초록 ▼

Provided is an apparatus and method for modifying the manufacture of chip carrier bond pads to increase the quality and reliability of semiconductor packages and ball joints in particular. This is accomplished by minimizing the corrosion of the barrier metal layer on the functional bond pads during

Provided is an apparatus and method for modifying the manufacture of chip carrier bond pads to increase the quality and reliability of semiconductor packages and ball joints in particular. This is accomplished by minimizing the corrosion of the barrier metal layer on the functional bond pads during gold deposition with the use of sacrificial pads electrically connected with the functional bond pads. According to one embodiment of the invention, a semiconductor package has copper conductive pads on a substrate that are exposed through a dielectric. Both functional and sacrificial (nonfunctional) copper conductive pads are provided. A barrier metal layer composed of nickel is electrolessly plated onto these conductive pads, and a bond metal layer of gold is deposited onto the nickel using electroless, generally immersion, gold plating. The surface area of the nickel on the sacrificial pads is less than that on the functional pads, and the nickel on the sacrificial pads corrodes first during electroless gold deposition. Without nickel corrosion on the functional bond pad, gold can more uniformly be deposited on the surface of the nickel layer. A eutectic solderable material placed on the gold can form a uniform bond with the nickel because the nickel on the functional bond pad is largely corrosion free.

대표청구항 ▼

[ What is claimed is:] [1.]1. A method for producing a semiconductor package comprising:forming a plurality of bond pads on a packaging substrate;forming a plurality of sacrificial pads on said substrate wherein said sacrificial pads do not electrically connect metallization on said packaging substr

[ What is claimed is:] [1.]1. A method for producing a semiconductor package comprising:forming a plurality of bond pads on a packaging substrate;forming a plurality of sacrificial pads on said substrate wherein said sacrificial pads do not electrically connect metallization on said packaging substrate with metallization on a circuit board;providing electrical connections between said bond and sacrificial pads; wherein the step of forming said bond and sacrificial pads comprises:depositing a first layer of material on the bond and sacrificial pads, wherein the first layer of material comprises a metal; andafter the step of depositing the first layer of material, depositing a second layer of material on the bond and sacrificial pads, wherein the second layer of material comprises a metal.