pulsed microwave signals.