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[미국특허] Protective system for integrated circuit (IC) wafers retained within containers designed for storage and shipment 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B65D-085/48
출원번호 US-0621511 (2000-07-21)
발명자 / 주소
  • Brooks Ray G.
  • Brooks Timothy
  • Fowler Steve L.
  • Neal Robert A.
출원인 / 주소
  • Brooks
  • Ray G.
대리인 / 주소
    Mantooth
인용정보 피인용 횟수 : 37  인용 특허 : 14

초록

A container for integrated circuit wafers provides protection for the wafers from mechanical shock and electrical charges. The wafers are mechanically protected by top and bottom cushions and side cushions. The top and bottom cushions each have foam within a membrane or film enclosure. The enclosure

대표청구항

[ What is claimed is:] [1.]1. A system for protecting integrated circuit wafers during storage and shipment, comprising:a) a container having an interior space for receiving the wafers;b) first and second cushions positioned inside of the interior space so as to receive the wafers therebetween;c) ea

이 특허에 인용된 특허 (14) 인용/피인용 타임라인 분석

  1. Kawada Seiichi,JPX, Accommodation container and accommodating method.
  2. Brooks Ray G. ; Brooks Timothy W. ; Fowler Stephen L., Apparatus for packaging contaminant-sensitive articles and resulting package.
  3. Mykleby Laurie G. (Palos Park IL), Impact resistant foam cushioned packages.
  4. Lin Chih-Ching (Hsin-Chu TWX) Tai Jiin C. (Hsin-Chu TWX) Huang Jane-Hong (Hsin-Chu TWX) Peng Ying-Kuang (Hsin-Chu TWX), Integrated circuit wafer and retainer element combination.
  5. Liang Wen-Sheng (Hsin-Chu TWX), Integrated circuit wafer container.
  6. Vacanti Eugene J. (Eden Prairie MN), Protective cushion.
  7. Daniels Jerry ; Simonson Michael E ; Grove Keith E., Selectively deformable cushion.
  8. Johnson Douglas M. (Waconia MN), Shipping container for substrates.
  9. Huang Ing Chung,TWX, Shock-absorbing cushion.
  10. Sprague ; Jr. William B. (2915 Arbor Dr. West Linn OR 97068), Shock-absorbing pillow.
  11. Hsia Jason,TWX ; Horng Jason,TWX, Storage box for semiconductor wafers.
  12. Lin Chih-Ching (Hsin-Chu TWX) Tai Jin-Chys (Hsin-Chu TWX), Storage container for integrated circuit semiconductor wafers.
  13. Nyseth David L. (Plymouth MN), Wafer shipper and package.
  14. Hatada Hirotaka,JPX, Wafer storage box and method for preventing attachment of dust caused by static electricity on a wafer storage box.

이 특허를 인용한 특허 (37) 인용/피인용 타임라인 분석

  1. Chen,Ping Shen, Antistatic transport package for LCD cells.
  2. Glovatsky,Andrew, Apparatus and method for protecting an electronic circuit.
  3. Haggard,Clifton C.; Thomas,James R.; Chen,Song Ping; Liu,Ru Zheng, Container with an adjustable inside dimension that restricts movement of items within the container.
  4. Ito,Tatsuichi; Morita,Kazuhito; Oyama,Masaki; Miyashita,Takayoshi; Saito,Yoshinori, Disc package.
  5. Brooks, Ray G.; Brooks, Timothy W., Integrated circuit wafer packaging system and method.
  6. Heerens, Gert-Jan, Mask transport system configured to transport a mask into and out of a lithographic apparatus.
  7. Dorsey, Joseph Alan, Moisture resistant coil package.
  8. Chen, Wei-Ren; Chen, Hung-Chi, Motor and housing thereof.
  9. Corbin, Damyon L.; Musante, Charles F., Package assembly for thin wafer shipping and method of use.
  10. Corbin, Damyon L.; Musante, Charles F., Package assembly for thin wafer shipping and method of use.
  11. Garner, Sean Matthew; Miller, Jeffrey Allen, Packages and methods of packaging glass sheets.
  12. Garner, Sean Matthew; Miller, Jeffrey Allen, Packages and methods of packaging glass sheets.
  13. Haggard,Clifton C.; Thomas,James R.; Chen,Song Ping; Liu,Ru Zheng, Packaging platform having an adjustable thickness.
  14. Brooks, Ray G.; Brooks, Timothy Wayne, Packaging system for protection of IC wafers during fabrication, transport and storage.
  15. Kuo, Yi-Cheng; Chen, Shihhsiang; Li, Jiaxin; Cheng, Jiahe, Packing box for liquid crystal display panel and waterproof structure thereof.
  16. Thomas,James R.; Haggard,Clifton C.; Brown,Jason D.; Chen,Song Ping; Liu,Ru Zheng; Hayden,Michael L., Plastic packaging cushion.
  17. Zabka,Michael; Nigg,James, Protective shipper.
  18. Oliver, Steve; Farnworth, Warren, Semiconductor device having backside redistribution layers.
  19. Oliver, Steve; Farnworth, Warren, Semiconductor device having backside redistribution layers and method for fabricating the same.
  20. Cleaver, Brian, Shock absorbing apparatus and method.
  21. Cleaver,Brian, Shock absorbing apparatus and method.
  22. Bores, Gregory W.; Zabka, Michael C.; Henderer, Ralph, Shock resistant variable load tolerant wafer shipper.
  23. Pylant, James D; Mack, Christopher R; Waber, Alan L; Miller, David A, Single and dual stage wafer cushion.
  24. Pylant, James D; Mack, Christopher R; Waber, Alan L; Miller, David A, Single and dual stage wafer cushion and wafer separator.
  25. Goostree, Phil, Spacer for coiled products.
  26. Kausch, William L.; Lockridge, James E.; Kretman, Wade D., Static dissipative optical construction.
  27. Kausch, William L.; Lockridge, James E.; Kretman, Wade D., Static dissipative optical construction.
  28. Kausch,William L.; Lockridge,James E.; Kretman,Wade D., Static dissipative optical construction.
  29. Forsyth, Valoris L.; Gardiner, Jim; Brown, Berry, Wafer box with radially pivoting latch elements.
  30. Pylant, James D.; Waber, Alan L., Wafer container.
  31. Pylant, James D.; Waber, Alan L., Wafer container.
  32. Fuyumuro, Masahiko; Nakayama, Yoshitaka; Kawashima, Eiichi, Wafer protective sheet.
  33. Cleaver, Brian R., Wafer shipping and storage container.
  34. Allison, David C, Windshield packaging system using pressure-regulated clamps.
  35. Allison, David, Windshield packaging system using pressure-regulated clamps with synergistic clamp jaw components.
  36. Allison,David, Windshield packaging system using pressure-regulated clamps with synergistic clamp jaw components.
  37. Allison, David, Windshield packaging system using synergistic clamp jaw components.

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