초록 ▼

The present invention generally provides a system for processing substrates having a carrier disposed primarily in at least one processing chamber and at least one shuttle for transferring substrates between the processing chamber and a load lock chamber. A plurality of processing chambers, load loc

The present invention generally provides a system for processing substrates having a carrier disposed primarily in at least one processing chamber and at least one shuttle for transferring substrates between the processing chamber and a load lock chamber. A plurality of processing chambers, load lock chambers, and other chambers can be joined to create a series of modular chambers through which the substrates are processed. Preferably, the carrier is only exposed to the processing environment, i.e., the carrier does not shuttle into a non-processing chamber. Thus, during continuous sequential processing of substrates, thermal cycling of the carrier is reduced. The carrier is reversibly moved within the processing chamber along a track. Multiple processing zones separated by partitions allow a plurality of processing regimes to occur within the same processing chamber.

대표청구항 ▼

[ What is claimed is:] [1.]1. A substrate processing system, comprising:a) at least one processing chamber;b) at least one load lock chamber coupled to the processing chamber;c) a shuttle disposed in the load lock chamber and communicable with the processing chamber; andd) a substrate carrier primar

[ What is claimed is:] [1.]1. A substrate processing system, comprising:a) at least one processing chamber;b) at least one load lock chamber coupled to the processing chamber;c) a shuttle disposed in the load lock chamber and communicable with the processing chamber; andd) a substrate carrier primarily disposed in the at least one processing chamber and adapted to operate solely within the processing chamber.