초록 ▼

There is provided an edge connectable electronic package. The package has a metallic base at least partially coated with a dielectric layer. An interconnection means taking the form of either a leadframe or a circuit trace is electrically interconnected to an encased semiconductor device. The opposi

There is provided an edge connectable electronic package. The package has a metallic base at least partially coated with a dielectric layer. An interconnection means taking the form of either a leadframe or a circuit trace is electrically interconnected to an encased semiconductor device. The opposing end of the interconnection means extends to the package perimeter for interconnection to a socket or brazing to external leads.

대표청구항 ▼

[ What is claimed is:] [1.]1. A package for encasing one or more electronic devices, comprising:a base component having a first perimeter;a cover component having a second perimeter of a size less than said first perimeter; anda leadframe disposed between and bonded to the base component and the cov

[ What is claimed is:] [1.]1. A package for encasing one or more electronic devices, comprising:a base component having a first perimeter;a cover component having a second perimeter of a size less than said first perimeter; anda leadframe disposed between and bonded to the base component and the cover component, said leadframe having an external portion that extends beyond said second perimeter, terminates adjacent to said first perimeter and rigidly adheres to said base component.