초록 ▼

Electronic devices formed by bonding and interconnecting one or more electronic components to an electronic circuit substrate employ specialized adhesives comprising gold-plated, platinum-plated and/or palladium-plated particles in a polymeric adhesive system which may include thermoplastic or therm

Electronic devices formed by bonding and interconnecting one or more electronic components to an electronic circuit substrate employ specialized adhesives comprising gold-plated, platinum-plated and/or palladium-plated particles in a polymeric adhesive system which may include thermoplastic or thermosetting resins. These plated particles beneficially provide electrical conductivity through the polymeric adhesive for electrically interconnecting contact pads on the electronic components with contact pads on the electronic circuit substrate and provide resistance to migration of metal, thereby enabling interconnection and bonding at very fine pitch and spacing. Polymers with substantial flexibility and a low glass transition temperature are preferred over more rigid resins. Particles having a morphology and shapes that include higher aspect ratios are preferred because lesser volume fraction loading is needed to establish good electrical conductivity through the polymeric adhesive. A combination of high aspect ratio plated particles and spherical particles may be employed to enhance the thermal conductivity of the polymeric adhesive without substantially increasing the overall cost of the conductive polymer adhesive system. Electronic devices employing the invention include such applications as semiconductor die attachment, flip-chip device interconnection, electronic component attachment, electronic substrate attachment to printed wiring boards, jumper interconnection, and the like.

대표청구항 ▼

[ What is claimed is:] [1.]1. An electronic device comprising:a substrate having contact pads thereon, wherein the contact pads are coated with an oxidation-resistant metal;a semiconductor chip having contact pads thereon coated with an oxidationresistant metal, wherein said semiconductor chip is co

[ What is claimed is:] [1.]1. An electronic device comprising:a substrate having contact pads thereon, wherein the contact pads are coated with an oxidation-resistant metal;a semiconductor chip having contact pads thereon coated with an oxidationresistant metal, wherein said semiconductor chip is connected in a flip chip manner to said substrate, wherein said substrate and said semiconductor chip have corresponding contact pads, wherein connections between corresponding contact pads on said semiconductor chip and on said substrate are made with a conductive adhesive including:an adhesive selected from the group consisting of thermosetting and thermoplastic polymer adhesives, a blend thereof and a copolymer thereof, wherein the polymer adhesive has a modulus of elasticity of less than 300,000 psi at temperatures above a glass transition temperature of 25.degree. C. or lower and has more than 30% elongation of linear dimension before fracture, anda multiplicity of core particles formed of a material other than a precious metal selected from the group consisting of copper, aluminum, nickel, carbon, graphite, glass, and polymers, wherein said core particles are plated with a precious metal selected from the group consisting of gold, platinum and palladium, and wherein said plating with a precious metal is about 10% to about 30% by weight of the core particle weight.