초록 ▼

It is an object of the invention to provide a cooler of an electronic apparatus capable of keeping semiconductor chips at a low temperature without care of condensation and which is excellent in compactness. To achieve the above object, the present invention proposes an electronic apparatus in which

It is an object of the invention to provide a cooler of an electronic apparatus capable of keeping semiconductor chips at a low temperature without care of condensation and which is excellent in compactness. To achieve the above object, the present invention proposes an electronic apparatus in which a heating region is built in the multilayered wiring substrate of the semiconductor package or module on the side near to the input/output pins, the semiconductor package or module and the cooler mounted on the package or module are placed in a moisture proof case, a heat insulating material is filled in the gaps between the moisture proof case, semiconductor package or module and cooler, and a heater is provided on the outer periphery of the heat insulating material.

대표청구항 ▼

[ What is claimed is:] [1.]1. An electronic apparatus comprising a cooler of a refrigerator unit, and a semiconductor module made in thermal contact with said cooler, wherein said cooler and said semiconductor module are covered with a heat insulator, a heater is provided on the outer periphery of s

[ What is claimed is:] [1.]1. An electronic apparatus comprising a cooler of a refrigerator unit, and a semiconductor module made in thermal contact with said cooler, wherein said cooler and said semiconductor module are covered with a heat insulator, a heater is provided on the outer periphery of said heat insulator, and heating means is provided in a layer of a multi-layered wiring substrate of said semiconductor module, said layer of said multi-layered wiring substrate having said heater being a layer disposed furthest from said semiconductor module.